BF720T1G,
SBF720T1G,
BF720T3G
NPN Silicon Transistor
Features
AEC−Q101 Qualified and PPAP Capable
S Prefix for Automotive and Other Applications Requiring Unique
http://onsemi.com
Site and Control Change Requirements
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant*
NPN SILICON TRANSISTOR
SURFACE MOUNT
MAXIMUM RATINGS
Rating
Collector
−Emitter
Voltage
Collector
−Base
Voltage
Collector
−Emitter
Voltage
Emitter
−Base
Voltage
Collector Current
Total Power Dissipation up to T
A
= 25C
Storage Temperature Range
Junction Temperature
Symbol
V
CEO
V
CBO
V
CER
V
EBO
I
C
P
D
T
stg
T
J
Value
300
300
300
5.0
100
1.5
−65
to +150
150
Unit
Vdc
Vdc
Vdc
Vdc
mAdc
W
C
C
EMITTER 3
BASE
1
COLLECTOR 2, 4
SOT−223 (TO−261)
CASE 318E
STYLE 1
THERMAL CHARACTERISTICS
Characteristic
Thermal Resistance,
Junction−to−Ambient (Note 1)
Symbol
R
qJA
Max
83.3
Unit
C/W
MARKING DIAGRAM
AYW
DC
G
G
1
A
Y
W
DC
G
= Assembly Location
= Year
= Work Week
= Device Code
= Pb−Free Package
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Device mounted on a glass epoxy printed circuit board 1.575 in. x 1.575 in. x
0.059 in.; mounting pad for the collector lead min. 0.93 in
2
.
(Note: Microdot may be in either location)
ORDERING INFORMATION
Device
BF720T1G
SBF720T1G
BF720T3G
Package
SOT−223
(Pb−Free)
SOT−223
(Pb−Free)
SOT−223
(Pb−Free)
Shipping
†
1,000 / Tape & Reel
1,000 / Tape & Reel
4,000 / Tape & Reel
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
Semiconductor Components Industries, LLC, 2011
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
Publication Order Number:
BF720T1/D
November, 2011
−
Rev. 8
1
BF720T1G, SBF720T1G, BF720T3G
ELECTRICAL CHARACTERISTICS
(T
A
= 25C unless otherwise noted)
Characteristics
OFF CHARACTERISTICS
Collector-Emitter Breakdown Voltage
(I
C
= 1.0 mAdc, I
B
= 0)
Collector-Base Breakdown Voltage
(I
C
= 100
mAdc,
I
E
= 0)
Collector-Emitter Breakdown Voltage
(I
C
= 100
mAdc,
R
BE
= 2.7 kW)
Emitter-Base Breakdown Voltage
(I
E
= 10
mAdc,
I
C
= 0)
Collector-Base Cutoff Current
(V
CB
= 200 Vdc, I
E
= 0)
Collector−Emitter Cutoff Current
(V
CE
= 250 Vdc, R
BE
= 2.7 kW)
(V
CE
= 200 Vdc, R
BE
= 2.7 kW, T
J
= 150C)
ON CHARACTERISTICS
DC Current Gain
(I
C
= 25 mAdc, V
CE
= 20 Vdc)
Collector-Emitter Saturation Voltage
(I
C
= 30 mAdc, I
B
= 5.0 mAdc)
DYNAMIC CHARACTERISTICS
Current−Gain
−
Bandwidth Product
(I
C
= 10 mAdc, V
CE
= 10 Vdc, f = 35 MHz)
Feedback Capacitance
(V
CE
= 30 Vdc, I
C
= 0, f = 1.0 MHz)
f
T
C
re
60
−
−
1.6
MHz
pF
h
FE
V
CE(sat)
50
−
−
0.6
−
Vdc
V
(BR)CEO
V
(BR)CBO
V
(BR)CER
V
(BR)EBO
I
CBO
I
CER
300
300
300
5.0
−
−
−
−
−
−
−
10
50
10
Vdc
Vdc
Vdc
Vdc
nAdc
Symbol
Min
Max
Unit
nAdc
mAdc
http://onsemi.com
2
BF720T1G, SBF720T1G, BF720T3G
PACKAGE DIMENSIONS
SOT−223 (TO−261)
CASE 318E−04
ISSUE N
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: INCH.
DIM
A
A1
b
b1
c
D
E
e
e1
L
L1
H
E
MIN
1.50
0.02
0.60
2.90
0.24
6.30
3.30
2.20
0.85
0.20
1.50
6.70
0
MILLIMETERS
NOM
MAX
1.63
1.75
0.06
0.10
0.75
0.89
3.06
3.20
0.29
0.35
6.50
6.70
3.50
3.70
2.30
2.40
0.94
1.05
−−−
−−−
1.75
2.00
7.00
7.30
10
−
MIN
0.060
0.001
0.024
0.115
0.009
0.249
0.130
0.087
0.033
0.008
0.060
0.264
0
INCHES
NOM
0.064
0.002
0.030
0.121
0.012
0.256
0.138
0.091
0.037
−−−
0.069
0.276
−
MAX
0.068
0.004
0.035
0.126
0.014
0.263
0.145
0.094
0.041
−−−
0.078
0.287
10
D
b1
4
H
E
E
1
2
3
e1
b
e
A
q
L
L1
C
q
0.08 (0003)
A1
STYLE 1:
PIN 1.
2.
3.
4.
BASE
COLLECTOR
EMITTER
COLLECTOR
SOLDERING FOOTPRINT*
3.8
0.15
2.0
0.079
2.3
0.091
2.3
0.091
6.3
0.248
2.0
0.079
1.5
0.059
mm
inches
SCALE 6:1
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor
and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
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4
BF720T1/D
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