3. Surface−mounted on FR4 board using the minimum recommended pad size, 1 oz Cu.
ELECTRICAL CHARACTERISTICS
(T
J
= 25°C unless otherwise specified)
Parameter
OFF CHARACTERISTICS
Drain−to−Source Breakdown Voltage
Zero Gate Voltage Drain Current
I
DSS
V
GS
= 0 V, V
DS
= 5 V
V
GS
= 0 V, V
DS
= 16 V
Gate−to−Source Leakage Current
ON CHARACTERISTICS
(Note 4)
Gate Threshold Voltage
Drain−to−Source On Resistance
V
GS(TH)
V
GS
= V
DS
, I
D
= 250
mA
V
GS
= 4.5 V, I
D
= 100 mA
V
GS
= 2.5 V, I
D
= 50 mA
R
DS(ON)
V
GS
= 1.8 V, I
D
= 20 mA
V
GS
= 1.5 V, I
D
= 10 mA
V
GS
= 1.2 V, I
D
= 1.0 mA
Forward Transconductance
Source−Drain Diode Voltage
CAPACITANCES
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
C
ISS
C
OSS
C
RSS
f = 1.0 MHz, V
GS
= 0 V
V
DS
= 15 V
12.5
3.6
2.6
pF
g
FS
V
SD
V
DS
= 5.0 V, I
D
= 125 mA
V
GS
= 0 V, I
S
= 10 mA
0.4
0.75
1.0
1.4
1.8
2.8
0.48
0.6
1.0
S
V
1.0
1.5
2.0
3.0
4.5
W
V
I
GSS
V
(BR)DSS
V
GS
= 0 V, I
D
= 250
mA
T
J
= 25°C
T
J
= 85°C
T
J
= 25°C
20
50
200
100
±100
nA
nA
V
nA
Symbol
Test Condition
Min
Typ
Max
Unit
V
DS
= 0 V, V
GS
=
±5.0
V
SWITCHING CHARACTERISTICS, V
GS
= 4.5 V
(Note 4)
Turn−On Delay Time
Rise Time
Turn−Off Delay Time
Fall Time
t
d(ON)
t
r
t
d(OFF)
t
f
V
GS
= 4.5 V, V
DD
= 10 V, I
D
= 200 mA,
R
G
= 2.0
W
16.5
25.5
142
80
ns
4. Switching characteristics are independent of operating junction temperatures.
ORDERING INFORMATION
Device
NTUD3170NZT5G
Package
SOT−963
(Pb−Free)
Shipping
†
8000 / Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
www.onsemi.com
2
NTUD3170NZ
TYPICAL CHARACTERISTICS
0.4
V
GS
= 2 thru 5 V
I
D
, DRAIN CURRENT (A)
1.8 V
0.3
1.6 V
T
J
= 25°C
I
D
, DRAIN CURRENT (A)
0.3
0.4
V
DS
≥
5 V
T
J
= −55°C
T
J
= 25°C
T
J
= 125°C
1.4 V
0.2
0.2
1.2 V
0.1
0.1
0
0
1
2
3
4
5
V
DS
, DRAIN−TO−SOURCE VOLTAGE (V)
0
0
1
2
3
V
GS
, GATE−TO−SOURCE VOLTAGE (V)
Figure 1. On−Region Characteristics
4
R
DS(on)
, DRAIN−TO−SOURCE RE-
SISTANCE (W)
I
D
= 220 mA
T
J
= 25°C
3
R
DS(on)
, DRAIN−TO−SOURCE RE-
SISTANCE (W)
1.50
Figure 2. Transfer Characteristics
T
J
= 25°C
1.25
V
GS
= 2.5 V
1.00
0.75
0.50
0.25
0
V
GS
= 4.5 V
2
1
0
0
1
2
3
4
5
V
GS
, GATE−TO−SOURCE VOLTAGE (V)
0.05
0.10
0.15
0.20
0.25
0.30
0.35
0.40
I
D
, DRAIN CURRENT (A)
Figure 3. On−Resistance vs. Gate Voltage
1.75
R
DS(on)
, DRAIN−TO−SOURCE RE-
SISTANCE (NORMALIZED)
I
D
= 100 mA
1.50
I
DSS
, LEAKAGE (nA)
V
GS
= 4.5 V
10,000
Figure 4. On−Resistance vs. Drain Current and
Gate Voltage
V
GS
= 0 V
1000
1.25
T
J
= 150°C
T
J
= 125°C
1.00
100
0.75
0.50
−50
10
−25
0
25
50
75
100
125
150
0
4
8
12
16
20
T
J
, JUNCTION TEMPERATURE (°C)
V
DS
, DRAIN−TO−SOURCE VOLTAGE (V)
Figure 5. On−Resistance Variation with
Temperature
Figure 6. Drain−to−Source Leakage Current
vs. Voltage
www.onsemi.com
3
NTUD3170NZ
TYPICAL CHARACTERISTICS
20.0
17.5
C, CAPACITANCE (pF)
15.0
12.5
10.0
7.50
5.00
2.50
0
0
5
10
15
20
GATE−TO−SOURCE AND DRAIN−TO−SOURCE VOLTAGE (V)
C
rss
1
1
10
R
G
, GATE RESISTANCE (W)
100
C
oss
C
iss
T
J
= 25°C
t, TIME (ns)
100
1000
V
DD
= 10 V
I
D
= 200 mA
V
GS
= 4.5 V
t
d(off)
t
f
t
r
t
d(on)
10
V
GS
= 0 V
Figure 7. Capacitance Variation
0.200
V
GS
= 0 V
I
S
, SOURCE CURRENT (A)
0.175
T
J
= 25°C
0.150
0.125
0.100
0.075
0.050
0.025
0
0
0.2
0.4
0.6
Figure 8. Resistive Switching Time Variation
vs. Gate Resistance
0.8
1
V
SD
, SOURCE−TO−DRAIN VOLTAGE (V)
Figure 9. Diode Forward Voltage vs. Current
www.onsemi.com
4
NTUD3170NZ
PACKAGE DIMENSIONS
SOT−963
CASE 527AD
ISSUE E
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD
FINISH THICKNESS. MINIMUM LEAD
THICKNESS IS THE MINIMUM THICKNESS OF
BASE MATERIAL.
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS, OR GATE BURRS.
DIM
A
b
C
D
E
e
H
E
L
L2
MILLIMETERS
MIN
NOM
MAX
0.34
0.37
0.40
0.10
0.15
0.20
0.07
0.12
0.17
0.95
1.00
1.05
0.75
0.80
0.85
0.35 BSC
0.95
1.00
1.05
0.19 REF
0.05
0.10
0.15
D
X
Y
4
E
A
6
1
5
2
H
E
3
C
SIDE VIEW
6X
TOP VIEW
e
L
6X
L2
6X
b
0.08 X Y
RECOMMENDED
MOUNTING FOOTPRINT
6X
6X
BOTTOM VIEW
0.20
PACKAGE
OUTLINE
0.35
1.20
0.35
PITCH
DIMENSIONS: MILLIMETERS
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