(Note 2)The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside
surface of the component package.
(Note 3)Using a PCB board based on JESD51-3.
Layer Number of
Measurement Board
Single
Top
Copper Pattern
Footprints and Traces
Layer Number of
Measurement Board
4 Layers
Top
Copper Pattern
Footprints and Traces
Material
FR-4
Thickness
70μm
Board Size
114.3mm x 76.2mm x 1.57mmt
(Note 4)Using a PCB board based on JESD51-5, 7.
Material
FR-4
Thickness
70μm
Board Size
114.3mm x 76.2mm x 1.6mmt
2 Internal Layers
Copper Pattern
74.2mm x 74.2mm
Thickness
35μm
Thermal Via
(Note 5)
Pitch
1.20mm
Bottom
Copper Pattern
74.2mm x 74.2mm
Thickness
70μm
Diameter
Φ0.30mm
(Note 5) This thermal via connects with the copper pattern of all layers.
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Embedded System
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