BAT54
Small signal Schottky diodes
Datasheet
production data
Features
Low conduction and reverse losses
Negligible switching losses
Low forward and reverse recovery times
Extremely fast switching
Surface mount device
Low capacitance diode
ECOPACK
®
2 compliant component
Description
The BAT54 series uses 40 V Schottky barrier
diodes packaged in SO123, SOD323, SOD523,
SOT-23, or SOT-323.
Table 1. Device summary
Symbol
I
F
V
RRM
C (typ)
T
j
(max)
Value
300 mA
40 V
7 pF
150 °C
June 2016
This is information on a product in full production.
DocID5505 Rev 12
1/15
www.st.com
Characteristics
BAT54
1
Characteristics
Table 2. Absolute ratings (limiting values at T
j
= 25 °C, unless otherwise specified)
Symbol
V
RRM
I
F
I
FSM
T
stg
T
j
T
L
Parameter
Repetitive peak reverse voltage
Continuous forward current
Surge non repetitive forward current
Storage temperature range
Operating junction temperature range
Maximum soldering temperature
t
p
= 10 ms Sinusoidal
Value
40
300
1.25
-65 to +150
-40 to +150
260
Unit
V
mA
A
°C
°C
°C
Table 3. Thermal parameters
Symbol
Parameter
SOT-23, SOD-123
R
th(j-a)
Junction to ambient
(1)
SOT-323, SOD323
SOD-523
1. Epoxy printed circuit board with recommended pad layout
Value
500
550
600
Unit
°C/W
Table 4. Static electrical characteristics
Symbol
I
R(1)
Parameter
Reverse leakage current
Test conditions
T
j
= 25 °C
T
j
= 100 °C
V
R
= 30 V
I
F
= 0.1 mA
I
F
= 1 mA
V
F(2)
Forward voltage drop
T
j
= 25 °C
I
F
= 10 mA
I
F
= 30 mA
I
F
= 100 mA
1. Pulse test: t
p
= 5 ms,
< 2%
2. Pulse test: t
p
= 380 µs,
< 2%
Min.
Typ.
Max.
1
Unit
µA
100
240
320
400
500
900
mV
Table 5. Dynamic characteristics
Symbol
C
t
rr
Parameter
Diode capacitance
Reverse recovery time
Test conditions
V
R
= 1 V, F = 1 MHz
I
F
= 10 mA, I
R
= 10 mA, T
j
= 25 °C
I
rr
= 1 mA, R
L
= 100
Min.
Typ. Max. Unit
7
10
5
pF
ns
2/15
DocID5505 Rev 12
BAT54
Characteristics
Figure 1. Average forward power dissipation
versus average forward current
0.35
0.30
0.25
0.20
0.15
0.10
0.05
I
F(AV)
(A)
Figure 2. Average forward current versus
ambient temperature ( = 1)
0.35
I
F(AV)
(A)
P(W)
δ=0.05
δ=0.2
δ=0.1
δ=0.5
δ=1
0.30
0.25
0.20
0.15
T
0.10
0.05
tp
T
δ
=tp/T
0.20
0.25
0.30
δ
=tp/T
0
25
tp
T
amb
(°C)
0.00
0.00
0.00
0.05
0.10
0.15
0.35
50
75
100
125
150
Figure 3. Reverse leakage current versus
reverse applied voltage (typical values)
1.E+02
I
R
(µA)
T
j
=100°C
Figure 4. Reverse leakage current versus
junction temperature
I
R
[T
j
] / I
R
[T
j
=25°C]
1.E+04
V
R
=3V
1.E+01
1.E+03
1.E+02
1.E+00
T
j
=50°C
1.E+01
1.E-01
T
j
=25°C
1.E+00
V
R
(V)
T
j
(°C)
1.E-01
1.E-02
0
5
10
15
20
25
30
0
25
50
75
100
125
150
Figure 5. Junction capacitance versus reverse
applied voltage (typical values)
10
C(pF)
F=1MHz
V
OSC
=30mV
RMS
T
j
=25°C
Figure 6. Forward voltage drop versus forward
current (typical values)
1.E+00
I
FM
(A)
T
j
=100°C
1.E-01
1.E-02
T
j
=50°C
T
j
=25°C
1.E-03
V
R
(V)
T
j
=-40 °C
1
1
10
100
1.E-04
0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2 1.3
V
FM
(V)
DocID5505 Rev 12
3/15
15
Characteristics
BAT54
Figure 7. Thermal resistance junction to
ambient versus copper surface under each lead
(SOD323)
600
R
th(j-a)
(°C/W)
Epoxy FR4
e
CU
=35 µm
Figure 8. Relative variation of thermal
impedance junction to ambient versus pulse
duration (SOD323)
1.E+00
Z
th(j-a)
/R
th(j-a)
Single pulse
SOD323
500
1.E-01
400
1.E-02
300
S
CU
(mm²)
Epoxy FR4
S
CU
=2.25 mm²
e
CU
=35 µm
t
P
(s)
200
0
5
10
15
20
25
30
35
40
45
50
1.E-03
1.E-03
1.E-02
1.E-01
1.E+00
1.E+01
1.E+02
1.E+03
Figure 9. Relative variation of thermal
impedance junction to ambient versus pulse
duration (SOT23)
1.E+00
Z
th(j-a)
/R
th(j-a)
Single pulse
SOT23
Figure 10. Relative variation of thermal
impedance junction to ambient versus pulse
duration (SOD-523)
1.E+00
Z
th(j-a)
/R
th(j-a)
Single pulse
SOD523
1.E-01
1.E-01
1.E-02
Alumine substrate
10 x 8 x 0.5 mm
t
P
(s)
t
P
(s)
Epoxy FR4
e
CU
=35 µm
1.E-02
1.E-03
1.E-02
1.E-01
1.E+00
1.E+01
1.E+02
1.E-03
1.E-03
1.E-02
1.E-01
1.E+00
1.E+01
4/15
DocID5505 Rev 12
BAT54
Package information
2
Package information
Epoxy meets UL94, V0
Lead-free packages
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
®
packages, depending on their level of environmental compliance. ECOPACK
®
specifications, grade definitions and product status are available at:
www.st.com.
ECOPACK
®
is an ST trademark.
Figure 11. SOD123 dimension definitions
DocID5505 Rev 12
5/15
15
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