BAL-CC25-01D3
50 ohm, conjugate match to CC253x, CC254x, CC257x, CC852x,
CC853x, transformer balun
Datasheet
production data
Description
STMicroelectronics BAL-CC25-01D3 is an ultra
miniature balun which integrates a matching
network in a monolithic glass substrate. This has
been customized for the CC25xx and CC85xx RF
transceivers.
It’s a design using STMicroelectronics IPD
(integrated passive device) technology on non-
conductive glass substrate to optimize RF
performance.
Figure 1. Pin configuration (top view)
Features
2.45 GHz balun with integrated matching
network
Matching optimized for following chip-sets:
– CC2530, CC2531, CC2533
– CC2540
– CC2543, CC2544, CC2545
– CC2570, CC2571
– CC8520, CC8521
– CC8530, CC82531
Low insertion loss
Low amplitude imbalance
Low phase imbalance
Coated Flip-Chip on glass
Small footprint: < 0.88 mm²
RF_N
SE
RF_P
GND
Figure 2. Application schematic (top view)
Benefits
Very low profile
High RF performance
PCB space saving versus discrete solution
BOM count reduction
Efficient manufacturability
November 2015
This is information on a product in full production.
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10
Characteristics
BAL-CC25-01D3
1
Characteristics
Table 1.
A
bsolute maximum rating (limiting values)
Value
Symbol
P
PEAK
Input power RF
IN
Parameter
Min.
Typ.
20
Max.
Unit
dBm
ESD ratings MIL STD883C (HBM: C = 100 pF, R = 1.5 kair discharge) 2000
V
ESD
ESD ratings machine model (MM: C = 200 pF, R = 25L = 500 nH)
ESD ratings charged device model (CDM, JESD22-C101D)
T
OP
Operating temperature
500
500
-40
+125
ºC
V
Table 2. Electrical characteristics - RF performance (T
amb
= 25 °C)
Value
Symbol
Z
OUT
Z
IN
F
I
L
R
L_SE
R
L_DIFF
imb
A
imb
Parameter
Min.
Nominal differential output impedance
Nominal input impedance
Frequency range (bandwidth)
Insertion loss in bandwidth
Single ended return loss in bandwidth
Differential ended return loss in bandwidth
Phase imbalance
Amplitude imbalance
Typ.
Max.
Unit
Conjugate match to CC25xx,
CC85xx
2379
0.66
19
19
14
0.3
2507
dB
dB
dB
°
dB
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BAL-CC25-01D3
Figure 3. Insertion loss (T
amb
= 25 °C)
-0.5
IL (dB)
Characteristics
-0.6
-0.7
-0.8
-0.9
F (GHz)
-1.0
2.38
2.40
2.42
2.44
2.46
2.48
2.50
2.52
Figure 4. Return loss (T
amb
= 25 °C)
RL_SE (dB)
-10
-12.5
-15
-17.5
-20
-22.5
-25
-27.5
-30
2.38
2.40
2.42
2.44
2.46
2.48
2.50
2.52
F (GHz)
Figure 5. Return loss (T
amb
= 25 °C)
RL_DIFF (dB)
-10
-12.5
-15
-17.5
-20
-22.5
-25
-27.5
-30
2.38
2.40
2.42
2.44
2.46
2.48
2.50
2.52
F (GHz)
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Characteristics
Figure 6. Amplitude imbalance (T
amb
= 25 °C)
AMPL(dB)
0.5
BAL-CC25-01D3
0.4
0.3
0.2
0.1
F (GHz)
0.0
2.38
2.40
2.42
2.44
2.46
2.48
2.50
2.52
Figure 7. Phase imbalance (T
amb
= 25 °C)
PHASE(deg)
20.0
17.5
15
12.5
10
7.5
5
2.5
F (GHz)
0.0
2.38
2.40
2.42
2.44
2.46
2.48
2.50
2.52
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BAL-CC25-01D3
Package information
2
Package information
Epoxy meets UL94, V0
Lead-free package
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
®
packages, depending on their level of environmental compliance. ECOPACK
®
specifications, grade definitions and product status are available at:
www.st.com.
ECOPACK
®
is an ST trademark.
2.1
Flip-Chip package information
Figure 8. Flip-Chip package outline
Table 3. Flip-Chip package mechanical data
Parameter
A
A1
A2
b
D
D1
E
E1
SE
fD
fE
ccc
$
0.025
Distance from bump to edge of die on Y
axis
Distance from bump to edge of die on X
axis
Description
Bump height + substrate thickness
Bump height
Substrate thickness
Bump diameter
Y dimension of the die
Y pitch
X dimension of the die
X pitch
0.890
0.215
0.890
Min.
0.570
0.155
Typ.
0.630
0.205
0.400
0.255
0.940
0.500
0.940
0.500
0.250
0.220
0.220
0.05
0.990
0.295
0.990
Max.
0.690
0.255
Unit
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
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