HuaWei Electronics has multiple power semiconductor discrete devices and IC chip production lines such as 4-inch, 5-inch and 6-inch, with a chip processing capacity of 3.3 million pieces per year and packaging resources of 2.4 billion pieces per year. The company has many patents in terminal design, process manufacturing and product design. Each series of products adopts core manufacturing technologies such as IGBT, MOS, bipolar technology and integrated circuits. The company mainly produces power semiconductor devices and ICs, which are used in automotive electronics, power electronics, photovoltaic inverters, industrial control and LED lighting. At present, the company has formed a series of products with IGBT, VDMOS, FRED, SBD, BJT, IPM and other products as the main marketing lines, and has become a manufacturer that provides solutions to customers in the field of power semiconductor devices and a provider of LED lighting solutions.
Recently, some people have been asking how to determine the crystal load capacitance of MSP430. Generally speaking, everyone uses some empirical values and is not particularly clear about the principl...
[i=s] This post was last edited by paulhyde on 2014-9-15 09:16 [/i] Hello friends; I am now designing a high-speed data acquisition system for a single-chip microcomputer and FPGA. The general idea is...
The board sold on the forum, first install e2 studio, similar to eclipse, double-click the exe file in the CDSelect allSelect the installation pathIn progressCompletedELF custom installationAllIn prog...
Nippon Seiko announced that it has successfully developed a steering column with a new safety mechanism. In the mechanism for adjusting the steering wheel, not only has the adjustability in the up-dow...
{:1_145:} I need help to make a static display digital tube with 2812. Static is fine (preferably simple). Use PW1 port and timer to control the number 9~0 to decrease. I can't install 3.3 on Windows ...
Ceva's market share will reach 68% in 2024, with a solid leadership position in Bluetooth, Wi-Fi, UWB, 802.15.4 and cellular IoT IP, highlighting its role in connecting smart edge devices.
...[Details]
On August 5, the National Enterprise Credit Information Publicity System website showed that the registration status of Zhejiang Hongzhen Intelligent Chip Co., Ltd. was changed from existing to can...[Details]
Enhanced visual experience: Intel and BOE launch the first AI-driven multi-frequency display solution.
Significantly extend laptop battery life and enhance user experience ...[Details]
On December 22, Taiwanese media outlet Mirror Weekly reported that TSMC's second wafer fab in Japan, JASM, "is very likely to skip 4nm and go straight to 2nm process."
JASM's second wafer fab ...[Details]
As the Director of Marketing and Strategic Planning for Automation at Applied Materials, David Hanny's team frequently has the opportunity to engage in in-depth discussions with customers. As a res...[Details]
Against the backdrop of a continuously rising AI computing power and a gradual slowdown in process miniaturization, advanced packaging has become a key breakthrough for improving chip performance, ...[Details]
World of Electronic Engineering, Ji Kai
Yang Yi, General Manager of Ruicheng Microelectronics, gave a media interview during ICCAD 2025. Yang stated that as a company focused on integrat...[Details]
ICCAD-Expo 2025 was successfully held at the Western China International Expo City in Chengdu from November 20th to 21st.
Themed "Open Innovation, Shaping the Future," the conference attracte...[Details]
On November 18, GlobalFoundries announced that it had acquired Singapore-based silicon photonics chip manufacturer Advanced Micro Foundry (AMF) for an undisclosed sum.
To complement the acquis...[Details]
According to a report by South Korea's "Electronic News" today, the development of high-bandwidth memory (HBM) is driving storage giant SK Hynix to overcome a new performance bottleneck—the develop...[Details]
Murata Manufacturing's 2025 patent lawsuit against Maxscend Microelectronics is not a typical infringement dispute confined to a single jurisdiction or isolated technical point.
It can be see...[Details]
DENSO Corporation (Headquartered in Kariya, Aichi Prefecture, Japan; President: Shinnosuke Hayashi; hereinafter referred to as “DENSO”) and ROHM Co., Ltd. (Headquartered in Ukyo-ku, Kyoto, Japan;...[Details]
— Against the backdrop of the accelerated evolution and reshaping of the global electronics industry,
the Global Electronics Association (formerly the IPC, the International Association for Co...[Details]
Improve production efficiency by enabling one-time testing through high-voltage switch matrix
The system is designed to improve operator and equipment safety while ensuring co...[Details]
On September 27, Tata Electronics announced in New Delhi, India, that it had reached a final agreement on technology transfer with Taiwan-based wafer foundry Powerchip Semiconductor Manufacturing C...[Details]
Microcontroller MCU
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