4 Isat1: Peak current for approximately 30% rolloff at +25°C.
5 Isat2: Peak current for approximately 30% rolloff at +125°C.
6 K-factor: Used to determine Bp-p for core loss (see graph). Bp-p = K * L *
ΔI
* 10-3, Bp-p : (Gauss),
K: (K-factor from table), L: (inductance in nH),
ΔI
(peak-to-peak ripple current in amps).
7 Part Number Definition: FP1109-xxx-R
• FP1109 = Product code and size
• xxx= Inductance value in
μH,
R = decimal point. If no “R” is present, then
third character = # of zeros
• “-R” suffix = RoHS compliant
1 Open Circuit Inductance (OCL) Test Parameters: 100kHz, 0.10Vrms, 0.0Adc
2 Full Load Inductance (FLL) Test Parameters: 100kHz, 0.1Vrms, Isat1
3 Irms: DC current for an approximate temperature rise of 40°C without core loss. Derating is
necessary for AC currents. PCB pad layout, trace thickness and width, air-flow and proximity of
other heat generating components will affect the temperature rise. It is recommended the part
temperature not exceed 125°C under worst case operating conditions verified in the end
application.
Dimensions-
mm
F ront V iew
T op V iew
S ide V iew
R ecom m ended P ad Layout
S chem atic
2
F P 1 1 0 9 -xxx
w w llyy R
2.5 nom .
(2x)
9.0
m ax
11.2
m ax
11.4
3.0
(2X )
1
2
3.0
(2X )
2.03 ref
4.10 ref
(2X )
1
11.2 m ax
Part Marking: FP1109
xxx = Inductance value in
μH.
(R = Decimal point). If no “R” is present, then last character is # of zeros
wwllyy = Date code
R = Revision level
Packaging
information
- mm
4.00
1.5 dia. +0.1/-0.0
2.00
1.5 dia. min
1.75
Section A-A
1
11.50
FP1109-xxx
wwllyy R
17.5 11.4
24.0 ±0.3
2
9.3
11.4
16.4
2.0
20.00
User direction of feed
Supplied in tape-and-reel packaging, 350 parts per reel, 13” diameter reel.
2
www.eaton.com/electronics
FP1109
High frequency, high current power inductor
Temperature rise
vs
total loss
50
Technical Data
4350
Effective
June
2017
40
Tem perature R ise (°C )
30
20
10
0
0
0 .2
0 .4
0 .6
0 .8
1
1 .2
1 .4
1 .6
T o tal Lo ss (W )
Core
loss
vs Bp-p
100
1MHz
500kHz
10
300kHz
200kHz
100kHz
1
Core Loss (W)
0.1
0.01
0.001
0.0001
0.00001
100
1000
10000
B
p-p
(Gauss)
Inductance characteristics
% o f O C L v s . % o f Is
a t
1
120%
100%
80%
% of OCL
- 4 0 °C
60%
40%
+1 2 5 °C
+2 5 °C
20%
0%
0%
20%
40%
60%
80%
100%
120%
% o f Is
a t
1
www.eaton.com/electronics
3
Technical Data
4350
Effective
June
2017
FP1109
High frequency, high current power inductor
Solder Reflow Profile
T
P
Max. Ramp Up Rate = 3°C/s
Max. Ramp Down Rate = 6°C/s
T
L
Preheat
A
t
t
P
T
C
-5°C
T
ab
l
e
1 -
S
t
a
n
da
r
d S
nP
b S
ol
de
r (T c)
Package
Thickness
<2.5mm
_
>2.5mm
Volume
mm
3
<350
235°C
220°C
Volume
mm
3
_
>350
220°C
220°C
Temperature
T
smax
T
ab
l
e
2 - L
ead
(P
b
) Fr
ee S
ol
de
r (T c)
T
smin
t
s
Package
Thickness
<1.6mm
1.6 – 2.5mm
>2.5mm
Time
Volume
mm
3
<350
260°C
260°C
250°C
Volume
mm
3
350 - 2000
260°C
250°C
245°C
Volume
mm
3
>2000
260°C
245°C
245°C
25°C
Time 25°C to Peak
Reference JDEC J-STD-020
Profile Feature
Preheat
and Soak
• T
e
mperature min. (Tsmin)
• Temperature max. (Tsmax)
• Time (Tsmin to Tsmax) (ts)
Average ramp up rate Tsmax to Tp
Liquidous temperature (T
L
)
Time
at
liquidous (tL)
Peak package
body
temperature (TP)*
Time (tp)** within 5 °C of the specified classification temperature (Tc)
Average ramp-down rate (Tp to Tsmax)
Time 25°C to Peak Temperature
Standard SnPb Solder
100°C
150°C
60-120 Seconds
3°C/
Second
Max.
183°C
60-150 Seconds
Table 1
20
Seconds**
6°C/ Second
Max.
6
Minutes Max.
Lead (Pb) Free Solder
150°C
200°C
60-120 Seconds
3°C/
Second
Max.
217°C
60-150 Seconds
T
able
2
30
Seconds**
6°C/ Second
Max.
8 Minutes Max.
*
Tolerance for peak profile temperature (Tp) is
defined as a
supplier minimum
and a
user maximum.
**
Tolerance for time
at
peak profile temperature (tp) is
defined as a
supplier minimum
and a
user maximum.
Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written
approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly
used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user.
Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also
reserves the right to change or update, without notice, any technical information contained in this bulletin.
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