
Working voltage: 1.8V ~ 3.6V CPU bits: 16-Bit CPU core: MSP430 Main frequency (MAX): 12MHz ROM type: FLASH 16-bit ultra-low power microprocessor with 16kB flash memory, 512B RAM and 3-segment SD24
| Parameter Name | Attribute value |
| Brand Name | Texas Instruments |
| Is it lead-free? | Lead free |
| Is it Rohs certified? | conform to |
| Maker | Texas Instruments |
| Parts packaging code | TSSOP |
| package instruction | TSSOP, TSSOP24,.25 |
| Contacts | 24 |
| Reach Compliance Code | compliant |
| ECCN code | EAR99 |
| Factory Lead Time | 1 week |
| Has ADC | YES |
| Address bus width | |
| bit size | 16 |
| boundary scan | YES |
| CPU series | MSP430 |
| maximum clock frequency | 12 MHz |
| DAC channel | NO |
| DMA channel | NO |
| External data bus width | |
| JESD-30 code | R-PDSO-G24 |
| JESD-609 code | e4 |
| length | 7.8 mm |
| low power mode | YES |
| Humidity sensitivity level | 1 |
| Number of I/O lines | 11 |
| Number of terminals | 24 |
| On-chip program ROM width | 8 |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | -40 °C |
| PWM channel | YES |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | TSSOP |
| Encapsulate equivalent code | TSSOP24,.25 |
| Package shape | RECTANGULAR |
| Package form | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| Peak Reflow Temperature (Celsius) | 260 |
| Certification status | Not Qualified |
| RAM (bytes) | 512 |
| rom(word) | 16384 |
| ROM programmability | FLASH |
| Maximum seat height | 1.2 mm |
| speed | 12 MHz |
| Maximum slew rate | 4.5 mA |
| Maximum supply voltage | 3.6 V |
| Minimum supply voltage | 1.8 V |
| Nominal supply voltage | 2.2 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | INDUSTRIAL |
| Terminal surface | Nickel/Palladium/Gold (Ni/Pd/Au) |
| Terminal form | GULL WING |
| Terminal pitch | 0.65 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 4.4 mm |
| uPs/uCs/peripheral integrated circuit type | MICROCONTROLLER, RISC |