time base integration
| Parameter Name | Attribute value |
| Brand Name | Texas Instruments |
| Maker | Texas Instruments |
| Parts packaging code | SOIC |
| package instruction | SOP, SOP8,.25 |
| Contacts | 8 |
| Reach Compliance Code | not_compliant |
| ECCN code | EAR99 |
| Factory Lead Time | 6 weeks |
| Analog Integrated Circuits - Other Types | PULSE; RECTANGULAR |
| JESD-30 code | R-PDSO-G8 |
| JESD-609 code | e0 |
| length | 4.9 mm |
| Humidity sensitivity level | 1 |
| Number of functions | 1 |
| Number of terminals | 8 |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | SOP |
| Encapsulate equivalent code | SOP8,.25 |
| Package shape | RECTANGULAR |
| Package form | SMALL OUTLINE |
| Peak Reflow Temperature (Celsius) | 235 |
| power supply | 5/15 V |
| Certification status | Not Qualified |
| Maximum seat height | 1.75 mm |
| Maximum supply current (Isup) | 15 mA |
| Maximum supply voltage (Vsup) | 16 V |
| Minimum supply voltage (Vsup) | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | YES |
| technology | BIPOLAR |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | GULL WING |
| Terminal pitch | 1.27 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 3.9 mm |
| LM555CMX | |
|---|---|
| Description | time base integration |
| Brand Name | Texas Instruments |
| Maker | Texas Instruments |
| Parts packaging code | SOIC |
| package instruction | SOP, SOP8,.25 |
| Contacts | 8 |
| Reach Compliance Code | not_compliant |
| ECCN code | EAR99 |
| Factory Lead Time | 6 weeks |
| Analog Integrated Circuits - Other Types | PULSE; RECTANGULAR |
| JESD-30 code | R-PDSO-G8 |
| JESD-609 code | e0 |
| length | 4.9 mm |
| Humidity sensitivity level | 1 |
| Number of functions | 1 |
| Number of terminals | 8 |
| Maximum operating temperature | 70 °C |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | SOP |
| Encapsulate equivalent code | SOP8,.25 |
| Package shape | RECTANGULAR |
| Package form | SMALL OUTLINE |
| Peak Reflow Temperature (Celsius) | 235 |
| power supply | 5/15 V |
| Certification status | Not Qualified |
| Maximum seat height | 1.75 mm |
| Maximum supply current (Isup) | 15 mA |
| Maximum supply voltage (Vsup) | 16 V |
| Minimum supply voltage (Vsup) | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | YES |
| technology | BIPOLAR |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | GULL WING |
| Terminal pitch | 1.27 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 3.9 mm |
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