TC58BVG0S3HTA00
TOSHIBA MOS DIGITAL INTEGRATED CIRCUIT SILICON GATE CMOS
1 GBIT (128M
×
8 BIT) CMOS NAND E PROM
DESCRIPTION
The TC58BVG0S3HTA00 is a single 3.3V 1 Gbit (1,107,296,256 bits) NAND Electrically Erasable and
Programmable Read-Only Memory (NAND E
2
PROM) organized as (2048
+
64) bytes
×
64 pages
×
1024blocks.
The device has a 2112-byte static register which allows program and read data to be transferred between the
register and the memory cell array in 2112-bytes increments. The Erase operation is implemented in a single block
unit (128 Kbytes
+
4 Kbytes: 2112 bytes
×
64 pages).
The TC58BVG0S3HTA00 is a serial-type memory device which utilizes the I/O pins for both address and data
input/output as well as for command inputs. The Erase and Program operations are automatically executed making
the device most suitable for applications such as solid-state file storage, voice recording, image file memory for still
cameras and other systems which require high-density non-volatile memory data storage.
The TC58BVG0S3HTA00 has ECC logic on the chip and 8bit read errors for each 528Bytes can be corrected
internally.
2
FEATURES
•
Organization
Memory cell array
Register
Page size
Block size
x8
2112
×
64K
×
8
2112× 8
2112 bytes
(128K
+
4K) bytes
•
Modes
Read, Reset, Auto Page Program, Auto Block Erase, Status Read, Page Copy,
ECC Status Read
Mode control
Serial input/output
Command control
Number of valid blocks
Min 1004 blocks
Max 1024 blocks
Power supply
V
CC
=
2.7V to 3.6V
Access time
Cell array to register
Serial Read Cycle
Program/Erase time
Auto Page Program
Auto Block Erase
Operating current
Read (25 ns cycle)
Program (avg.)
Erase (avg.)
Standby
40
µs
typ.
25 ns min (CL=50pF)
330
µs/page
typ.
2.5 ms/block typ.
30 mA max.
30 mA max
30 mA max
50
µA
max
•
•
•
•
•
•
•
Package
TSOP I 48-P-1220-0.50 (Weight: 0.53 g typ.)
8bit ECC for each 528Bytes is implemented on a chip.
•
1
2012-08-31C
TC58BVG0S3HTA00
PIN ASSIGNMENT (TOP VIEW)
TC58BVG0S3HTA00
×
8
×
8
NC
NC
NC
NC
NC
NC
RY / BY
RE
CE
NC
NC
V
CC
V
SS
NC
NC
CLE
ALE
WE
WP
NC
NC
NC
NC
NC
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
NC
NC
NC
NC
I/O8
I/O7
I/O6
I/O5
NC
NC
NC
V
CC
V
SS
NC
NC
NC
I/O4
I/O3
I/O2
I/O1
NC
NC
NC
NC
PIN NAMES
I/O1 to I/O8
CE
I/O port
Chip enable
WE
RE
CLE
ALE
WP
RY/BY
V
CC
V
SS
NC
Write enable
Read enable
Command latch enable
Address latch enable
Write protect
Ready/Busy
Power supply
Ground
No Connection
2
2012-08-31C
TC58BVG0S3HTA00
BLOCK DIAGRAM
Data register 1
ECC Logic
V
CC
V
SS
Status register
I/O1
to
I/O8
I/O
Control circuit
Address register
Column buffer
Column decoder
Command register
Data register 0
Sense amp
Row address decoder
CE
CLE
ALE
WE
RE
WP
Logic control
Control circuit
Row address buffer
decoder
Memory cell array
RY/BY
RY / BY
HV generator
ABSOLUTE MAXIMUM RATINGS
SYMBOL
V
CC
V
IN
V
I/O
P
D
T
SOLDER
T
STG
T
OPR
Power Supply Voltage
Input Voltage
RATING
VALUE
−
0.6 to 4.6
−
0.6 to 4.6
−
0.6 to V
CC
+
0.3
UNIT
V
V
Input /Output Voltage
Power Dissipation
Soldering Temperature (10 s)
Storage Temperature
Operating Temperature
(
≤
4.6 V)
V
W
°C
°C
°C
0.3
260
−
55 to 150
0 to 70
CAPACITANCE
*(Ta
=
25°C, f
=
1 MHz)
SYMB0L
C
IN
C
OUT
*
PARAMETER
Input
Output
CONDITION
V
IN
=
0 V
V
OUT
=
0 V
MIN
⎯
⎯
MAX
10
10
UNIT
pF
pF
This parameter is periodically sampled and is not tested for every device.
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2012-08-31C
TC58BVG0S3HTA00
VALID BLOCKS
SYMBOL
N
VB
NOTE:
PARAMETER
Number of Valid Blocks
MIN
1004
TYP.
⎯
MAX
1024
UNIT
Blocks
The device occasionally contains unusable blocks. Refer to Application Note (13) toward the end of this document.
The first block (Block 0) is guaranteed to be a valid block at the time of shipment.
The specification for the minimum number of valid blocks is applicable over lifetime
RECOMMENDED DC OPERATING CONDITIONS
SYMBOL
V
CC
V
IH
V
IL
*
PARAMETER
Power Supply Voltage
High Level input Voltage
Low Level Input Voltage
MIN
2.7
Vcc x 0.8
−
0.3
*
TYP.
⎯
⎯
⎯
MAX
3.6
V
CC
+
0.3
Vcc x 0.2
UNIT
V
V
V
−
2 V (pulse width lower than 20 ns)
DC CHARACTERISTICS
(Ta
=
0 to 70℃, V
CC
=
2.7 to 3.6V)
SYMBOL
I
IL
I
LO
I
CCO1
I
CCO2
I
CCO3
I
CCS
PARAMETER
Input Leakage Current
Output Leakage Current
Serial Read Current
Programming Current
Erasing Current
Standby Current
CONDITION
V
IN
=
0 V to V
CC
V
OUT
=
0 V to V
CC
CE
=
V
IL
, I
OUT
=
0 mA, tcycle
=
25 ns
MIN
⎯
⎯
⎯
⎯
⎯
⎯
TYP.
⎯
⎯
⎯
⎯
⎯
⎯
MAX
±
10
±
10
UNIT
µ
A
µ
A
30
30
30
50
mA
mA
mA
µ
A
⎯
⎯
CE
=
V
CC
−
0.2 V, WP
=
0 V/V
CC
,
V
OH
High Level Output Voltage
I
OH
= −
0.1 mA
Vcc – 0.2
⎯
⎯
V
V
OL
Low Level Output Voltage
I
OL
=
0.1 mA
⎯
⎯
0.2
V
I
OL
( RY / BY )
Output current of RY / BY
V
OL
=
0.2 V
pin
⎯
4
⎯
mA
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2012-08-31C
TC58BVG0S3HTA00
AC CHARACTERISTICS AND RECOMMENDED OPERATING CONDITIONS
(Ta
=
0 to 70℃, V
CC
=
2.7 to 3.6V)
SYMBOL
t
CLS
t
CLH
t
CS
t
CH
t
WP
t
ALS
t
ALH
t
DS
t
DH
t
WC
t
WH
t
WW
t
RR
t
RW
t
RP
t
RC
t
REA
tCEA
PARAMETER
CLE Setup Time
CLE Hold Time
CE
Setup Time
CE
Hold Time
MIN
12
5
20
5
12
12
5
12
5
25
10
100
20
20
12
25
⎯
⎯
MAX
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
UNIT
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
µ
s
Write Pulse Width
ALE Setup Time
ALE Hold Time
Data Setup Time
Data Hold Time
Write Cycle Time
WE High Hold Time
WP High to WE Low
Ready to RE Falling Edge
Ready to WE Falling Edge
Read Pulse Width
Read Cycle Time
RE Access Time
CE
Access Time
20
25
⎯
⎯
⎯
⎯
t
CLR
t
AR
t
RHOH
t
RLOH
t
RHZ
t
CHZ
t
CSD
t
REH
t
IR
t
RHW
t
WHC
t
WHR
t
WB
t
RST
CLE Low to RE Low
ALE Low to RE Low
RE High to Output Hold Time
RE Low to Output Hold Time
RE High to Output High Impedance
CE
High to Output High Impedance
10
10
25
5
⎯
⎯
60
20
⎯
⎯
⎯
⎯
⎯
⎯
CE
High to ALE or CLE Don’t Care
0
10
0
30
30
60
⎯
⎯
RE High Hold Time
Output-High-impedance-to- RE Falling Edge
RE High to WE Low
WE High to
CE
Low
WE High to RE Low
WE High to Busy
Device Reset Time (Ready/Read/Program/Erase)
100
5/5/10/500
*1: tCLS and tALS can not be shorter than tWP
*2: tCS should be longer than tWP + 8ns.
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2012-08-31C
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