BX80526F566128SL4NW datasheet, PDF

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BX80526F566128SL4NW: DescriptionRISC Microprocessor, 32-Bit, 566MHz, CMOS, PPGA370; CategoryMicrocontrollers and processors; File Size1MB，128 Pages; ManufacturerIntel; Websitehttp://www.intel.com/

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BX80526F566128SL4NW Overview

RISC Microprocessor, 32-Bit, 566MHz, CMOS, PPGA370

BX80526F566128SL4NW Parametric

Parameter Name	Attribute value
Maker	Intel
package instruction	PGA, SPGA370,37X37
Reach Compliance Code	unknown
Is Samacsys	N
bit size	32
JESD-30 code	S-PPGA-P370
Number of terminals	370
Package body material	PLASTIC/EPOXY
encapsulated code	PGA
Encapsulate equivalent code	SPGA370,37X37
Package shape	SQUARE
Package form	GRID ARRAY
power supply	1.5 V
Certification status	Not Qualified
speed	566 MHz
Nominal supply voltage	1.5 V
surface mount	NO
technology	CMOS
Terminal form	PIN/PEG
Terminal pitch	1.27 mm
Terminal location	PERPENDICULAR
uPs/uCs/peripheral integrated circuit type	MICROPROCESSOR, RISC
Base Number Matches	1

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Intel

Celeron

Processor

up to 1.10 GHz

Datasheet

Available at 1.10 GHz, 1 GHz, 950 MHz,

900 MHz, 850 MHz, 800 MHz, 766 MHz,

733 MHz, 700 MHz, 667 MHz, 633 MHz,

600 MHz, 566 MHz, 533 MHz,

533A MHz, 500 MHz, 466 MHz,

433 MHz, 400 MHz, 366 MHz, 333 MHz,

and 300A MHz core frequencies with

128 KB level-two cache (on die); 300 MHz

and 266 MHz core frequencies without

level-two cache.

Intel’s latest Celeron

processors in the

FC-PGA/FC-PGA2 package are

manufactured using the advanced 0.18

micron technology.

Binary compatible with applications

running on previous members of the Intel

microprocessor line.

Dynamic execution microarchitecture.

Operates on a 100/66 MHz, transaction-

oriented system bus.

Specifically designed for uni-processor

based Value PC systems, with the

capabilities of MMX™ technology.

Power Management capabilities.

Optimized for 32-bit applications running

on advanced 32-bit operating systems.

Uses cost-effective packaging technology.

— Single Edge Processor (S.E.P.) Package

to maintain compatibility with SC242

(processor core frequencies (MHz):

266, 300, 300A, 333, 366, 400, 433).

— Plastic Pin Grid Array (PPGA) Package

(processor core frequencies (MHz):

300A, 333, 366, 400, 433, 466, 500,

533).

— Flip-Chip Pin Grid Array (FC-PGA /

FC-PGA2) Package (processor core

frequencies (MHz); 533A, 566, 600,

633, 667, 700, 733, 766, 800, 850, 900,

950); (GHz); 1, 1.10

Integrated high-performance 32 KB

instruction and data, nonblocking, level-

one cache: separate 16 KB instruction and

16 KB data caches.

Integrated thermal diode.

The Intel

Celeron

processor is designed for uni-processor based Value PC desktops and is

binary compatible with previous generation Intel architecture processors. The Celeron processor

provides good performance for applications running on advanced operating systems such as

Microsoft* Windows*98, Windows NT*, Windows* 2000, Windows XP* and Linux*. This is

achieved by integrating the best attributes of Intel processors—the dynamic execution

performance of the P6 microarchitecture plus the capabilities of MMX™ technology—bringing

a balanced level of performance to the Value PC market segment. The Celeron processor offers

the dependability you would expect from Intel at an exceptional value. Systems based on

Celeron processors also include the latest features to simplify system management and lower the

cost of ownership for small business and home environments.

FC-PGA2 Package

FC-PGA Package

PPGA Package

S.E.P. Package

Document Number:

243658-020

January 2002

Intel

Celeron

Processor up to 1.10 GHz

Contents

1.0

Introduction.......................................................................................................................11

1.1

Terminology.........................................................................................................11

1.1.1 Package Terminology.............................................................................12

1.1.2 Processor Naming Convention...............................................................13

References ..........................................................................................................14

System Bus and Vref...........................................................................................15

Clock Control and Low Power States..................................................................15

2.2.1 Normal State—State 1 ...........................................................................16

2.2.2 AutoHALT Power Down State—State 2 .................................................16

2.2.3 Stop-Grant State—State 3 .....................................................................17

2.2.4 HALT/Grant Snoop State—State 4 ........................................................17

2.2.5 Sleep State—State 5..............................................................................17

2.2.6 Deep Sleep State—State 6 ....................................................................18

2.2.7 Clock Control..........................................................................................18

Power and Ground Pins ......................................................................................18

2.3.1 Phase Lock Loop (PLL) Power...............................................................19

Processor Decoupling .........................................................................................19

2.4.1 System Bus AGTL+ Decoupling.............................................................19

Voltage Identification ...........................................................................................20

System Bus Unused Pins....................................................................................21

Processor System Bus Signal Groups ................................................................21

2.7.1 Asynchronous Vs. Synchronous for System Bus Signals ......................23

2.7.2 System Bus Frequency Select Signal (BSEL[1:0]).................................23

Test Access Port (TAP) Connection....................................................................23

Maximum Ratings................................................................................................23

Processor DC Specifications...............................................................................24

AGTL+ System Bus Specifications .....................................................................33

System Bus AC Specifications ............................................................................34

System Bus Clock (BCLK) Signal Quality Specifications and

Measurement Guidelines ....................................................................................52

AGTL+ Signal Quality Specifications and Measurement Guidelines ..................55

Non-AGTL+ Signal Quality Specifications and Measurement Guidelines...........57

3.3.1 Overshoot/Undershoot Guidelines .........................................................57

3.3.2 Ringback Specification ...........................................................................58

3.3.3 Settling Limit Guideline...........................................................................59

AGTL+ Signal Quality Specifications and Measurement Guidelines

(FC-PGA/FC-PGA2 Packages) ...........................................................................59

3.4.1 Overshoot/Undershoot Guidelines (FC-PGA/FC-PGA2 Packages) .......59

3.4.2 Overshoot/Undershoot Magnitude (FC-PGA/FC-PGA2 Packages) .......59

3.4.3 Overshoot/Undershoot Pulse Duration (FC-PGA/FC-PGA2

Packages) ..............................................................................................60

3.4.4 Activity Factor (FC-PGA/FC-PGA2 Packages) ......................................60

1.2

2.0

2.1

2.2

Electrical Specifications....................................................................................................15

2.3

2.4

2.5

2.6

2.7

2.8

2.9

2.10

2.11

2.12

3.0

3.1

3.2

3.3

System Bus Signal Simulations........................................................................................52

3.4

Datasheet

Intel

Celeron

Processor up to 1.10 GHz

3.5

4.0

4.1

5.0

Reading Overshoot/Undershoot Specification Tables

(FC-PGA/FC-PGA2 Packages) .............................................................. 61

3.4.6 Determining if a System meets the Overshoot/Undershoot

Specifications (FC-PGA/FC-PGA2 Packages)....................................... 62

Non-AGTL+ Signal Quality Specifications and Measurement Guidelines........... 64

Thermal Specifications........................................................................................ 65

4.1.1 Thermal Diode........................................................................................ 68

S.E.P. Package ................................................................................................... 69

5.1.1 Materials Information.............................................................................. 69

5.1.2

Signal Listing (S.E.P. Package) ............................................................ 70

PPGA Package ................................................................................................... 79

5.2.1 PPGA Package Materials Information.................................................... 79

5.2.2 PPGA Package Signal Listing ................................................................ 81

FC-PGA/FC-PGA2 Packages ............................................................................. 92

5.3.1 FC-PGA Mechanical Specifications ....................................................... 92

5.3.2 Mechanical Specifications (FC-PGA2 Package) .................................... 94

5.3.2.1 Recommended Mechanical Keep-Out Zones

(FC-PGA2 Package) ................................................................. 96

5.3.3 FC-PGA/FC-PGA2 Package Signal List................................................. 97

Processor Markings (PPGA/FC-PGA/FC-PGA2 Packages) ............................. 108

Heatsink Volumetric Keepout Zone Guidelines................................................. 109

Mechanical Specifications for the Boxed Intel

Celeron

Processor ................ 110

6.1.1 Mechanical Specifications for the S.E.P. Package............................... 110

6.1.1.1 Boxed Processor Heatsink Weight.......................................... 112

6.1.1.2 Boxed Processor Retention Mechanism ................................. 112

6.1.2 Mechanical Specifications for the PPGA Package............................... 113

6.1.2.1 Boxed Processor Heatsink Weight.......................................... 114

6.1.3 Mechanical Specifications for the FC-PGA/FC-PGA2 Packages......... 114

6.1.3.1 Boxed Processor Heatsink Weight.......................................... 115

Thermal Specifications...................................................................................... 115

6.2.1 Thermal Requirements for the Boxed Intel

Celeron

Processor........ 115

6.2.1.1 Boxed Processor Cooling Requirements ................................ 115

6.2.1.2 Boxed Processor Thermal Cooling Solution Clip .................... 117

Electrical Requirements for the Boxed Intel

Celeron

Processor ................... 117

6.3.1 Electrical Requirements ....................................................................... 117

Signal Summaries ............................................................................................. 126

3.4.5

Thermal Specifications and Design Considerations......................................................... 65

Mechanical Specifications................................................................................................ 69

5.1

5.2

5.3

5.4

5.5

6.0

6.1

Boxed Processor Specifications..................................................................................... 110

6.2

6.3

7.0

Processor Signal Description ......................................................................................... 120

7.1

Datasheet

Intel

Celeron

Processor up to 1.10 GHz

Figures

Clock Control State Machine...............................................................................16

BCLK to Core Logic Offset ..................................................................................48

BCLK*, PICCLK, and TCK Generic Clock Waveform .........................................49

System Bus Valid Delay Timings ........................................................................49

System Bus Setup and Hold Timings..................................................................49

System Bus Reset and Configuration Timings (For the S.E.P. and

PPGA Packages) ................................................................................................50

System Bus Reset and Configuration Timings (For the

FC-PGA/FC-PGA2 Package) ..............................................................................50

Power-On Reset and Configuration Timings.......................................................51

Test Timings (TAP Connection) ..........................................................................51

Test Reset Timings .............................................................................................51

BCLK, TCK, PICCLK Generic Clock Waveform at the Processor Core Pins .....53

BCLK, TCK, PICCLK Generic Clock Waveform at the Processor

Edge Fingers .......................................................................................................54

Low to High AGTL+ Receiver Ringback Tolerance.............................................56

Non-AGTL+ Overshoot/Undershoot, Settling Limit, and Ringback .....................57

Maximum Acceptable AGTL+ Overshoot/Undershoot Waveform

(FC-PGA/FC-PGA2 Packages) ...........................................................................63

Non-AGTL+ Overshoot/Undershoot, Settling Limit, and Ringback ....................64

Processor Functional Die Layout (CPUID 0686h)...............................................67

Processor Functional Die Layout (up to CPUID 0683h)......................................67

Processor Substrate Dimensions (S.E.P. Package) ...........................................70

Processor Substrate Primary/Secondary Side Dimensions (S.E.P. Package)....70

Package Dimensions (PPGA Package) ..............................................................79

PPGA Package (Pin Side View)..........................................................................81

Package Dimensions (FC-PGA Package)...........................................................92

Package Dimensions (FC-PGA2 Package).........................................................94

Volumetric Keep-Out ...........................................................................................96

Component Keep-Out .........................................................................................96

Package Dimensions (FC-PGA/FC-PGA2 Packages) ........................................97

Top Side Processor Markings (PPGA Package)...............................................108

Top Side Processor Markings (FC-PGA Package) ...........................................108

Top Side Processor Markings (FC-PGA2 Package) .........................................108

Retention Mechanism for the Boxed Intel® Celeron

Processor in the

S.E.P. Package .................................................................................................111

Side View Space Requirements for the Boxed Processor in the S.E.P.

Package ............................................................................................................111

Front View Space Requirements for the Boxed Processor in the S.E.P.

Package ............................................................................................................112

Boxed Intel

Celeron

Processor in the PPGA Package..................................113

Side View Space Requirements for the Boxed Processor in the PPGA

Package ............................................................................................................113

Conceptual Drawing of the Boxed Intel

Celeron

Processor in the

370-Pin Socket (FC-PGA/FC-PGA2 Packages)................................................114

Dimensions of Mechanical Step Feature in Heatsink Base for the

FC-PGA/FC-PGA2 Packages ...........................................................................114

Top View Airspace Requirements for the Boxed Processor in the

S.E.P. Package .................................................................................................115

Datasheet

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