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ADC0832BCJ

Description
IC 2-CH 8-BIT SUCCESSIVE APPROXIMATION ADC, SERIAL ACCESS, CDIP8, 0.300 INCH, HERMETIC SEALED, CERAMIC, DIP-8, Analog to Digital Converter
Categoryconverter   
File Size747KB,33 Pages
ManufacturerNational Semiconductor(TI )
Websitehttp://www.ti.com
Stay tuned Parametric Compare

ADC0832BCJ Overview

IC 2-CH 8-BIT SUCCESSIVE APPROXIMATION ADC, SERIAL ACCESS, CDIP8, 0.300 INCH, HERMETIC SEALED, CERAMIC, DIP-8, Analog to Digital Converter

ADC0832BCJ Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerNational Semiconductor(TI )
package instruction0.300 INCH, HERMETIC SEALED, CERAMIC, DIP-8
Reach Compliance Codeunknown
ECCN codeEAR99
Is SamacsysN
Maximum analog input voltage6.8 V
Minimum analog input voltage-0.3 V
Maximum conversion time800 µs
Converter typeADC, SUCCESSIVE APPROXIMATION
JESD-30 codeR-GDIP-T8
JESD-609 codee0
Maximum linear error (EL)0.2%
Number of analog input channels2
Number of digits8
Number of functions1
Number of terminals8
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Output bit codeBINARY
Output formatSERIAL
Package body materialCERAMIC, GLASS-SEALED
encapsulated codeDIP
Encapsulate equivalent codeDIP8,.3
Package shapeRECTANGULAR
Package formIN-LINE
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply5 V
Certification statusNot Qualified
Maximum seat height5.08 mm
Maximum slew rate6.5 mA
Nominal supply voltage5 V
surface mountNO
technologyBIPOLAR
Temperature levelINDUSTRIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
width7.62 mm
Base Number Matches1

ADC0832BCJ Related Products

ADC0832BCJ ADC0838BCN ADC0834CIWM ADC0832BCN ADC0832BIWM ADC0834MDC ADC0832CCJ ADC0834MWC
Description IC 2-CH 8-BIT SUCCESSIVE APPROXIMATION ADC, SERIAL ACCESS, CDIP8, 0.300 INCH, HERMETIC SEALED, CERAMIC, DIP-8, Analog to Digital Converter IC 8-CH 8-BIT SUCCESSIVE APPROXIMATION ADC, SERIAL ACCESS, PDIP20, 0.300 INCH, PLASTIC, DIP-20, Analog to Digital Converter IC 4-CH 8-BIT SUCCESSIVE APPROXIMATION ADC, SERIAL ACCESS, PDSO14, PLASTIC, SOIC-14, Analog to Digital Converter IC 2-CH 8-BIT SUCCESSIVE APPROXIMATION ADC, SERIAL ACCESS, PDIP8, 0.300 INCH, PLASTIC, DIP-8, Analog to Digital Converter IC 2-CH 8-BIT SUCCESSIVE APPROXIMATION ADC, SERIAL ACCESS, PDSO14, SO-14, Analog to Digital Converter IC 4-CH 8-BIT SUCCESSIVE APPROXIMATION ADC, SERIAL ACCESS, UUC, DIE, Analog to Digital Converter IC 2-CH 8-BIT SUCCESSIVE APPROXIMATION ADC, SERIAL ACCESS, CDIP8, 0.300 INCH, HERMETIC SEALED, CERAMIC, DIP-8, Analog to Digital Converter IC 4-CH 8-BIT SUCCESSIVE APPROXIMATION ADC, SERIAL ACCESS, UUC, WAFER, Analog to Digital Converter
package instruction 0.300 INCH, HERMETIC SEALED, CERAMIC, DIP-8 0.300 INCH, PLASTIC, DIP-20 PLASTIC, SOIC-14 0.300 INCH, PLASTIC, DIP-8 SO-14 DIE, DIE OR CHIP DIP, DIP8,.3 DIE, DIE OR CHIP
Reach Compliance Code unknown unknown unknown unknown unknown unknown unknown unknown
ECCN code EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
Maximum analog input voltage 6.8 V 5 V 5 V 5 V 5 V 5.05 V 6.8 V 5.05 V
Maximum conversion time 800 µs 32 µs 32 µs 32 µs 32 µs 32 µs 800 µs 32 µs
Converter type ADC, SUCCESSIVE APPROXIMATION ADC, SUCCESSIVE APPROXIMATION ADC, SUCCESSIVE APPROXIMATION ADC, SUCCESSIVE APPROXIMATION ADC, SUCCESSIVE APPROXIMATION ADC, SUCCESSIVE APPROXIMATION ADC, SUCCESSIVE APPROXIMATION ADC, SUCCESSIVE APPROXIMATION
JESD-30 code R-GDIP-T8 R-PDIP-T20 R-PDSO-G14 R-PDIP-T8 R-PDSO-G14 X-XUUC-N R-GDIP-T8 X-XUUC-N
Number of analog input channels 2 8 4 2 2 4 2 4
Number of digits 8 8 8 8 8 8 8 8
Number of functions 1 1 1 1 1 1 1 1
Maximum operating temperature 85 °C 70 °C 85 °C 70 °C 85 °C 70 °C 85 °C 70 °C
Output bit code BINARY BINARY BINARY BINARY BINARY BINARY BINARY BINARY
Output format SERIAL SERIAL SERIAL SERIAL SERIAL SERIAL SERIAL SERIAL
Package body material CERAMIC, GLASS-SEALED PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY UNSPECIFIED CERAMIC, GLASS-SEALED UNSPECIFIED
encapsulated code DIP DIP SOP DIP SOP DIE DIP DIE
Encapsulate equivalent code DIP8,.3 DIP20,.3 SOP14,.4 DIP8,.3 SOP14,.4 DIE OR CHIP DIP8,.3 DIE OR CHIP
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR UNSPECIFIED RECTANGULAR UNSPECIFIED
Package form IN-LINE IN-LINE SMALL OUTLINE IN-LINE SMALL OUTLINE UNCASED CHIP IN-LINE UNCASED CHIP
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Nominal supply voltage 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
surface mount NO NO YES NO YES YES NO YES
Temperature level INDUSTRIAL COMMERCIAL INDUSTRIAL COMMERCIAL INDUSTRIAL COMMERCIAL INDUSTRIAL COMMERCIAL
Terminal form THROUGH-HOLE THROUGH-HOLE GULL WING THROUGH-HOLE GULL WING NO LEAD THROUGH-HOLE NO LEAD
Terminal location DUAL DUAL DUAL DUAL DUAL UPPER DUAL UPPER
Base Number Matches 1 1 1 1 1 1 1 1
Is it Rohs certified? incompatible incompatible incompatible incompatible incompatible - incompatible -
Maker National Semiconductor(TI ) National Semiconductor(TI ) National Semiconductor(TI ) National Semiconductor(TI ) National Semiconductor(TI ) National Semiconductor(TI ) - -
Is Samacsys N N N N N N - -
JESD-609 code e0 e0 e0 e0 e0 - e0 -
Maximum linear error (EL) 0.2% 0.2% - 0.2% 0.2% - 0.4% -
Number of terminals 8 20 14 8 14 - 8 -
Peak Reflow Temperature (Celsius) NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED - NOT SPECIFIED -
power supply 5 V - 5 V 5 V 5 V 5 V 5 V 5 V
Maximum seat height 5.08 mm 5.08 mm 2.65 mm 5.08 mm 2.65 mm - 5.08 mm -
Maximum slew rate 6.5 mA 2.5 mA 2.5 mA 6.5 mA 6.5 mA - 6.5 mA -
technology BIPOLAR BIPOLAR CMOS BIPOLAR BIPOLAR - BIPOLAR -
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) - Tin/Lead (Sn/Pb) -
Terminal pitch 2.54 mm 2.54 mm 1.27 mm 2.54 mm 1.27 mm - 2.54 mm -
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED - NOT SPECIFIED -
width 7.62 mm 7.62 mm 7.5 mm 7.62 mm 7.5 mm - 7.62 mm -
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