IC 2-CH 8-BIT SUCCESSIVE APPROXIMATION ADC, SERIAL ACCESS, CDIP8, 0.300 INCH, HERMETIC SEALED, CERAMIC, DIP-8, Analog to Digital Converter
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | National Semiconductor(TI ) |
| package instruction | 0.300 INCH, HERMETIC SEALED, CERAMIC, DIP-8 |
| Reach Compliance Code | unknown |
| ECCN code | EAR99 |
| Is Samacsys | N |
| Maximum analog input voltage | 6.8 V |
| Minimum analog input voltage | -0.3 V |
| Maximum conversion time | 800 µs |
| Converter type | ADC, SUCCESSIVE APPROXIMATION |
| JESD-30 code | R-GDIP-T8 |
| JESD-609 code | e0 |
| Maximum linear error (EL) | 0.2% |
| Number of analog input channels | 2 |
| Number of digits | 8 |
| Number of functions | 1 |
| Number of terminals | 8 |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | -40 °C |
| Output bit code | BINARY |
| Output format | SERIAL |
| Package body material | CERAMIC, GLASS-SEALED |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP8,.3 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| power supply | 5 V |
| Certification status | Not Qualified |
| Maximum seat height | 5.08 mm |
| Maximum slew rate | 6.5 mA |
| Nominal supply voltage | 5 V |
| surface mount | NO |
| technology | BIPOLAR |
| Temperature level | INDUSTRIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 7.62 mm |
| Base Number Matches | 1 |
| ADC0832BCJ | ADC0838BCN | ADC0834CIWM | ADC0832BCN | ADC0832BIWM | ADC0834MDC | ADC0832CCJ | ADC0834MWC | |
|---|---|---|---|---|---|---|---|---|
| Description | IC 2-CH 8-BIT SUCCESSIVE APPROXIMATION ADC, SERIAL ACCESS, CDIP8, 0.300 INCH, HERMETIC SEALED, CERAMIC, DIP-8, Analog to Digital Converter | IC 8-CH 8-BIT SUCCESSIVE APPROXIMATION ADC, SERIAL ACCESS, PDIP20, 0.300 INCH, PLASTIC, DIP-20, Analog to Digital Converter | IC 4-CH 8-BIT SUCCESSIVE APPROXIMATION ADC, SERIAL ACCESS, PDSO14, PLASTIC, SOIC-14, Analog to Digital Converter | IC 2-CH 8-BIT SUCCESSIVE APPROXIMATION ADC, SERIAL ACCESS, PDIP8, 0.300 INCH, PLASTIC, DIP-8, Analog to Digital Converter | IC 2-CH 8-BIT SUCCESSIVE APPROXIMATION ADC, SERIAL ACCESS, PDSO14, SO-14, Analog to Digital Converter | IC 4-CH 8-BIT SUCCESSIVE APPROXIMATION ADC, SERIAL ACCESS, UUC, DIE, Analog to Digital Converter | IC 2-CH 8-BIT SUCCESSIVE APPROXIMATION ADC, SERIAL ACCESS, CDIP8, 0.300 INCH, HERMETIC SEALED, CERAMIC, DIP-8, Analog to Digital Converter | IC 4-CH 8-BIT SUCCESSIVE APPROXIMATION ADC, SERIAL ACCESS, UUC, WAFER, Analog to Digital Converter |
| package instruction | 0.300 INCH, HERMETIC SEALED, CERAMIC, DIP-8 | 0.300 INCH, PLASTIC, DIP-20 | PLASTIC, SOIC-14 | 0.300 INCH, PLASTIC, DIP-8 | SO-14 | DIE, DIE OR CHIP | DIP, DIP8,.3 | DIE, DIE OR CHIP |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| ECCN code | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| Maximum analog input voltage | 6.8 V | 5 V | 5 V | 5 V | 5 V | 5.05 V | 6.8 V | 5.05 V |
| Maximum conversion time | 800 µs | 32 µs | 32 µs | 32 µs | 32 µs | 32 µs | 800 µs | 32 µs |
| Converter type | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION |
| JESD-30 code | R-GDIP-T8 | R-PDIP-T20 | R-PDSO-G14 | R-PDIP-T8 | R-PDSO-G14 | X-XUUC-N | R-GDIP-T8 | X-XUUC-N |
| Number of analog input channels | 2 | 8 | 4 | 2 | 2 | 4 | 2 | 4 |
| Number of digits | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| Number of functions | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| Maximum operating temperature | 85 °C | 70 °C | 85 °C | 70 °C | 85 °C | 70 °C | 85 °C | 70 °C |
| Output bit code | BINARY | BINARY | BINARY | BINARY | BINARY | BINARY | BINARY | BINARY |
| Output format | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL |
| Package body material | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | UNSPECIFIED | CERAMIC, GLASS-SEALED | UNSPECIFIED |
| encapsulated code | DIP | DIP | SOP | DIP | SOP | DIE | DIP | DIE |
| Encapsulate equivalent code | DIP8,.3 | DIP20,.3 | SOP14,.4 | DIP8,.3 | SOP14,.4 | DIE OR CHIP | DIP8,.3 | DIE OR CHIP |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | UNSPECIFIED | RECTANGULAR | UNSPECIFIED |
| Package form | IN-LINE | IN-LINE | SMALL OUTLINE | IN-LINE | SMALL OUTLINE | UNCASED CHIP | IN-LINE | UNCASED CHIP |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Nominal supply voltage | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | NO | NO | YES | NO | YES | YES | NO | YES |
| Temperature level | INDUSTRIAL | COMMERCIAL | INDUSTRIAL | COMMERCIAL | INDUSTRIAL | COMMERCIAL | INDUSTRIAL | COMMERCIAL |
| Terminal form | THROUGH-HOLE | THROUGH-HOLE | GULL WING | THROUGH-HOLE | GULL WING | NO LEAD | THROUGH-HOLE | NO LEAD |
| Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL | UPPER | DUAL | UPPER |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | - | incompatible | - |
| Maker | National Semiconductor(TI ) | National Semiconductor(TI ) | National Semiconductor(TI ) | National Semiconductor(TI ) | National Semiconductor(TI ) | National Semiconductor(TI ) | - | - |
| Is Samacsys | N | N | N | N | N | N | - | - |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 | - | e0 | - |
| Maximum linear error (EL) | 0.2% | 0.2% | - | 0.2% | 0.2% | - | 0.4% | - |
| Number of terminals | 8 | 20 | 14 | 8 | 14 | - | 8 | - |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED | - |
| power supply | 5 V | - | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| Maximum seat height | 5.08 mm | 5.08 mm | 2.65 mm | 5.08 mm | 2.65 mm | - | 5.08 mm | - |
| Maximum slew rate | 6.5 mA | 2.5 mA | 2.5 mA | 6.5 mA | 6.5 mA | - | 6.5 mA | - |
| technology | BIPOLAR | BIPOLAR | CMOS | BIPOLAR | BIPOLAR | - | BIPOLAR | - |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | - |
| Terminal pitch | 2.54 mm | 2.54 mm | 1.27 mm | 2.54 mm | 1.27 mm | - | 2.54 mm | - |
| Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED | - |
| width | 7.62 mm | 7.62 mm | 7.5 mm | 7.62 mm | 7.5 mm | - | 7.62 mm | - |