BGX13P Blue Gecko
Bluetooth
®
Module
Data Sheet
The BGX13P Blue Gecko
Bluetooth
®
Module family of serial replacement modules elim-
inates Bluetooth firmware development complexity with a serial interface that can oper-
ate as a raw data stream or control the device through a abstracted command API. The
BGX13P can facilitate a device-to-device cable replacement link or communicate with
mobile devices through the Xpress Bluetooth mobile library. The device integrates a
Bluetooth 5 compliant stack to future-proof applications as Bluetooth 5 adoption increa-
ses.
The device is targeted for applications where ultra-small size, reliable high-performance
RF, low-power consumption, and fast time-to-market are key requirements. At 12.9 ×
15.0 × 2.0 mm (W × L × H) the BGX13P module fits applications where size is a con-
straint. BGX13P also integrates a high-performance, ultra-robust antenna, which re-
quires minimal PCB, plastic, and metal clearance. The total PCB area required by
BGX13P is only 51 mm
2
. The BGX13P has Bluetooth, CE, full FCC, Japanese and
South Korean certifications.
BGX13P modules can be used in a wide variety of applications:
• Health, sports, and wellness devices
• Industrial, home, and building automation
• Smart phone, tablet, and PC accessories
KEY FEATURES
• Bluetooth 5 low energy compliant
• Serial interface with hardware flow control
• GPIO control through command API
• Integrated antenna
• TX power up to 8 dBm
• Encrypted bonding and connectivity
• Integrated DC-DC Converter
• Onboard Bluetooth stack
• Centralized OTA through mobile app
library
Serial interface
RX/TX and flow
control
Bluetooth
controller
Bluetooth 5
compliant
stack
Timers
OTA
manager
Radio
Radio
transceiver
Chip
antenna
Matching
network
Command
parser
Raw data
stream
buffers
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This information applies to a product under development. Its characteristics and specifications are subject to change without notice.
GPIO
control
Preliminary Rev. 0.5
BGX13P Blue Gecko
Bluetooth
®
Module Data Sheet
Ordering Information
1. Ordering Information
Table 1.1. Ordering Information
Frequency Band
Ordering Code
BGX13P22GA-V21R
BGX13P22GA-V21
Protocol Stack
Bluetooth Low
Energy
Bluetooth Low
Energy
@ Max TX Power
2.4 GHz @ 8 dBm
2.4 GHz @ 8 dBm
Antenna
Built-in
Built-in
GPIO
8
8
Packaging
Reel
Tray
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Preliminary Rev. 0.5 | 2
Table of Contents
1. Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
2. Electrical Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2.1 Electrical Characteristics . . . . . .
2.1.1 Absolute Maximum Ratings . . . .
2.1.2 Operating Conditions . . . . . .
2.1.3 Power Consumption. . . . . . .
2.1.4 2.4 GHz RF Transceiver Characteristics
2.1.5 Non-Volatile Configuration Storage. .
2.1.6 General-Purpose I/O (GPIO) . . . .
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5
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3. Typical Connection Diagrams
4. Layout Guidelines
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.10
3.1 UART Interface with Embedded Host .
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.11
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4.1 Module Placement and Application PCB Layout Guidelines .
4.2 Effect of Plastic and Metal Materials .
4.4 2D Radiation Pattern Plots .
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4.3 Locating the Module Close to Human Body .
5. Hardware Design Guidelines
5.1 Power Supply Requirements .
5.2 Reset Functions
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5.3 Debug and Firmware Updates .
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.15
.15
.15
6. Pin Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
6.1 BGX13P Device Pinout .
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.16
7. Functional overview . . . . . . . . . . . . . . . . . . . . . . . . . . . .
7.1 Introduction .
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7.2 Communication Use Cases .
7.3 Embedded Interface .
7.5 Command API .
7.6 GPIO Control
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18
.18
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.19
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.19
7.4 Command Mode and Streaming Mode .
7.7 Device Configuration .
7.8 Security Features .
7.9 OTA
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7.10 Direct Test Mode Support .
8. Package Specifications
8.2 BGX13P Dimensions .
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.20
.21
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8.1 BGX13P Package Marking .
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Preliminary Rev. 0.5 | 3
8.3 BGX13P Module Footprint .
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.21
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8.4 BGX13P Recommended PCB Land Pattern .
9. Soldering Recommendations
9.1 Soldering Recommendations .
. . . . . . . . . . . . . . . . . . . . . . . . 23
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.23
10. Certifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
10.1 Bluetooth .
10.2 CE
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10.3 FCC .
10.5 Japan
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.24
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.27
.27
10.4 ISED Canada .
10.6 KC (South-Korea)
11. Revision History. . . . . . . . . . . . . . . . . . . . . . . . . . . . .
28
silabs.com
| Building a more connected world.
Preliminary Rev. 0.5 | 4
BGX13P Blue Gecko
Bluetooth
®
Module Data Sheet
Electrical Specifications
2. Electrical Specifications
2.1 Electrical Characteristics
All electrical parameters in all tables are specified under the following conditions, unless stated otherwise:
• Typical values are based on T
AMB
= 25°C and V
DD
= 3.3 V, by production test and/or technology characterization.
• Radio performance numbers are measured in conducted mode, based on Silicon Laboratories reference designs using output pow-
er-specific external RF impedance-matching networks for interfacing to a 50 Ω antenna.
• Minimum and maximum values represent the worst conditions across supply voltage, process variation, and operating temperature,
unless stated otherwise.
The BGX13P module has only one external supply pin (VDD). There are several internal supply rails mentioned in the electrical specifi-
cations, whose connections vary based on transmit power configuration. Refer to for the relationship between the module's external
VDD pin and internal voltage supply rails.
Refer to for more details about operational supply and temperature limits.
2.1.1 Absolute Maximum Ratings
Stresses above those listed below may cause permanent damage to the device. This is a stress rating only, and functional operation of
the devices at those or any other conditions above those indicated in the operation listings of this specification is not implied. Exposure
to maximum rating conditions for extended periods may affect device reliability. For more information on the available quality and relia-
bility data, see the Quality and Reliability Monitor Report at
http://www.silabs.com/support/quality/pages/default.aspx.
Table 2.1. Absolute Maximum Ratings
Parameter
Storage temperature range
Voltage on any supply pin
Voltage ramp rate on any
supply pin
DC voltage on any GPIO pin
Maximum RF level at input
Symbol
T
STG
V
DDMAX
V
DDRAMPMAX
V
DIGPIN
P
RFMAX2G4
Source
Sink
Sink
Source
Current for all I/O pins
I
IOALLMAX
Sink
Source
Junction temperature
T
J
Test Condition
Min
-50
-0.3
—
-0.3
—
—
—
—
—
—
—
-40
Typ
—
—
—
—
—
—
—
—
—
—
—
—
Max
150
3.8
1
VDD+0.3
10
200
200
50
50
200
200
105
Unit
°C
V
V / µs
V
dBm
mA
mA
mA
mA
mA
mA
°C
Total current into supply pins I
VDDMAX
Total current into VSS
ground lines
Current per I/O pin
I
VSSMAX
I
IOMAX
2.1.2 Operating Conditions
The following subsections define the operating conditions for the module.
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Preliminary Rev. 0.5 | 5
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