4 outputs at 50MHz, 2 outputs selectable at 25MHz or
125MHz, 1 output selectable at 25MHz or 100MHz.
2 SDRAM selectable frequencies of 66.6, 75, 83.3,
100MHz (Double Drive Strength).
All non SDRAM outputs can be disabled (tri-state)
Spread spectrum technology selectable for EMI
reduction from
±0.5%, ±0.75%
for SDRAM and 100MHz
output.
Zero PPM synthesis error in all clocks.
Ideal for Network switches.
3.3V operation.
Available in 24-Pin 150mil SSOP
.
Note:
SDRAMx2: Double Drive strength.
T
: Tri-Level input
^
: Internal pull-up
resistor. *: Bi-directional pin (input value is latched upon power-up).
PLL650-02
DESCRIPTIONS
The PLL 650-02 is a low cost, low jitter, and high
performance clock synthesizer. With PhaseLink’s
proprietary analog Phase Locked Loop techniques, the chip
accepts 25 MHz crystal, and produces multiple output
clocks for networking chips, PCI devices, SDRAM, and
ASICs, with double drive strength for its SDRAM outputs.
FREQUENCY TABLE
FS1
0
0
1
1
FS0
0
1
0
1
SDRAM
100MHz
SST
75MHz
S ST
83.3MHz
SST
66.6MHz
SST
FS3
0
M
1
Pin 13, 15
Disable
125MHz
25MHz
FS2
0
M
1
Pin 22
25MHz
Disable
100MHz
SST
FS(2:3): Tri-level inputs.
SST: SST modulation applied (see selection table)
BLOCK DIAGRAM
4
XIN
XOUT
XTAL
OSC
50MHz
(can be disabled)
25MHz/125MHz
(can be disabled)
SDRAM (66.6, 75, 83.3, 100MHz)
2
Control
Logic
FS (0:3)
2
1
25MHz/100MHz
(can be disabled)
47745 Fremont Blvd., Fremont, California 94538 Tel (510) 492-0990 Fax (510) 492-0991
www.phaselink.com
Rev 09/03/04 Page 1
PLL650-02
Low EMI Network LAN Clock
PIN DESCRIPTIONS
Name
XIN
XOUT/50MHz_OE
50MHz/FS(0:2)
50MHz/SS0
FS3
25MHz/125MHz
SDRAMx2
25MHz/100MHz
VDD
GND
Number
2
3
6,8,9,11
10
13,15
18,20
22
1,5,12,
16,17,23,24
4,7,14,19,21
Type
I
B
B
I
O
O
O
P
P
Description
25MHz fundamental crystal input (20pF C
L
parallel resonant). C
L
have been
integrated into the chip. No external C
L
capacitor is required.
Crystal connection pin. At power-up, this pin latches 50MHz_OE (output
enable selector for all 50MHz outputs. Disabled when 50MHz_OE is logical
zero. Has 120kΩ internal pull up resistor.
Bi-directional pins. 50MHz outputs. These pins latch FS(0:2) and SS0 at
power-up. 60kΩ internal pull up resistors on pins 6 and 8.
Tri-level input pin. FS3 input put.
25MHz (reference) or 125MHz outputs. Can be disabled with FS3 = 1.
SDRAM outputs with double drive strength determined by FS(0:1) value.
25MHz (reference) or 100MHz output. Can be disabled with FS2 = M.
3.3V power supply.
Ground.
SPREAD SPECTRUM SELECTION TABLE
SS0
0
M
1
SST modulation
±0.75%
center
OFF
±0.5%
center
FUNCTIONAL DESCRIPTION
Selectable spread spectrum and output frequencies
The PLL650-02 provides selectable spread spectrum modulation and selectable output frequencies. Selection is made by
connecting specific pins to a logical “zero” or “one”, or by leaving them not connected (tri-level inputs or internal pull-up)
according to the frequency and spread spectrum selection tables shown on pages 1 and 2 respectively.
In order to reduce pin usage, the PLL650-02 uses tri-level input pins. These pins allow 3 levels for input selection: namely, 0
(Connect to GND), 1 (Connect to VDD), M (Do not connect). Thus, unlike the two-level selection pins, the tri-level input pins are
in the “M” (mid) state when not connected. In order to connect a tri-level pin to a logical “zero”, the pin must be connected to
GND. Likewise, in order to connect to a logical “one” the pin must be connected to VDD.
Pin 3 (XOUT/50MHz_OE) is a bi-directional pin used to disable the 50MHz output pins. Pin 6 (FS0) and pin 8 (FS1) are bi-
directional pins used to select the SDRAM output frequency upon power-up. Pin 9 (FS2) and pin 11 (FS3) are tri-level bi-
directional pins used to select the output frequency of pins 13, 15 and 22, as shown in the frequency table on page 1. After the
input signals have been latched, pins 6, 8, 9, and 11 serve as 50 MHz frequency outputs.
47745 Fremont Blvd., Fremont, California 94538 Tel (510) 492-0990 Fax (510) 492-0991
www.phaselink.com
Rev 09/03/04 Page 2
PLL650-02
Low EMI Network LAN Clock
Connecting a bi-directional pin
A bi-directional pin serves as input upon power-up, and as output as soon as the inputs have been latched. The value of the
input is latched-in upon power-up. Depending on the pin (see pin description), the input can be tri-level or a standard two-level.
Unlike unidirectional pins, bi-directional pins cannot be connected directly to GND or VDD in order to set the input to "0" or "1",
since the pin also needs to serve as output. In the case of two level input pins, an internal pull-up resistor is present. This allows
a default value to be set when no external pull down resistor is connected between the pin and GND (by definition, a tri-level
input has a the default value of "M" (mid) if it is not connected). In order to connect a bi-directional pin to a non-default value, the
input must be connected to GND or VDD through an external pull-down/pull-up resistor.
Note:
when the output load presents a
low impedance in comparison to the internal pull-up resistor, the internal pull-up resistor may not be sufficient to pull the input up
to a logical “one”, and an external pull-up resistor may be required.
For bi-directional inputs, the external loading resistor between the pin and GND has to be sufficiently small (compared to the
internal pull-up resistor) so that the pin voltage be pulled below 0.8V (logical “zero”). In order to avoid loading effects when the
pin serves as output, the value of the external pull-down resistor should however be kept as large as possible. In general, it is
recommended to use an external resistor of around one sixth to one quarter of the internal pull-up resistor (see Application
Diagram).
Note:
when the output is used to drive a load presenting an small resistance between the output pin and VDD, this
resistance is in essence connected in parallel to the internal pull-up resistor. In such a case, the external pull-down resistor may
have to be dimensioned smaller to guarantee that the pin voltage will be low enough achieve the desired logical “zero”. This is
particularly true when driving 74FXX TTL components.
APPLICATION DIAGRAM
Internal to chip
VDD
External Circuitry
R
up
Power Up
Reset
R
RB
Output
EN
Bi-directional pin
Clock Load
Latched
Input
Latch
R
UP
/
4
Jumper options
NOTE:
Rup=120kΩ for 50MHz/OE (Pin3); Rup=60k
Ω
for FS(0:1). R starts from 1 to 0 while RB starts from 0 to 1.
47745 Fremont Blvd., Fremont, California 94538 Tel (510) 492-0990 Fax (510) 492-0991
www.phaselink.com
Rev 09/03/04 Page 3
PLL650-02
Low EMI Network LAN Clock
Electrical Specifications
1. Absolute Maximum Ratings
PARAMETERS
Supply Voltage
Input Voltage, dc
Output Voltage, dc
Storage Temperature
Ambient Operating Temperature*
Junction Temperature
Lead Temperature (soldering, 10s)
ESD Protection, Human Body Model
SYMBOL
V
DD
V
I
V
O
T
S
T
A
T
J
MIN.
-0.5
-0.5
-65
-40
MAX.
4.6
V
DD
+0.5
V
DD
+0.5
150
85
125
260
2
UNITS
V
V
V
°C
°C
°C
°C
kV
Exposure of the device under conditions beyond the limits specified by Maximum Ratings for extended periods may cause permanent damage to the device
and affect product reliability. These conditions represent a stress rating only, and functional operations of the device at these or any other conditions above
the operational limits noted in this specification is not implied.
*
Note:
Operating Temperature is guaranteed by design for all parts (COMMERCIAL and INDUSTRIAL), but tested for COMMERCIAL grade only.
2. AC Specifications
PARAMETERS
Input Frequency
Output Rise Time
Output Fall Time
Duty Cycle*
Max. Absolute Jitter
Max. Jitter, cycle to cycle
0.8V to 2.0V with no load
2.0V to 0.8V with no load
At V
DD
/2
Short term
45
50
±150
80
CONDITIONS
MIN.
10
TYP.
25
MAX.
27
1.5
1.5
55
UNITS
MHz
ns
ns
%
ps
ps
* : in case SDRAM output is selected to be 83.3MHz, the duty cycle of output pin 22 will be 40%-60% if its output frequency is selected to be 100MHz
(FS2=1). In all other situations, pin 22 will also have a 50%-50% typical duty cycle.
47745 Fremont Blvd., Fremont, California 94538 Tel (510) 492-0990 Fax (510) 492-0991
www.phaselink.com
Rev 09/03/04 Page 4
PLL650-02
Low EMI Network LAN Clock
3. DC Specifications
PARAMETERS
Operating Voltage
Input High Voltage
Input Low Voltage
Input High Voltage
Input Low Voltage
Input High Voltage
Input Low Voltage
Output High Voltage
Output Low Voltage
Output High Voltage At
CMOS Level
Operating Supply Current
Short-circuit Current
Nominal output current*
Nominal output current*
Internal pull-up resistor
Internal pull-up resistor
SYMBOL
V
DD
V
IH
V
IL
V
IH
V
IL
V
IH
V
IL
V
OH
V
OL
V
OH
I
DD
I
S
I
out
I
out
R
up
R
up
CONDITIONS
MIN.
2.97
TYP.
V
DD
/2
V
DD
/2
MAX.
3.63
V
DD
/2 - 1
0.5
UNITS
V
V
V
V
V
V
V
V
V
V
For all Tri-level input
For all Tri-level input
For all normal input
For all normal input
I
OH
= -25mA
I
OL
= 25mA
I
OH
= -8mA
No Load
V
DD
-0.5
2
0.8
2.4
0.4
V
DD
-0.4
35
±100
mA
mA
mA
mA
kΩ
kΩ
CMOS output level
TTL output level
Pins 6,8
Pin 3
35
20
40
25
60
120
*: SDRAM output strengths are doubled (i.e. min. CMOS level is 70mA, typ. CMOS level is 80mA)
47745 Fremont Blvd., Fremont, California 94538 Tel (510) 492-0990 Fax (510) 492-0991
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