RJ(ARJ2)
SMD RELAYS
WITH
8GHz
CAPABILITIES
RJ-RELAYS
TYPICAL
APPLICATIONS
Measurement equipment market
Attenuator circuits, spectrum analyzer,
oscilloscope, mobile equipment, tester
Mobile telecommunication market
IMT2000, microwave communication
Medical instruments market
FEATURES
14.0
.551
9.00
.354
8.20
.323
14.0
.551
9.00
.354
8.20
.323
• Excellent high frequency characteris-
tics (50Ω, at 5GHz)
V.S.W.R.: Max. 1.25
Insertion loss: Max. 0.5dB
Isolation: Min. 35dB
(Between open contacts)
Min. 30dB
(Between contact sets)
• Surface mount terminal
Surface mount terminals are now stan-
dard so there is much less work in design-
ing PC boards.
• Small size
Size: 14.00 (L)×9.00 (W)×8.20 (H) mm
.551 (L)×.354 (W)×.323 (H) inch
SPECIFICATIONS
Contact
Arrangement
Contact material
Initial contact resistance
Contact rating
Rating
Contact carrying power
Max. switching voltage
Max. switching current
V.S.W.R.
Insertion loss
(without D.U.T. board’s loss)
Between
open contacts
Isolation
Between
contact sets
Input power
Expected life
(min. opera-
tions)
Mechanical (at 180 cpm)
1W, at 5GHz,
Electrical V.S.W.R.
&
1.25
(at
10mA 10V DC
20cpm)
(resistive load)
2 Form C
Gold alloy
Max. 150mΩ
1W (at 5 GHz, Impedance
50
Ω,
V.S.W.R.
&1.25)
10mA 10V DC (resistive load)
1W (at 5 GHz, Impedance
50
Ω,
V.S.W.R.
&
1.25)
30 V DC
0.3 A DC
Max. 1.25
Max. 0.5dB
Min. 35dB
Min. 30dB
Characteristics
Initial insulation resistance*
1
Min. 500 MΩ (at 500 V DC)
Between open contacts
500 Vrms
Initial breakdown
Between contact sets
500 Vrms
voltage*
2
Between contact and coil
500 Vrms
3
(at 20°C)
Operate time [Set time]*
Max. 5ms
3
Release time (without diode)[Reset time]*
Max. 5ms
(at 20°C)
Temperature rise (at 20°C)*
4
Max. 50°C
5
Functional*
Min. 500 m/s
2
Shock resistance
Destructive*
6
Min. 1,000 m/s
2
10 to 55 Hz at double
Functional*
7
amplitude of 3 mm
Vibration resistance
10 to 55 Hz at double
Destructive
amplitude of 5 mm
Conditions for operation,
–30°C to 70°C
Ambient temp.
transport and storage*
8
–22°F to 158°F
(Not freezing and condens-
Humidity
5 to 85% R.H.
ing at low temperature)
Unit weight
Approx. 3 g
.11 oz
High frequency
characteristics
(Initial)
(~5GHz,
Impedance
50Ω)
1W (at 5GHz, impedance 50Ω,
V.S.W.R.
&1.25,
at 20°C)
10
7
10
5
10
6
Remarks
* Specifications will vary with foreign standards certification ratings.
*
1
Measurement at same location as "Initial breakdown voltage" section.
*
2
Detection current: 10mA
*
3
Nominal operating voltage applied to the coil, excluding contact bounce time.
*
4
By resistive method, nominal voltage applied to the coil, 5GHz, V.S.W.R.
&
1.25
*
5
Half-wave pulse of sine wave: 6ms, detection time: 10µs.
*
6
Pulse of sine wave: 11ms.
*
7
Detection time: 10µs
*
8
Refer to 6. Conditions for operation, transport and storage mentioned in NOTES
Coil (at 20°C,
68°F)
Single side stable
2 coil latching
Nominal operating power
200 mW
150 mW
ORDERING INFORMATION
Ex. ARJ
Contact arrangement Operating function
2: 2 Form C
2
Terminal shape
Coil voltage (DC)
03 : 3V
4H: 4.5V
12 : 12V
24 : 24V
Packing style
Nil: Carton packing
X: Tape end reel packing
(picked from 1/2/3-pin side)
Z: Tape and reel packing (picked
from 6/7/8-pin side)
Note: Tape and reel packing symbol “-Z” is not marked on the relay. “X” type tape and reel packing (picked from 1/2/3-pin side) is
also available. Suffix “X” instead of “Z”.
0: Single side stable Nil: Standard PC board terminal
2: 2 coil latching
A: Surface-mount terminal
2
RJ(ARJ2)
TYPES AND COIL DATA (at 20°C
68°F)
1. Standard PC board terminal
• Packing of standard PC board terminal: 50 pcs. in an inner package (carton); 500 pcs. in an outer package
Operating
function
Coil Rating,
V DC
3
4.5
12
24
Part No.
Pick-up voltage, Drop-out voltage, Nominal operating
Coil resistance,
V DC (max.)
V DC (min.)
current, mA
Standard PC
Ω
(±10%)
(initial)
(initial)
(±10%)
board terminal
ARJ2003
2.25
0.3
66.6
45
ARJ204H
3.375
0.45
44.4
101.2
ARJ2012
ARJ2024
Part No.
Standard PC
board terminal
ARJ2203
ARJ224H
ARJ2212
ARJ2224
9
18
1.2
2.4
16.6
8.3
720
2,880
Nominal
operating
power, mW
200
200
200
200
Max. allowable
voltage, V DC
3.3
4.95
13.2
26.4
Single side
stable
Operating
function
Coil Rating,
V DC
3
4.5
12
24
Set voltage,
V DC (max.)
(initial)
2.25
3.375
9
18
Reset voltage,
V DC (min.)
(initial)
2.25
3.375
9
18
Nominal operating
Coil resistance,
current, mA
Ω
(±10%)
(±10%)
50
33.3
12.5
6.3
60
135
960
3,840
Nominal
operating
power, mW
150
150
150
150
Max. allowable
voltage, V DC
3.3
4.95
13.2
26.4
2 coil
latching
2. Surface-mount terminal
• Packing of surface-mount terminal: 50 pcs. in an inner package (carton); 500 pcs. in an outer package
• Packing of surface-mount terminal: 500 pcs. in an inner package (tape and reel); 500 pcs. in an outer package
Operating
function
Coil Rating,
V DC
3
4.5
12
24
Part No.
Pick-up
Drop-out
Nominal operating
Coil
Nominal
Max. allowable
current, mA
resistance, operating
Carton
Tape and reel voltage, V DC voltage, V DC
voltage, V DC
(max.) (initial) (min.) (initial)
(±10%)
Ω
(±10%) power, mW
packing
packing
ARJ20A03 ARJ20A03Z
2.25
0.3
66.6
45
200
3.3
ARJ20A4H ARJ20A4HZ
3.375
0.45
44.4
101.2
200
4.95
ARJ20A12 ARJ20A12Z
9
1.2
16.6
720
200
13.2
ARJ20A24 ARJ20A24Z
18
2.4
8.3
2,880
200
26.4
Part No.
Set voltage, Reset voltage, Nominal operating
Coil
Nominal
Max. allowable
current, mA
resistance, operating
Carton
Tape and reel V DC (max.) V DC (min.)
voltage, V DC
(initial)
(initial)
(±10%)
Ω
(±10%) power, mW
packing
packing
ARJ22A03 ARJ22A03Z
2.25
2.25
50
60
150
3.3
ARJ22A4H ARJ22A4HZ
3.375
3.375
33.3
135
150
4.95
ARJ22A12
ARJ22A24
ARJ22A12Z
ARJ22A24Z
9
18
9
18
12.5
6.3
960
3,840
150
150
13.2
26.4
Single side
stable
Operating
function
Coil Rating,
V DC
3
4.5
12
24
2 coil
latching
REFERENCE DATA
1. High frequency characteristics
Sample: ARJ20A12
Measuring method: Measured with MEW PC board by HP network analyzer (HP8510C).
• V.S.W.R. characteristics
2.0
1.9
Insertion loss, dB
1.8
V.S.W.R.
1.7
1.6
1.5
1.4
1.3
1.2
1.1
1.0
45MHz
5GHz
Frequency
8GHz
3.0
45MHz
5GHz
Frequency
8GHz
0.5
Isolation, dB
1.0
1.5
2.0
60
2.5
Between open contact
70
80
45MHz
5GHz
Frequency
8GHz
• Insertion loss characteristics
(without D.U.T. board’s loss)
0
• Isolation characteristics
0
10
20
Between contact sets
30
40
50
3
RJ(ARJ2)
DIMENSIONS
1. Standard PC board terminal
Schematic (Bottom view)
Expansion of A
Single side stable
Direction
indication
10.6
.417
10.4
.409
0 to 0.2
0 to .008
(Typical: 0.1)
(Typical: .004)
12.2
.480
14.0
.551
3.50
.138
A
24
ribs should be soldered with PC board ground.
9.00
.354
3Better
HF characteristics
may be obtained when this
8.20
portion is soldered with
.323
PC board ground.
0.50
.020
3.81
.150
+ 1
10
NC
9
8
7 6
Com
Com
2 3 –
4
NO
5
10
NC
9
+ 8
7 6 –
Com
mm
inch
2 coil latching
+ 1
Com
2 3 –
4
NO
5
(Deenergized condition)
(Reset condition)
0.50
.020
8.89
.350
12.70
.500
11.40
.449
0.40
.016
7.62
.300
0.20
.008
0.50
.020
6.36
.250
0.20
.008
0.15
.006
1All
bottom surface of the base should be
touched closely or soldered with PC board
ground.
General tolerance:
±0.3
±.012
2. Surface mount terminal
Schematic (Top view)
Expansion of A
Single side stable
Direction
indication
0.50
.020
10.6
.417
0 to 0.2
0 to .008
10.4
.409
0.50
.020
0.40
.016
3.81
.150
(Typical: 0.1)
(Typical: .004)
9
NC
10
+ 1
2 3 –
Com
8
Com
7 6
5
NO
4
9
NC
10
+ 1
2 3 –
Com
2 coil latching
Com
7 6 –
5
NO
4
+ 8
8.89
.350
12.2
.480
14.0
.551
24
ribs should be soldered with PC board ground.
(Deenergized condition)
(Reset condition)
9.00
.354
A
0.20
.008
3Better
HF characteristics
8.20 may be obtained when this
.323
portion is soldered with
PC board ground.
10.0
.394
15.0
.591
11.40
.449
6.36
.250
0.50
.020
1All
bottom surface of the base should be
touched closely or soldered with PC board
ground.
General tolerance:
±0.3
±.012
4
RJ(ARJ2)
NOTES
1. Coil operating power
Pure DC current should be applied to the
coil. The wave form should be rectangular.
If it includes ripple, the ripple factor should
be less than 5%.
However, check it with the actual circuit
since the characteristics may be slightly
different. The nominal operating voltage
should be applied to the coil for more than
20 ms to set/reset the latching type relay.
2. Coil connection
When connecting coils, refer to the wiring
diagram to prevent mis-operation or mal-
function.
3. External magnetic field
Since RJ relays are highly sensitive polar-
ized relays, their characteristics will be af-
fected by a strong external magnetic field.
Avoid using the relay under that condition.
4. Cleaning
For automatic cleaning, the boiling meth-
od is recommended. Avoid ultrasonic
cleaning which subjects the relays to high
frequency vibrations, which may cause
the contacts to stick.
It is recommended that alcoholic solvents
be used.
5. Tape and reel packing
1) Tape dimensions
16.00
.630
4.00
.157
2.0 (Accumulation 10 pitch:
.079
40±0.1
1.575±.004)
1.75
.069
11.50
.453
8.80
.346
0.40±0.05 8.50
.016±.002 .337
3 to
5
°
6. Conditions for operation, transport
and storage conditions
1) Ambient temperature, humidity, and at-
mospheric pressure during usage, trans-
port, and storage of the relay:
(1) Temperature:
–30 to +70°C
–22 to +158°F
(However, tolerance range is –30 to
+60°C
–22 to +140°F
if package is carried
as is.)
(2) Humidity: 5 to 85% RH
(Avoid freezing and condensation.)
The humidity range varies with the tem-
perature. Use within the range indicated
in the graph below.
(3) Atmospheric pressure: 86 to 106 kPa
Temperature and humidity range for us-
age, transport, and storage:
Humidity, %R.H.
7. Soldering
1) Surface-mount terminal
In case of automatic soldering, the follow-
ing conditions should be observed
(1) Position of measuring temperature
1.0mm
.039inch
B
A
A: Surface of PC board where relay is mounted.
B: Above the PC board surface.
(2) IR (infrared reflow) soldering method
A:
B:
T
5
T
4
T
3
T
2
T
1
t
1
85
Tolerance range
(Avoid freezing
when used at
temperatures
lower than
0°C
32°F)
5
–30
–22
(Avoid
condensation
when used at
temperatures
higher than
0°C
32°F)
0
70
32
158
Temperature,
°C
°F
T
1
=150°C
302°F
T
2
=160°C
320°F
T
3
=183°C
361°F
T
4
=245°C
473°F
T
5
=270°C
518°F
t
2
t
3
t
4
t
5
t
2
- t
1
= 80 to 120 s
t
5
- t
3
= 30 to 40 s
t
4
= 170 to 190 s
7.40
.291
1.50
.059
11.20
.441
6.20
.244
11.40
.449
9.40
°
.370
5
3 to
16.00
24.00
.630
.945
14.40
.570
(10.75)
(.423)
1.33
.052
2.57
.101
2) Dimensions of plastic reel
21±0.8 dia.
.827±.031 dia.
2.0±0.5
.079±.020
100±1 dia.
3.937±.039 dia.
370±2 dia.
14.567±.079 dia.
13±0.2 dia.
.512±.008 dia.
24.4
+2
0
.961
+.079
0
2.0±0.2
.079±.008
2) Condensation
Condensation forms when there is a sud-
den change in temperature under high
temperature and high humidity conditions.
Condensation will cause deterioration of
the relay insulation.
3) Freezing
Condensation or other moisture may
freeze on the relay when the temperature
is lower than 0°C
32°F.
This causes prob-
lems such as sticking of movable parts or
operational time lags.
4) Low temperature, low humidity environ-
ments
The plastic becomes brittle if the relay is
exposed to a low temperature, low humid-
ity environment for long periods of time.
5) Storage procedures for surface-mount
terminal types
Since the relay is very sensitive to humid-
ity, it is packed in humidity-free, hermeti-
cally sealed packaging. When storing the
relay, be careful of the following points:
(1) Be sure to use the relay immediately
after removing it from its sealed package.
(2) When storing the relay for long periods
of time after removing it from its sealed
package, we recommend using a humidi-
ty-free bag with silica gel to prevent sub-
jecting the relay to humidity.
Furthermore, if the relay is solder mount-
ed when it has been subjected to exces-
sive humidity, cracks and leaks can occur.
Be sure to mount the relay under the re-
quired mounting conditions.
Temperature rise of relay itself may vary
according to the mounting level or the
heating method of reflow equipment.
Therefore, please set the temperature of
soldering portion of relay terminal and the
top surface of the relay case not to exceed
the above mentioned soldering condition.
It is recommended to check the tempera-
ture rise of each portion under actual
mounting condition before use.
2) Standard PC board terminal
Please meet the following conditions if
this relay is to be automatically soldered.
(1) Preheating: Max. 100°C
212°F
(termi-
nal solder surface) for max. 60 seconds
(2) Soldering: Max. 250°C
482°F
for max.
5 seconds
The effect on the relay depends on the ac-
tual substrate used. Please verify the sub-
strate to be used.
3) Hand soldering
Please meet the following conditions if
this relay is to be soldered by hand.
(1) Wattage: 30 to 60 W
(2) Tip temperature/time: 280 to 300°C
536 to 572°F
for max. 5 seconds
The effect on the relay depends on the ac-
tual substrate used. Please verify the sub-
strate to be used.
4) Avoid high frequency cleaning since
this may adversely affect relay character-
istics. Use alcohol-based cleaning solu-
tions when cleaning relays.
ia.
a.
.1
d
i
+0
0
0
+.0004
d
1.5
59
.0
5
RJ(ARJ2)
Measuring method (Impedance 50Ω)
1
2
<Standard PC board terminal>
78
78
-0.4
-.0
0
16
dia
dia
.
.
.
dia
a.
60
di
1.
3
4-
-.06
4
PORT2
Network B
analyzer A
R
HP
8510C
RF
OUT
B S parameter
A test set
R
1
2
8.35
.329
a.
di
.
0
dia
6
0.
4
4-
-.02
4
1.00
.039
HP
RF
IN
8515A
7.62
.300
45
°
PORT1
• High-frequency load-operating
When high-frequency opening and clos-
ing of the relay is performed with a load
that causes arcs at the contacts, nitrogen
and oxygen in the air is fused by the arc
energy and HNO
3
is formed. This can cor-
rode metal materials.
Three countermeasures for these are listed
here.
(1) Incorporate an arc-extinguishing circuit.
(2) Lower the operating frequency
(3) Lower the ambient humidity
3.81
.150
Connector
No.
1
2
Product name
HP 85131-60013
HP 83059
Contents
3.5 mm testport,
Extension cable
3.5 mm coaxial
adaptor
a.
di
.
0
dia
7
0.
28
6-
-.0
6
.
dia
.
.70
dia
6-1
.067
6-
12.70
.500
17.00
.669
6-1.86
0.90
6-.073
.035
0.40
.016
0.40
.016
(Step 1) Calibrate the test system with HP
calibration kit [HP85052B]
(Step 2) After calibration, connect the
D.U.T. board and measure. Con-
nect 50
Ω
terminals on connec-
tors other than those for
measurement.
Notes)
1. All bottom surface of the base should be
touched closely or soldered with PC board
ground.
2. 4 ribs should be soldered with PC board
ground.
20.00 6.62
.787 .261
6.72
.265
0.50
.020
8.89
.350
11.70
.461
30.00
1.181
0.50
.020
<Calibration board>
14.5
.571
10.0
.394
0.40 or 0.50
.016 or .020
1.76 or 1.86
.069 or .073
Measuring board
1) Dimensions
<Surface mount terminal>
6-1.76
6-.069
0.80
.031
17.00
.669
0.40
.016
0.40
.016
7.07
.278
2.81
.111
0.40
.016
8.89
.350
12.04
.474
8.35
.329
1.00
.039
20.00
.787
0.40
.016
7.22
.284
e
hol
gh a.
rou .40 di
a.
Th -0
di
86
-.016
6
8
30.00
1.181
2) Material: Glass PTFE double-sided
through hole PC board R-4737 (Matsush-
ita Electric Works)
3) Board thickness: t = 0.8 mm
4) Copper plating: 18µm
• Connector (SMA type receptacle)
Product name: R125 510 (RADIALL)
Insertion loss compensation
The insertion loss of relay itself is given by
subtracting the insertion loss of short-
circuit the Com and the NC (or NO). (sig-
nal path and two connectors)
9. Others
1) The switching lifetime is defined under
the standard test condition specified in the
JIS* C 5442-1996 standard (temperature
15 to 35°C
59 to 95°F,
humidity 25 to
75%). Check this with the real device as it
is affected by coil driving circuit, load type,
activation frequency, activation phase,
ambient conditions and other factors.
Also, be especially careful of loads such
as those listed below.
• When used for AC load-operating and
the operating phase is synchronous.
Rocking and fusing can easily occur due
to contact shifting.
2) Use the relay within specifications such
as coil rating, contact rating and on/off
service life. If used beyond limits, the relay
may overheat, generate smoke or catch
fire.
3) Be careful not to drop the relay. If acci-
dentally dropped, carefully check its ap-
pearance and characteristics before use.
4) Be careful to wire the relay correctly.
Otherwise, malfunction, overheat, fire or
other trouble may occur.
5) If a relay stays on in a circuit for many
months or years at a time without being
activated, circuit design should be re-
viewed so that the relay can remain non-
excited. A coil that receives current all the
time heats, which degrades insulation
earlier than expected. A latching type re-
lay is recommended for such circuits.
6) The latching type relay is shipped in the
reset position. But jolts during transport or
impacts during installation can change
the reset position. It is, therefore, advis-
able to build a circuit in which the relay
can be initialized (set and reset) just after
turning on the power.
7) If silicone materials (e.g., silicone rub-
bers, silicone oils, silicone coating agents,
silicone sealers) are used in the vicinity of
the relay, the gas emitted from the silicone
may adhere to the contacts of the relay
during opening and closing and lead to
improper contact. If this is the case, use a
material other than silicone.
8) We recommend latching type when us-
ing in applications which involve lengthy
duty cycles.
* Japanese Industrial Standards
45
°
12/2/2002
16
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