H
400 V/10 Ohm,
General Purpose, 1 Form A,
Solid State Relay
Technical Data
HSSR-8400
Features
• Compact Solid-State
Bidirectional Switch
• Normally-Off Single-Pole
Relay Function (1 Form-A)
• 400 V Output Withstand
Voltage in Both Polarities at
25
°
C
• 150/300 mA Current Ratings
(See Schematic for
Connection A & B)
• Low Input Current; CMOS
Compatibility
• Very Low On-Resistance: 6
Ω
Typical at 25
°
C
• ac/dc Signal & Power
Switching
• Input-to-Output Momentary
Withstand Insulation
Voltage: 2500 Vac, 1 Minute
• 16-kV ESD Immunity: MIL-
STD-883, Method 3015
• CSA Approved
• UL 508 Recognized
Description
The HSSR-8400 consists of a
high-voltage circuit, optically
coupled with a Light-Emitting
Diode (LED). This device is a
solid-state replacement for single-
pole, normally-open (1 Form A)
electromechanical relays used for
general purpose switching of
signals and low-power ac/dc
loads. The relay turns on (contact
closes) with a minimum input
current, I
F
, of 5 mA through the
input LED. The relay turns off
(contact opens) with an input
voltage, V
F
, of 0.8 V or less. The
detector contains a high speed
photosensitive FET driver circuit
and two high voltage MOSFETs.
This relay’s logic-level input con–
trol and very low typical output
on-resistance of 6
Ω
make it
suitable for switching of audio
frequency signals in telecom
applications. Connection A, as
shown in the schematic, allows
the relay to switch either ac or dc
loads. In this configuration, the
150 mA output current rating
allows it to switch small loads
that are driven from 110 Vac and
220 Vac power lines. Connection
B, with the polarity and pin
configuration as indicated in the
schematic, allows the relay to
switch dc loads only. The
advantage of Connection B is that
the on-resistance is significantly
reduced and the output current
capability increases by a factor of
two.
The electrical and switching
characteristics of the HSSR-8400
are specified from -40°C to
+85°C.
Functional Diagram
Applications
• Modems
• Telecommunication
Switching Equipment
• Telecommunication Test
Instruments
• Reed Relay Replacement
• 110/220 Vac Load Driver
• Industrial Relay Coil Driver
TRUTH TABLE
(POSITIVE LOGIC)
LED
ON
OFF
OUTPUT
L
H
CAUTION: It is advised that normal static precautions be taken in handling and assembly of this component to
prevent damage and/or degradation which may be induced by ESD.
1-465
5965-3573E
Selection Guide
6-Pin DIP
(300 Mil)
Single
Channel
Package
HSSR-8400
HSSR-8060
[1]
4-Pin DIP
(300 Mil)
Dual
Channel
Package
Maximum
Maximum
ON
Speed
Resistance
t(ON)
R(ON)
Ω
msec
25
°
C
25
°
C
0.95
10
1.4
0.7
1.5
200
6
1
Maximum
Output
Voltage
VO(off)
V
25
°
C
400
60
200
90
Maximum
Output
Current
Io(ON)
mA
25
°
C
150
750
40
800
Minimum
Input
Current
mA
5
5
1
5
Hermetic
8-Pin
Single
Channel
Packages
HSSR-8200
[1]
HSSR-7110
[1]
Note:
1. Technical data are on separate HP publication.
Ordering Information:
Specify part number followed by Option Number (if desired).
HSSR-8400#XXX
300 = Gull Wing Surface Mount Lead Option
500 = Tape/Reel Package Option (1 Kmin.)
Option data sheets available. Contact your Hewlett-Packard sales representative or authorized distributor for
information.
Schematic
6
+
1
I
F
V
F
SWITCH
DRIVER
5
–
2
4
1-466
Outline Drawing
6-Pin DIP Package
9.40 (0.370)
9.90 (0.390)
6
5
4
TYPE
NUMBER
7.36 (0.290)
7.88 (0.310)
HP RXXXX
YYWW
PIN
ONE
DOT
1
2
RU
3
DATE CODE
UL
RECOGNITION
0.20 (0.008)
0.33 (0.013)
5° TYP.
1.78 (0.070) MAX.
6.10 (0.240)
6.60 (0.260)
4.70 (0.185) MAX.
0.51 (0.020) MIN.
2.92 (0.115) MIN.
0.45 (0.018)
0.65 (0.025)
2.28 (0.090)
2.80 (0.110)
2.16 (0.085)
2.54 (0.100)
DIMENSIONS IN MILLIMETERS AND (INCHES).
1-467
6-Pin Device Outline Drawing Option #300 (Gull Wing Surface Mount)
9.65 ± 0.25
(0.380 ± 0.010)
PAD LOCATION (FOR REFERENCE ONLY)
TYPE NUMBER
6.35 ± 0.25
(0.250 ± 0.010)
HP RXXXX
YYWW
DATE CODE
4.826
(0.190)
TYP.
9.398 (0.370)
9.906 (0.390)
1.194 (0.047)
1.778 (0.070)
9.65 ± 0.25
(0.380 ± 0.010)
7.62 ± 0.25
(0.300 ± 0.010)
0.381 (0.015)
0.635 (0.025)
1.78
(0.070)
MAX.
4.19
MAX.
(0.165)
0.635 ± 0.130
(0.025 ± 0.005)
0.20 (0.008)
0.33 (0.013)
2.29
(0.090)
2.54
(0.100)
TYP.
0.635 ± 0.25
(0.025 ± 0.010)
12° NOM.
[3] [5]
DIMENSIONS IN mm (INCHES)
TOLERANCES: xx.xx = 0.01
xx.xxx = 0.001
(unless otherwise specified)
LEAD COPLANARITY
MAXIMUM: 0.102 (0.004)
HSSR-8400 Outline – Option 300
Thermal Profile (Option #300)
260
240
220
200
180
160
140
120
100
80
60
40
20
0
0
1
∆T
= 145°C, 1°C/SEC
∆T
= 115°C, 0.3°C/SEC
TEMPERATURE – °C
∆T
= 100°C, 1.5°C/SEC
2
3
4
5
6
7
8
9
10
11
12
TIME – MINUTES
Figure 1. Maximum Solder Reflow Thermal Profile.
(Note: Use of non-chlorine activated fluxes is recommended.)
1-468
Regulatory Information
The HSSR-8400 has been
approved by the following
organizations:
UL
Recognized under UL 508,
Component Recognition
Program, Industrial Control
Switches, File E142465.
CSA
Approved under CAN/CSA-C22.2
No. 14-95, Industrial Control
Equipment, File LR 87683.
Insulation and Safety Related Specifications
Parameter
Min. External Air Gap
(External Clearance)
Min. External Tracking Path
(External Creepage)
Min. Internal Plastic Gap
(Internal Clearance)
Symbol
L(IO1)
L(IO2)
Value Units
7.0
8.5
0.5
mm
mm
mm
Conditions
Measured from input terminals to output
terminals, shortest distance through air
Measured from input terminals to output
terminals, shortest distance path along body
Through insulation distance, conductor to
conductor, usually the direct distance
between the photoemitter and photodetector
inside the optocoupler cavity
DIN IEC 112/VDE 0303 PART 1
Material Group (DIN VDE 0110, 1/89, Table 1)
Tracking Resistance
(Comparative Tracking Index)
Isolation Group
CTI
200
IIIa
volts
Option 300 – surface mount classification is Class A in accordance with CECC 00802.
Absolute Maximum Ratings
Storage Temperature ................................................... -55°C to+125°C
Operating Temperature - T
A
.......................................... -40°C to +85°C
Case Temperature - T
C
.......................................................... +105°C
[1]
Lead Solder Temperature .... 260°C for 10 S (1.6 mm below seating plane)
Average Input Current - I
F
............................................................ 20 mA
Repetitive Peak Input Current - I
F
............................................... 40 mA
(Pulse Width
≤
1 ms; duty cycle
≤
50%)
Transient Peak Input Current - I
F
............................................... 100 mA
(Pulse Width
≤
200
µs;
duty cycle
≤
1%)
Reverse Input Voltage - V
R
................................................................ 3 V
Input Power Dissipation .............................................................. 40 mW
Output Voltage (T
A
= 25°C)
Connection A - V
O
..................................................... - 400 to +400 V
Connection B - V
O
........................................................... 0 to +400 V
Average Output Current - Figure 3 (T
A
= 25°C, T
C
≤
70°C)
Connection A - I
O
..................................................................... 0.15 A
Connection B - I
O
....................................................................... 0.3 A
Single Shot Peak Output Current
(100 ms pulse width, T
A
= 25°C, I
F
= 10 mA)
Connection A - I
O
...................................................................... 1.0 A
Connection B - I
O
...................................................................... 2.0 A
Output Power Dissipation ..................................................... 750 mW
[2]
Infrared and Vapor Phase Reflow Temperature
(Option #300) ......................................... See Fig. 1, Thermal Profile
Thermal Resistance
Typical Output MOSFET Junction
to Case –
θ
JC
= 55°C/W
Demonstrated ESD
Performance
Human Body Model: MIL-STD-
883 Method 3015.7 - 16 kV
Machine Model: EIAJ 1988.3.28
Version 2), Test Method 20,
Condition C – 1200 V
1-469
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