SPEC NO. 05-08-5018 REV. P
REV
0
A
B
RH1021-10, PRECISION 10V REFERENCE
REVISION RECORD
DESCRIPTION
DATE
06/12/96
02/28/97
11/25/97
C
D
E
F
INITIAL RELEASE
•
CORRECTION TO RH1021BM-10, DM-10, OUTPUT VOLTAGE, 100 KRAD MINIMUM LIMIT
FROM “9.98 V” TO “9.938 V, PAGE 10.
•
PAGE 2, ADDED PARAGRAPHS 3.2.1, 3.2.2, AND 3.2.3. PARAGRAPH 3.3.b, ADDED “(SEE
PARAGRAPH 3.2)”.
•
PAGE 4, PARAGRAPH 3.12, WAFER LOT ACCEPTANCE REDEFINED. PARAGRAPH 4.4.2,
GROUP B INSPECTION, REDEFINED. PARAGRAPH 4.4.3, GROUP D INSPECTION,
REDEFINED.
•
PAGE 5, PARAGRAPH 4.5, SOURCE INSPECTION, REDEFINED.
•
PAGE 6, FIGURE 1, TO5 CASE OUTLINE, ADDED
θja
AND
θjc.
•
PAGE 4, AMENDED PARAGRAPHS 4.1 AND 4.1.1 TAKING EXCEPTION TO ANALYSIS OF
CATASTROPHIC FAILURES.
•
PAGE 6, FIGURE 1, CHANGED
θja
FROM 180°C/W TO 150°C/W.
•
PAGE 4, PARAGRAPH 3.7, CHANGED VERBIAGE FROM “SPECIFIED IN TABLE III TO “AND
AS SPECIFIED IN TABLE III HEREIN”, LINE 2.
PARAGRAPH 3.9, ADDED “HEREIN” AFTER “TABLE II”, LINE 2.
•
PAGE 5, PARAGRAPH 4.3, ADDED “HEREIN” AFTER “TABLE III”, LINE 2.
PARAGRAPH 4.4.1, ADDED “HEREIN” AFTER “TABLE III”, LINE 2.
PARAGRAPH 4.4.2.2, CHANGED VERBIAGE IN LINE 1 FROM “ALL FOOTNOTES OF TABLE
IIA OF MIL-STD-883” TO “ALL FOOTNOTES PERTAINING TO TABLE IIA IN MIL-STD-883”.
PARAGRAPH 4.4.3.2, CHANGED VERBIAGE IN LINE 1 FROM “ALL FOOTNOTES OF TABLE IV
OF MIL-STD-883” TO “ALL FOOTNOTES PERTAINING TO TABLE IV IN MIL-STD-883”.
•
PAGE 3, PARAGRAPH 3.2.4, ADDED NEW DEVICE OPTION 4 (W10 FLATPACK).
•
PAGE 4, PARAGRAPH 3.8 CHANGED VERBIAGE ADDED FIGURES 5 AND 6.
PARAGRAPH 3.10.1, ADDED FIGURE 2.
PARAGRAPH 3.10.2, CHANGED VERBIAGE ADDED FIGURES 3 AND 4.
PARAGRAPH 3.10.3, CHANGED VERBIAGE.
PARAGRAPH 3.11.3, CHANGED FIGURE 4 TO 7.
•
PAGE 8, ADDED PAGE 7 DEVICE OPTION 4, PACKAGE OUTLINE.
•
PAGE 9, CHANGED FIGURE 2 TO 3.
•
PAGE 10, ADDED DEVICE OPTION 4, FIGURE 4 TERMINAL CONNECTIONS.
•
PAGE 11, CHANGED FIGURE 3 TO 5.
•
PAGE 12, ADDED DEVICE OPTION 4, FIGURE 6 BURN-IN CIRCUIT.
•
PAGE 13, CHANGED FIGURE 4 TO 7.
•
PAGE 15, CHANGED V
OUT
OUTPUT VOLTAGE 10 KRAD (SI) MIN TO 9.992 AND MAX TO
10.008 AND ADDED VERBIAGE TO NOTE 3.
CAUTION: ELECTROSTATIC DISCHARGE SENSITIVE PART
1
2
3
4
5
6
7
8
9
10 11 12
P
P
P
P
P
P
P
P
P
P
P
P
05/8/98
11/17/99
12/13/99
06/25/00
REVISION RECORD AND DESCRIPTION CONTINUED ON NEXT PAGE.
REVISION
INDEX
REVISION
INDEX
PAGE NO.
REVISION
PAGE NO.
REVISION
13
P
14
P
ORIG
DSGN
ENGR
MFG
CM
QA
PROG
FUNCT
APPLICATION
SIGNOFFS
DATE
LINEAR TECHNOLOGY CORPORATION
MILPITAS, CALIFORNIA
TITLE:
MICROCIRCUIT, LINEAR,
RH1021-10, PRECISION 10V REFERENCE
CAGE
CODE
94155
CONTRACT:
SIZE
DRAWING
NUMBER
05-08-5018
REV
P
FOR OFFICIAL USE ONLY
LINEAR TECHNOLOGY CORPORATION
Page 1 of 14
SPEC NO. 05-08-5018 REV. P
REV
G
H
RH1021-10, PRECISION 10V REFERENCE
DATE
9/05/00
03/26/02
J
REVISION RECORD
DESCRIPTION
•
PAGE 8, CHANGED THETA JA TO
θja
= +170°C/W AND THETA JC TO
θjc
= +40°C/W FROM
θja
= 225°C/W AND
θjc
18°C/W PER PACKAGE ENGINEERING.
•
CONVERSION FROM WORD PERFECT TO MICROSOFT WORD. REDUCED SPEC PAGES TO
14 TOTAL.
•
PAGE 2, AN ADDITIONAL REVISION RECORD PAGE WAS INSTALLED
•
MADE THE REVISION RELEASE DATES AND THE DOCUMENT CONTROL HISTORY PAGE
DATE MATCH
•
PAGE 3:
PARAGRAPH 3.2.1 THROUGH 3.2.4, ADDED THE WORD “OPTION” PRECEDING THE NUMBER OF
EACH LTC PART NUMBER FOR BETTER CUSTOMER ORDERING CONVENIENCE.
•
PAGE 4:
PARAGRAPH 3.6, CHANGED “TABLE IA” TO “TABLE II”
PARAGRAPH 3.7, CHANGED “TABLE III” TO “TABLE IV”
PARAGRAPHS 3.8.1 AND 3.8.2, ADDED THE PACKAGE TYPES AND OPTIONS AFTER EACH
FIGURE.
PARAGRAPH 3.9, CHANGED “TABLE II” TO “TABLE III”
PARAGRAPHS 3.10.1 AND 3.10.2, ADDED THE PACKAGE TYPES AFTER EACH FIGURE
PARAGRAPH 3.11.1 WAS CHANGED FROM “…dosage rate of approximately 20 Rads per
second” TO “…dosage rate of less than or equal to 10 Rads per second”
•
PAGE 5:
PARAGRAPHS 4.1 THROUGH 4.4.2.1 CHANGES WERE DONE TO CLARIFY GROUP SAMPLING.
•
PAGE 6:
PARAGRAPH 4.4.3 CHANGE WAS DONE TO CLARIFY GROUP SAMPLING.
PARAGRAPHS 4.6.2 THROUGH 4.6.4 WERE RE-WRITTEN. THESE DATA PROVIDED, AND DATA
AVAILABLE.
PARAGRAPH 4.6.10 NOTE, ADDED FURTHER EXPLANATION OF MINIMUM DELIVERED DATA.
•
PAGES 7 THROUGH 12, ALL FIGURE TITLES CHANGED TO HAVE DEVICE OPTIONS AND
PACKAGE TYPES AT TOP OF PAGE, AND HAVE ALL FIGURES AT BOTTOM OF PAGE.
•
PAGE 9, MOVED FIGURE 4 TO PAGE 9 FROM PAGE 10 AS SHOWN IN PREVIOUS
SPECIFICATION REVISION.
•
PAGE 12, FIGURE 7, TOTAL DOSE BIAS CIRCUIT REVISED BY ENGINEERING.
•
PAGE 13, TABLES I, II AND CORRESPONDING NOTES ALL ON ONE PAGE.
•
PAGE 8, CHANGED OUTLINE DRAWING PIN 1 NOTCH MOVED TO INSIDE LEAD
LOCATION.
05/19/03
K
L
M
N
P
•
•
•
•
•
•
PAGE 4, CHANGED INITIAL RATE OF RADS TO 240 RADS/SEC.
PAGE 4, ADDED NOTE: ABSOLUTE MAXIMUM RATINGS ARE THOSE VALUES BEYOND
WHICH THE LIFE OF A DEVICE MAY BE IMPAIRED.
PAGE 5, CHANGED IN BOTH PARAGRAPHS 4.2, 4.3 IN CONJUNCTION TO 3.3 CHANGED TO
3.4 AND PARAGRAPH 4.3 CHANGED 3.1.1 TO 3.1 AND 3.2.1 TO 3.1.1
PAGE 4, PARAGRAPH 3.11.1 CHANGED VERBIAGE.
PAGE 5, PARAGRAPH 4.4.2 CHANGED VERBIAGE.
PAGE 8, FIGURE 2 NOTE 2 ADDED TO LEAD THICKNESS. DATA SHEET CHANGE TO
ELECTRICAL TEST NOTES #7, #9 V
IN
= 12V CHANGED TO V
IN
= 15V.
03/15/05
08/15/05
12/07/07
04/30/08
07/18/08
LINEAR TECHNOLOGY CORPORATION
Page 2 of 14
SPEC NO. 05-08-5018 REV. P
1.0
SCOPE:
1.1
RH1021-10, PRECISION 10V REFERENCE
This specification defines the performance and test requirements for a microcircuit processed to a space
level manufacturing flow.
2.0
APPLICABLE DOCUMENTS:
2.1
Government Specifications and Standards: the following documents listed in the Department of Defense
Index of Specifications and Standards, of the issue in effect on the date of solicitation, form a part of this
specification to the extent specified herein.
SPECIFICATIONS:
MIL-PRF-38535
MIL-STD-883
MIL-STD-1835
2.2
Integrated Circuits (Microcircuits) Manufacturing, General Specification for
Test Method and Procedures for Microcircuits
Microcircuits Case Outlines
Order of Precedence: In the event of a conflict between the documents referenced herein and the contents
of this specification, the order of precedence shall be this specification, MIL-PRF-38535 and other
referenced specifications.
3.0
REQUIREMENTS:
3.1
General Description: This specification details the requirements for the RH1021-10, Precision 10V
Reference, processed to space level manufacturing flow.
Part Number:
3.2.1
3.2.2
3.2.3
3.2.4
3.3
Option 1 – RH1021BMH-10 (TO5 Metal Can, 8 Leads)
Option 2 – RH1021CMH-10 (TO5 Metal Can, 8 Leads)
Option 3 – RH1021DMH-10 (TO5 Metal Can, 8 Leads)
Option 4 – RH1021CMW-10 (Glass Sealed Flatpack, 10 Leads)
3.2
Part Marking Includes:
3.3.1
3.3.2
3.3.3
3.3.4
3.3.5
LTC Logo
LTC Part Number (See Paragraph 3.2)
Date Code
Serial Number
ESD Identifier per MIL-PRF-38535, Appendix A
LINEAR TECHNOLOGY CORPORATION
Page 3 of 14
SPEC NO. 05-08-5018 REV. P
3.4
The Absolute Maximum Ratings:
RH1021-10, PRECISION 10V REFERENCE
Input Voltage
. . . . . . . . . . . . . . . . 40V
Input / Output Voltage Differential
. . . . . . . . . . 35V
Output to Ground Voltage
(Shunt Mode Current Limit)
. . . . . . . . . . .
16V
Trim Pin to Ground Voltage
Positive
. . . . . . . . . . . . . . . Equal to V
OUT
. . . . . . . . . . . . . . .
-20V
Negative
Output Short Circuit Duration
V
IN
= 35V
. . . . . . . . . . . . . . . 10 sec
V
IN
= < 20V
. . . . . . . . . . . . . . Indefinite
Operating Temperature Range
. . . . . . . . . . . -55°C to 125°C
.
. . . . . . . . . . . -65°C to 150°C
Storage Temperature Range
Lead Temperature (Soldering, 10 sec.)
. . . . . . . . .
300°C
NOTE:
Absolute maximum ratings are those values beyond which the life of a device
may be impaired.
3.5
3.6
Electrostatic discharge sensitivity, ESDS, shall be Class 1.
Electrical Performance Characteristics: The electrical performance characteristics shall be as specified in
Table I
and
Table II.
Electrical Test Requirements: Screening requirements shall be in accordance with 4.1 herein,
MIL-STD-883, Method 5004, and as specified in
Table IV
herein.
Burn-In Requirement:
3.8.1
3.8.2
3.9
Options 1, 2, 3 (TO5): Static Burn-In,
Figure 5
Option 4 (Glass Sealed Flatpack) : Static Burn-In,
Figure 6
3.7
3.8
Delta Limit Requirement: Delta limit parameters are specified in
Table III
herein, are calculated after
each burn-in, and the delta rejects are included in the PDA calculation.
Design, Construction, and Physical Dimensions: Detail design, construction, physical, dimensions, and
electrical requirements shall be as specified herein.
3.10.1
Mechanical / Packaging Requirements: Case outlines and dimensions are in accordance with
Figure 1
(TO5/8 Leads) and
Figure 2
(Glass Sealed Flatpack/10 Leads).
Terminal Connections: The terminal connections shall be as specified in
Figure 3
(TO5/8
Leads) and
Figure 4
(Glass Sealed Flatpack/10 Leads).
Lead Material and Finish: The lead material shall be Kovar for TO5 and alloy 42 for flatpack.
The lead finish shall be hot solder dip (Finish letter A) in accordance with MIL-PRF-38535.
3.10
3.10.2
3.10.3
3.11
Radiation Hardness Assurance (RHA):
3.11.1
The manufacturer shall perform a lot sample test as an internal process monitor for total dose
radiation tolerance. The sample test is performed with MIL-STD-883 TM1019 Condition A as
a guideline.
LINEAR TECHNOLOGY CORPORATION
Page 4 of 14
SPEC NO. 05-08-5018 REV. P
3.11.2
RH1021-10, PRECISION 10V REFERENCE
For guaranteed radiation performance to MIL-STD-883, Method 1019, total dose irradiation,
the manufacturer will provide certified RAD testing and report through an independent test
laboratory when required as a customer purchase order line item.
Total dose bias circuit is specified in
Figure 7.
3.11.3
3.12
Wafer Lot Acceptance: Wafer lot acceptance shall be in accordance with MIL-PRF-38535, Appendix A,
except for the following: Topside glassivation thickness shall be a minimum of 4K
Å
.
Wafer Lot Acceptance Report: SEM is performed per MIL-STD-883, Method 2018 and copies of SEM
photographs shall be supplied with the Wafer Lot Acceptance Report as part of a Space Data Pack when
specified as a customer purchase order line item.
3.13
4.0
VERIFICATION (QUALITY ASSURANCE PROVISIONS)
4.1
Quality Assurance Provisions: Quality Assurance provisions shall be in accordance with MIL-PRF-38535.
Linear Technology is a QML certified company and all Rad Hard candidates are assembled on qualified
Class S manufacturing lines.
Sampling and Inspection: Sampling and Inspection shall be in accordance with MIL-STD-883, Method
5005 with QML allowed and TRB approved deviations in conjunction with paragraphs 3.1.1, 3.2.1, and
3.4 of the test method.
Screening: Screening requirements shall be in accordance with MIL-STD-883, Method 5004 with QML
allowed and TRB approved deviations in conjunction with paragraphs 3.1, 3.1.1, and 3.4 of the test
method. Electrical testing shall be as specified in
Table IV
herein.
4.3.1
Analysis of catastrophic (open/short) failures from burn-in will be conducted only when a lot fails
the burn-in or re-burn-in PDA requirements.
4.2
4.3
4.4
Quality Conformance Inspection: Quality conformance inspection shall be in accordance with 4.2 and 4.3
herein and as follows:
4.4.1
Group A Inspection: Group A inspection shall be performed in accordance with 4.1 herein, per
MIL-STD-883, Method 5005, and specified in
Table IV
herein.
Group B Inspection: When purchased, a full Group B is performed on an inspection lot. As a
minimum, Subgroups 1-4 plus 6 are performed on every assembly lot, and Subgroup B2
(Resistance to Solvents / Mark Permanency) and Subgroup B3 (Solderability) are performed prior
to the first shipment from any inspection lot and Attributes provided when a Full Space Data Pack
is ordered. Subgroup B5 (Operating Life) is performed on each wafer lot. This subgroup may or
may not be from devices built in the same package style as the current inspection lot. Attributes
and variables data for this subgroup will be provided upon request at no charge.
4.4.2.1
Group B, Subgroup 2c = 10%
Group B, Subgroup 3 = 10%
Group B, Subgroup 4 = 5%
Group B, Subgroup 5 = *5%
(*per wafer or inspection lot
whichever is the larger quantity)
Group B, Subgroup 6 = 15%
4.4.2
4.4.2.2 All footnotes pertaining to Table IIa in MIL-STD-883, Method 5005 apply. The quantity
(accept number) of all other subgroups are per MIL-STD-883, Method 5005, Table IIa.
LINEAR TECHNOLOGY CORPORATION
Page 5 of 14
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