LPC435x/3x/2x/1x
32-bit ARM Cortex-M4/M0 MCU; up to 1 MB flash and 136 kB
SRAM; Ethernet, two High-speed USB, LCD, EMC
Rev. 5.4 — 10 January 2020
Product data sheet
1. General description
The LPC435X_3X_2X_1X are ARM Cortex-M4 based microcontrollers with Floating Point
Unit (FPU) for embedded applications which include an ARM Cortex-M0 coprocessor, up
to 1 MB of flash and 136 kB of on-chip SRAM, 16 kB of EEPROM memory, two
high-speed USB controllers, Ethernet, LCD, an external memory controller, a quad SPI
Flash Interface (SPIFI) that supports execute-in-place, advanced configurable peripherals
such as the State Configurable Timer (SCTimer/PWM) and the Serial General Purpose
I/O (SGPIO) interface, and multiple digital and analog peripherals. The
LPC435X_3X_2X_1X operate at CPU frequencies of up to 204 MHz.
The ARM Cortex-M4 is a 32-bit core that offers system enhancements such as low power
consumption, enhanced debug features, and a high level of support block integration. The
ARM Cortex-M4 CPU incorporates a 3-stage pipeline, uses a Harvard architecture with
separate local instruction and data buses as well as a third bus for peripherals, and
includes an internal prefetch unit that supports speculative branching. The ARM
Cortex-M4 supports single-cycle digital signal processing and SIMD instructions. A
hardware floating-point processor is integrated into the core.
The ARM Cortex-M0 coprocessor is an energy-efficient and easy-to-use 32-bit core,
which is upward code- and tool-compatible with the Cortex-M4 core. It is ideal for handling
control or peripheral handling to free up the Cortex-M4 for real-time processing. The
Cortex-M0 coprocessor offers up to 204 MHz performance with a simple instruction set
and reduced code size. In LPC43xx, the Cortex-M0 coprocessor hardware multiply is
implemented as a 32-cycle iterative multiplier.
For additional documentation related to the LPC43xx parts, see
Section 17.
2. Features and benefits
Cortex-M4 Processor core
ARM Cortex-M4 processor (version r0p1), running at frequencies of up to
204 MHz.
Built-in Memory Protection Unit (MPU) supporting eight regions.
Built-in Nested Vectored Interrupt Controller (NVIC).
Hardware floating-point unit.
Non-maskable Interrupt (NMI) input.
JTAG and Serial Wire Debug (SWD), serial trace, eight breakpoints, and four
watch points.
Enhanced Trace Module (ETM) and Enhanced Trace Buffer (ETB) support.
System tick timer.
NXP Semiconductors
LPC435x/3x/2x/1x
32-bit ARM Cortex-M4/M0 microcontroller
Cortex-M0 Processor core
ARM Cortex-M0 co-processor (version r0p0) capable of off-loading the main ARM
Cortex-M4 application processor.
Running at frequencies of up to 204 MHz.
JTAG
Built-in NVIC.
On-chip memory
Up to 1 MB on-chip dual bank flash memory with flash accelerator.
16 kB on-chip EEPROM data memory.
136 kB SRAM for code and data use.
Multiple SRAM blocks with separate bus access. Two SRAM blocks can be
powered down individually.
64 kB ROM containing boot code and on-chip software drivers.
64 bit+ 256 bit of One-Time Programmable (OTP) memory for general-purpose
use.
Configurable digital peripherals
Serial GPIO (SGPIO) interface.
State Configurable Timer (SCTimer/PWM) subsystem on AHB.
Global Input Multiplexer Array (GIMA) allows to cross-connect multiple inputs and
outputs to event driven peripherals like the timers, SCTimer/PWM, and ADC0/1.
Serial interfaces
Quad SPI Flash Interface (SPIFI) with four lanes and up to 52 MB per second.
10/100T Ethernet MAC with RMII and MII interfaces and DMA support for high
throughput at low CPU load. Support for IEEE 1588 time stamping/advanced time
stamping (IEEE 1588-2008 v2).
One High-speed USB 2.0 Host/Device/OTG interface with DMA support and
on-chip high-speed PHY.
One High-speed USB 2.0 Host/Device interface with DMA support, on-chip
full-speed PHY and ULPI interface to external high-speed PHY.
USB interface electrical test software included in ROM USB stack.
One 550 UART with DMA support and full modem interface.
Three 550 USARTs with DMA and synchronous mode support and a smart card
interface conforming to ISO7816 specification. One USART with IrDA interface.
Up to two C_CAN 2.0B controllers with one channel each.
Two SSP controllers with FIFO and multi-protocol support. Both SSPs with DMA
support.
One SPI controller.
One Fast-mode Plus I
2
C-bus interface with monitor mode and with open-drain I/O
pins conforming to the full I
2
C-bus specification. Supports data rates of up to
1 Mbit/s.
One standard I
2
C-bus interface with monitor mode and with standard I/O pins.
Two I
2
S interfaces, each with DMA support and with one input and one output.
Digital peripherals
External Memory Controller (EMC) supporting external SRAM, ROM, NOR flash,
and SDRAM devices.
LPC435X_3X_2X_1X
All information provided in this document is subject to legal disclaimers.
© NXP Semiconductors N.V. 2020. All rights reserved.
Product data sheet
Rev. 5.4 — 10 January 2020
2 of 162
NXP Semiconductors
LPC435x/3x/2x/1x
32-bit ARM Cortex-M4/M0 microcontroller
LCD controller with DMA support and a programmable display resolution of up to
1024 H
768 V. Supports monochrome and color STN panels and TFT color
panels; supports 1/2/4/8 bpp Color Look-Up Table (CLUT) and 16/24-bit direct
pixel mapping. Available on parts LPC4357/53 only.
Secure Digital Input Output (SD/MMC) card interface.
Eight-channel General-Purpose DMA controller can access all memories on the
AHB and all DMA-capable AHB slaves.
Up to 164 General-Purpose Input/Output (GPIO) pins with configurable
pull-up/pull-down resistors.
GPIO registers are located on the AHB for fast access. GPIO ports have DMA
support.
Up to eight GPIO pins can be selected from all GPIO pins as edge and level
sensitive interrupt sources.
Two GPIO group interrupt modules enable an interrupt based on a programmable
pattern of input states of a group of GPIO pins.
Four general-purpose timer/counters with capture and match capabilities.
One motor control Pulse Width Modulator (PWM) for three-phase motor control.
One Quadrature Encoder Interface (QEI).
Repetitive Interrupt timer (RI timer).
Windowed watchdog timer (WWDT).
Ultra-low power Real-Time Clock (RTC) on separate power domain with 256 bytes
of battery powered backup registers.
Alarm timer; can be battery powered.
Analog peripherals
One 10-bit DAC with DMA support and a data conversion rate of 400 kSamples/s.
Two 10-bit ADCs with DMA support and a data conversion rate of 400 kSamples/s.
Up to eight input channels per ADC.
Unique ID for each device.
Clock generation unit
Crystal oscillator with an operating range of 1 MHz to 25 MHz.
12 MHz internal RC oscillator trimmed to 3 % accuracy over temperature and
voltage (1.5 % accuracy for T
amb
= 0 °C to 85 °C).
Ultra-low power Real-Time Clock (RTC) crystal oscillator.
Three PLLs allow CPU operation up to the maximum CPU rate without the need for
a high-frequency crystal. The second PLL can be used with the High-speed USB,
the third PLL can be used as audio PLL.
Clock output.
Power
Single 3.3 V (2.4 V to 3.6 V) power supply with on-chip DC-to-DC converter for the
core supply and the RTC power domain.
RTC power domain can be powered separately by a 3 V battery supply.
Four reduced power modes: Sleep, Deep-sleep, Power-down, and Deep
power-down.
Processor wake-up from Sleep mode via wake-up interrupts from various
peripherals.
LPC435X_3X_2X_1X
All information provided in this document is subject to legal disclaimers.
© NXP Semiconductors N.V. 2020. All rights reserved.
Product data sheet
Rev. 5.4 — 10 January 2020
3 of 162
NXP Semiconductors
LPC435x/3x/2x/1x
32-bit ARM Cortex-M4/M0 microcontroller
Wake-up from Deep-sleep, Power-down, and Deep power-down modes via
external interrupts and interrupts generated by battery powered blocks in the RTC
power domain.
Brownout detect with four separate thresholds for interrupt and forced reset.
Power-On Reset (POR).
Available as LQFP208, LQFP144, LBGA256, or TFBGA100 packages.
3. Applications
Motor control
Power management
White goods
RFID readers
Embedded audio applications
Industrial automation
e-metering
LPC435X_3X_2X_1X
All information provided in this document is subject to legal disclaimers.
© NXP Semiconductors N.V. 2020. All rights reserved.
Product data sheet
Rev. 5.4 — 10 January 2020
4 of 162
NXP Semiconductors
LPC435x/3x/2x/1x
32-bit ARM Cortex-M4/M0 microcontroller
4. Ordering information
Table 1.
Ordering information
Package
Name
LPC4357FET256
LPC4357JET256
LPC4357JBD208
LPC4353FET256
LPC4353JET256
LPC4353JBD208
LPC4337FET256
LPC4337JET256
LPC4337JBD144
LPC4337JET100
LPC4333FET256
LPC4333JET256
LPC4333JBD144
LPC4333JET100
LPC4327JBD144
LPC4327JET100
LPC4325JBD144
LPC4325JET100
LPC4323JBD144
LPC4323JET100
LPC4322JBD144
LPC4322JET100
LPC4317JBD144
LPC4317JET100
LPC4315JBD144
LPC4315JET100
LPC4313JBD144
LPC4313JET100
LPC4312JBD144
LPC4312JET100
LBGA256
LBGA256
LQFP208
LBGA256
LBGA256
LQFP208
LBGA256
LBGA256
LQFP144
LBGA256
LBGA256
LQFP144
LQFP144
LQFP144
LQFP144
LQFP144
LQFP144
LQFP144
LQFP144
LQFP144
Description
Plastic low profile ball grid array package; 256 balls; body 17
17
1 mm
Plastic low profile ball grid array package; 256 balls; body 17
17
1 mm
Plastic low profile quad flat package; 208 leads; body 28
28
1.4 mm
Plastic low profile ball grid array package; 256 balls; body 17
17
1 mm
Plastic low profile ball grid array package; 256 balls; body 17
17
1 mm
Plastic low profile quad flat package; 208 leads; body 28
28
1.4 mm
Plastic low profile ball grid array package; 256 balls; body 17
17
1 mm
Plastic low profile ball grid array package; 256 balls; body 17
17
1 mm
Plastic low profile quad flat package; 144 leads; body 20
20
1.4 mm
Plastic low profile ball grid array package; 256 balls; body 17
17
1 mm
Plastic low profile ball grid array package; 256 balls; body 17
17
1 mm
Plastic low profile quad flat package; 144 leads; body 20
20
1.4 mm
Plastic low profile quad flat package; 144 leads; body 20
20
1.4 mm
Plastic low profile quad flat package; 144 leads; body 20
20
1.4 mm
Plastic low profile quad flat package; 144 leads; body 20
20
1.4 mm
Plastic low profile quad flat package; 144 leads; body 20
20
1.4 mm
Plastic low profile quad flat package; 144 leads; body 20
20
1.4 mm
Plastic low profile quad flat package; 144 leads; body 20
20
1.4 mm
Plastic low profile quad flat package; 144 leads; body 20
20
1.4 mm
Plastic low profile quad flat package; 144 leads; body 20
20
1.4 mm
Version
SOT740-2
SOT740-2
SOT459-1
SOT740-2
SOT740-2
SOT459-1
SOT740-2
SOT740-2
SOT486-1
SOT926-1
SOT740-2
SOT740-2
SOT486-1
SOT926-1
SOT486-1
SOT926-1
SOT486-1
SOT926-1
SOT486-1
SOT926-1
SOT486-1
SOT926-1
SOT486-1
SOT926-1
SOT486-1
SOT926-1
SOT486-1
SOT926-1
SOT486-1
SOT926-1
Type number
TFBGA100 Plastic thin fine-pitch ball grid array package; 100 balls; body 9
9
0.7 mm
TFBGA100 Plastic thin fine-pitch ball grid array package; 100 balls; body 9
9
0.7 mm
TFBGA100 Plastic thin fine-pitch ball grid array package; 100 balls; body 9
9
0.7 mm
TFBGA100 Plastic thin fine-pitch ball grid array package; 100 balls; body 9
9
0.7 mm
TFBGA100 Plastic thin fine-pitch ball grid array package; 100 balls; body 9
9
0.7 mm
TFBGA100 Plastic thin fine-pitch ball grid array package; 100 balls; body 9
9
0.7 mm
TFBGA100 Plastic thin fine-pitch ball grid array package; 100 balls; body 9
9
0.7 mm
TFBGA100 Plastic thin fine-pitch ball grid array package; 100 balls; body 9
9
0.7 mm
TFBGA100 Plastic thin fine-pitch ball grid array package; 100 balls; body 9
9
0.7 mm
TFBGA100 Plastic thin fine-pitch ball grid array package; 100 balls; body 9
9
0.7 mm
LPC435X_3X_2X_1X
All information provided in this document is subject to legal disclaimers.
© NXP Semiconductors N.V. 2020. All rights reserved.
Product data sheet
Rev. 5.4 — 10 January 2020
5 of 162
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