LPC1763FBD100 datasheet, PDF - EEWORLD Datasheet

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LPC1763FBD100: Description256kB Flash, 64kB SRAM, no CAN, LQFP100 package; CategoryThe embedded processor and controller Microcontrollers and processors; File Size3MB，93 Pages; ManufacturerNXP; Websitehttps://www.nxp.com; Environmental Compliance

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LPC1763FBD100 Overview

256kB Flash, 64kB SRAM, no CAN, LQFP100 package

LPC1763FBD100 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	NXP
Parts packaging code	QFP
package instruction	LFQFP,
Contacts	100
Reach Compliance Code	compliant
Samacsys Description	This errata sheet describes both the known functional problems and any
Has ADC	YES
Address bus width
bit size	32
maximum clock frequency	25 MHz
DAC channel	YES
DMA channel	YES
External data bus width
JESD-30 code	S-PQFP-G100
length	14 mm
Humidity sensitivity level	3
Number of I/O lines	70
Number of terminals	100
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
PWM channel	YES
Package body material	PLASTIC/EPOXY
encapsulated code	LFQFP
Package shape	SQUARE
Package form	FLATPACK, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)	260
Certification status	Not Qualified
ROM programmability	FLASH
Maximum seat height	1.6 mm
speed	100 MHz
Maximum supply voltage	3.6 V
Minimum supply voltage	2.4 V
Nominal supply voltage	3.3 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Pure Tin (Sn)
Terminal form	GULL WING
Terminal pitch	0.5 mm
Terminal location	QUAD
Maximum time at peak reflow temperature	30
width	14 mm
uPs/uCs/peripheral integrated circuit type	MICROCONTROLLER, RISC

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LPC1769/68/67/66/65/64/63

32-bit Arm Cortex

-M3 microcontroller; up to 512 kB flash and

64 kB SRAM with Ethernet, USB 2.0 Host/Device/OTG, CAN

Rev. 9.9 — 18 March 2020

Product data sheet

1. General description

The LPC1769/68/67/66/65/64/63 are ARM Cortex-M3 based microcontrollers for

embedded applications featuring a high level of integration and low power consumption.

The Arm Cortex-M3 is a next generation core that offers system enhancements such as

enhanced debug features and a higher level of support block integration.

The LPC1768/67/66/65/64/63 operate at CPU frequencies of up to 100 MHz. The

LPC1769 operates at CPU frequencies of up to 120 MHz. The Arm Cortex-M3 CPU

incorporates a 3-stage pipeline and uses a Harvard architecture with separate local

instruction and data buses as well as a third bus for peripherals. The Arm Cortex-M3 CPU

also includes an internal prefetch unit that supports speculative branching.

The peripheral complement of the LPC1769/68/67/66/65/64/63 includes up to 512 kB of

flash memory, up to 64 kB of data memory, Ethernet MAC, USB Device/Host/OTG

interface, 8-channel general purpose DMA controller, 4 UARTs, 2 CAN channels, 2 SSP

controllers, SPI interface, 3 I

C-bus interfaces, 2-input plus 2-output I

S-bus interface,

8-channel 12-bit ADC, 10-bit DAC, motor control PWM, Quadrature Encoder interface,

four general purpose timers, 6-output general purpose PWM, ultra-low power Real-Time

Clock (RTC) with separate battery supply, and up to 70 general purpose I/O pins.

The LPC1769/68/67/66/65/64/63 are pin-compatible to the 100-pin LPC236x Arm7-based

microcontroller series.

For additional documentation, see

Section 19 “References”.

2. Features and benefits



Arm Cortex-M3 processor, running at frequencies of up to 100 MHz

(LPC1768/67/66/65/64/63) or of up to 120 MHz (LPC1769). A Memory Protection Unit

(MPU) supporting eight regions is included.



Arm Cortex-M3 built-in Nested Vectored Interrupt Controller (NVIC).



Up to 512 kB on-chip flash programming memory. Enhanced flash memory accelerator

enables high-speed 120 MHz operation with zero wait states.



In-System Programming (ISP) and In-Application Programming (IAP) via on-chip

bootloader software.



On-chip SRAM includes:



32/16 kB of SRAM on the CPU with local code/data bus for high-performance CPU

access.

LPC1763FBD100 Related Products

	LPC1763FBD100	LPC1764FBD100	LPC1765FBD100	LPC1765FET100	LPC1766FBD100	LPC1767FBD100	LPC1768FBD100	LPC1768FET100
Description	256kB Flash, 64kB SRAM, no CAN, LQFP100 package	128kB Flash, 32kB SRAM, Ethernet, USB, LQFP100 package	256kB Flash, 64kB SRAM, USB, LQFP100 package	32-BIT, FLASH, 100MHz, RISC MICROCONTROLLER, PBGA100, 9 X 9 MM, 0.70 MM HEIGHT, PLASTIC, SOT926-1, TFBGA-100	256kB Flash, 64kB SRAM, Ethernet, USB, LQFP100 package	512kB Flash, 64kB SRAM, Ethernet, no CAN, LQFP100 package	512kB Flash, 64kB SRAM, Ethernet, USB, LQFP100 package	512kB Flash, 64kB SRAM, Ethernet, USB, TFBGA100 package
Is it Rohs certified?	conform to	conform to	conform to	-	conform to	conform to	conform to	conform to
Maker	NXP	-	NXP	-	NXP	NXP	-	NXP
Parts packaging code	QFP	QFP	QFP	-	QFP	QFP	QFP	BGA
package instruction	LFQFP,	LQFP-100	LFQFP, QFP100,.63SQ,20	-	LFQFP, QFP100,.63SQ,20	LFQFP,	LFQFP, QFP100,.63SQ,20	TFBGA,
Contacts	100	100	100	-	100	100	100	100
Reach Compliance Code	compliant	compliant	compliant	-	compliant	compliant	compliant	compliant
Has ADC	YES	YES	YES	-	YES	YES	YES	YES
bit size	32	32	32	-	32	32	32	32
maximum clock frequency	25 MHz	25 MHz	25 MHz	-	25 MHz	25 MHz	25 MHz	25 MHz
DAC channel	YES	YES	YES	-	YES	YES	YES	YES
DMA channel	YES	YES	YES	-	YES	YES	YES	YES
JESD-30 code	S-PQFP-G100	S-PQFP-G100	S-PQFP-G100	-	S-PQFP-G100	S-PQFP-G100	S-PQFP-G100	S-PBGA-B100
length	14 mm	14 mm	14 mm	-	14 mm	14 mm	14 mm	9 mm
Humidity sensitivity level	3	3	3	-	3	3	3	3
Number of I/O lines	70	70	70	-	70	70	70	70
Number of terminals	100	100	100	-	100	100	100	100
Maximum operating temperature	85 °C	85 °C	85 °C	-	85 °C	85 °C	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C	-	-40 °C	-40 °C	-40 °C	-40 °C
PWM channel	YES	YES	YES	-	YES	YES	YES	YES
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	-	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	LFQFP	LFQFP	LFQFP	-	LFQFP	LFQFP	LFQFP	TFBGA
Package shape	SQUARE	SQUARE	SQUARE	-	SQUARE	SQUARE	SQUARE	SQUARE
Package form	FLATPACK, LOW PROFILE, FINE PITCH	FLATPACK, LOW PROFILE, FINE PITCH	FLATPACK, LOW PROFILE, FINE PITCH	-	FLATPACK, LOW PROFILE, FINE PITCH	FLATPACK, LOW PROFILE, FINE PITCH	FLATPACK, LOW PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)	260	260	260	-	260	260	260	260
Certification status	Not Qualified	Not Qualified	Not Qualified	-	Not Qualified	Not Qualified	Not Qualified	Not Qualified
ROM programmability	FLASH	FLASH	FLASH	-	FLASH	FLASH	FLASH	FLASH
Maximum seat height	1.6 mm	1.6 mm	1.6 mm	-	1.6 mm	1.6 mm	1.6 mm	1.2 mm
speed	100 MHz	100 MHz	100 MHz	-	100 MHz	100 MHz	100 MHz	100 MHz
Maximum supply voltage	3.6 V	3.6 V	3.6 V	-	3.6 V	3.6 V	3.6 V	3.6 V
Minimum supply voltage	2.4 V	2.4 V	2.4 V	-	2.4 V	2.4 V	2.4 V	2.4 V
Nominal supply voltage	3.3 V	3.3 V	3.3 V	-	3.3 V	3.3 V	3.3 V	3.3 V
surface mount	YES	YES	YES	-	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	-	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	-	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal surface	Pure Tin (Sn)	Tin (Sn)	Tin (Sn)	-	Tin (Sn)	Pure Tin (Sn)	Tin (Sn)	-
Terminal form	GULL WING	GULL WING	GULL WING	-	GULL WING	GULL WING	GULL WING	BALL
Terminal pitch	0.5 mm	0.5 mm	0.5 mm	-	0.5 mm	0.5 mm	0.5 mm	0.8 mm
Terminal location	QUAD	QUAD	QUAD	-	QUAD	QUAD	QUAD	BOTTOM
Maximum time at peak reflow temperature	30	30	30	-	30	30	30	30
width	14 mm	14 mm	14 mm	-	14 mm	14 mm	14 mm	9 mm
uPs/uCs/peripheral integrated circuit type	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC	-	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC

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