IC 256 X 4 OTPROM, 35 ns, CDFP16, CERAMIC, FP-16, Programmable ROM
| Parameter Name | Attribute value |
| Maker | NXP |
| Parts packaging code | DFP |
| package instruction | DFP, |
| Contacts | 16 |
| Reach Compliance Code | unknown |
| ECCN code | EAR99 |
| Is Samacsys | N |
| Maximum access time | 35 ns |
| JESD-30 code | R-CDFP-F16 |
| memory density | 1024 bit |
| Memory IC Type | OTP ROM |
| memory width | 4 |
| Number of functions | 1 |
| Number of terminals | 16 |
| word count | 256 words |
| character code | 256 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| organize | 256X4 |
| Output characteristics | 3-STATE |
| Package body material | CERAMIC, METAL-SEALED COFIRED |
| encapsulated code | DFP |
| Package shape | RECTANGULAR |
| Package form | FLATPACK |
| Parallel/Serial | PARALLEL |
| Certification status | Not Qualified |
| Maximum seat height | 2.159 mm |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | YES |
| technology | BIPOLAR |
| Temperature level | MILITARY |
| Terminal form | FLAT |
| Terminal pitch | 1.27 mm |
| Terminal location | DUAL |
| width | 6.731 mm |
| Base Number Matches | 1 |
| 82S129A/BFA | 82S126A/BFA | 82S126A/BEA | 82S129A/BEA | |
|---|---|---|---|---|
| Description | IC 256 X 4 OTPROM, 35 ns, CDFP16, CERAMIC, FP-16, Programmable ROM | IC 256 X 4 OTPROM, 35 ns, CDFP16, CERAMIC, FP-16, Programmable ROM | IC 256 X 4 OTPROM, 35 ns, CDIP16, 0.300 INCH, CERAMIC, DIP-16, Programmable ROM | IC 256 X 4 OTPROM, 35 ns, CDIP16, 0.300 INCH, CERAMIC, DIP-16, Programmable ROM |
| Maker | NXP | NXP | NXP | NXP |
| Parts packaging code | DFP | DFP | DIP | DIP |
| package instruction | DFP, | DFP, | DIP, | DIP, |
| Contacts | 16 | 16 | 16 | 16 |
| Reach Compliance Code | unknown | unknown | unknown | unknown |
| ECCN code | EAR99 | EAR99 | EAR99 | EAR99 |
| Is Samacsys | N | N | N | N |
| Maximum access time | 35 ns | 35 ns | 35 ns | 35 ns |
| JESD-30 code | R-CDFP-F16 | R-CDFP-F16 | R-GDIP-T16 | R-GDIP-T16 |
| memory density | 1024 bit | 1024 bit | 1024 bit | 1024 bit |
| Memory IC Type | OTP ROM | OTP ROM | OTP ROM | OTP ROM |
| memory width | 4 | 4 | 4 | 4 |
| Number of functions | 1 | 1 | 1 | 1 |
| Number of terminals | 16 | 16 | 16 | 16 |
| word count | 256 words | 256 words | 256 words | 256 words |
| character code | 256 | 256 | 256 | 256 |
| Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| Maximum operating temperature | 125 °C | 125 °C | 125 °C | 125 °C |
| Minimum operating temperature | -55 °C | -55 °C | -55 °C | -55 °C |
| organize | 256X4 | 256X4 | 256X4 | 256X4 |
| Output characteristics | 3-STATE | OPEN-COLLECTOR | OPEN-COLLECTOR | 3-STATE |
| Package body material | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED |
| encapsulated code | DFP | DFP | DIP | DIP |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | FLATPACK | FLATPACK | IN-LINE | IN-LINE |
| Parallel/Serial | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum seat height | 2.159 mm | 2.159 mm | 5.08 mm | 5.08 mm |
| Maximum supply voltage (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V |
| surface mount | YES | YES | NO | NO |
| technology | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR |
| Temperature level | MILITARY | MILITARY | MILITARY | MILITARY |
| Terminal form | FLAT | FLAT | THROUGH-HOLE | THROUGH-HOLE |
| Terminal pitch | 1.27 mm | 1.27 mm | 2.54 mm | 2.54 mm |
| Terminal location | DUAL | DUAL | DUAL | DUAL |
| width | 6.731 mm | 6.731 mm | 7.62 mm | 7.62 mm |
| Base Number Matches | 1 | 1 | 1 | 1 |
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