EEWORLDEEWORLDEEWORLD

Part Number

Search

3-FIS074-51TT

Description
IC Socket, PGA74, 74 Contact(s), 2.54mm Term Pitch, 0.1inch Row Spacing, Solder
CategoryThe connector    socket   
File Size146KB,2 Pages
ManufacturerAdvanced Interconnections Corp.
Download Datasheet Parametric View All

3-FIS074-51TT Overview

IC Socket, PGA74, 74 Contact(s), 2.54mm Term Pitch, 0.1inch Row Spacing, Solder

3-FIS074-51TT Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerAdvanced Interconnections Corp.
Reach Compliance Codecompliant
ECCN codeEAR99
Is SamacsysN
Other features1.0 OZ. AVG. INSERTION FORCE
body width1.3 inch
subject depth0.13 inch
body length1.3 inch
Contact structure13X13
Contact to complete cooperationSN-PB ON NI
Contact completed and terminatedTin/Lead (Sn/Pb) - with Nickel (Ni) barrier
Contact materialBE-CU
Contact styleRND PIN-SKT
Device slot typeIC SOCKET
Type of equipment usedPGA74
Shell materialGLASS FILLED EPOXY
JESD-609 codee0
Manufacturer's serial numberFIS
Plug contact pitch0.1 inch
Installation methodSTRAIGHT
Number of contacts74
Maximum operating temperature140 °C
PCB contact patternRECTANGULAR
PCB contact row spacing0.1 mm
Terminal pitch2.54 mm
Termination typeSOLDER
Base Number Matches1
Low Insertion Force
PGA Sockets
5 Energy Way, P.O. Box 1019, West Warwick, RI 02893 USA Tel. 800-424-9850/401-823-5200 • Fax 401-823-8723 • Email info@advintcorp.com • Internet http://www.advintcorp.com
Molded & FR-4 Low Insertion Force PGA Sockets
.100
(2.54)
.062
(1.57)
Molded
PC Board
FR-4
PC Board
Features:
• As low as 1 oz.(28.34 g) average insertion
force per pin.
• Multiple finger contacts for reliability.
• Over 500 PGA footprints available.
• Closed bottom terminal for 100% anti-
wicking of solder.
• Tapered entry for ease of insertion.
• To fit .100” (2.54 mm) grid.
• Easily customized to fit your application.
How To Order
1 oz. (28.34 g) Average Insertion Force Sockets
1
Footprint Dash #
If Applicable*
Body Type
CIS - Standard Molded
HCIS - High Temp. Molded
FIS - FR-4
Number of Pins
004 to 484
*See pages 37 - 64
for PGA footprints
CIS
068
-01
T
G
Contact Plating
G - Gold
T - Tin-Lead
Terminal Plating
G - Gold
T - Tin-Lead
Terminal Type
See next page
for terminal types
Terminals and Contacts:
Terminal: Brass - Copper Alloy (C36000)
ASTM-B-16
Contact: Beryllium Copper (C17200)
ASTM-B-194
How To Order
2.5 oz. (70.85 g) Average Insertion Force Sockets
1
Footprint Dash #
If Applicable*
Body Type
CS - Standard Molded
HCS - High Temp. Molded
FS - FR-4
Number of Pins
004 to 484
*See pages 37 - 64
for PGA footprints
Solder Preform:
63% Tin, 37% Lead
CS
068
-01
T
G
Contact Plating
G - Gold
T - Tin-Lead
Terminal Plating
G - Gold
T - Tin-Lead
Plating:
Terminal: Gold over Nickel or
Tin-Lead over Nickel
Contact: Gold over Nickel or
Tin-Lead over Nickel
Gold per MIL-G-45204
Tin-Lead per MIL-P-81728
Nickel per QQ-N-290
Terminal Type
See next page
for terminal types
Sealant Options
RTV
Seal
Body Material:
CS/CIS -
Glass Filled Thermoplastic
Polyester (P.B.T.), U.L. Rated 94V-O,
-60˚C to 140˚C (-76˚F to 284˚F)
HCS/HCIS -
High Temp. Glass Filled
Thermoplastic (P.P.S.) , U.L. Rated 94V-O,
-60˚C to 260˚C (-76˚F to 500˚F)
FS/FIS -
FR-4 Fiberglass Epoxy Board,
U.L. Rated 94V-O, Index 140˚C (284˚F)
RTV Sealed
To order: Add RTV to end of part #
Note: RTV not available with HCS or HCIS Insulators
Tape Sealed
To order: Add 3M to end of part #
Page 32
Products shown covered by patents issued and/or pending. Specifications subject to change without notice.
inch/(mm)
A new type of high-voltage, high-power, small-signal amplifier circuit
Abstract: The characteristics and working principles of UC3637 dual PWM controller and IR2110 are briefly analyzed. A high-voltage, high-power, small-signal amplifier circuit is constructed by UC3637 ...
zbz0529 Power technology
Sincerely invite you to participate in the compatibility test of VU2.2 in the field of embedded unit testing, and give away the official license
Embedded unit testing has always been a difficult point in unit testing. Generally, there are two execution methods: one is to execute on a simulator or target machine, and the other is to execute on ...
visualunit Embedded System
[MSP430 Sharing] MSP430 Program Explanation
MSP430 programming explanation is hopefully useful for beginners...
hangsky Microcontroller MCU
Simulation of Spaceborne Synthetic Aperture Radar Echo Signal
Abstract: The spatial geometric relationship of spaceborne synthetic aperture radar and the satellite orbit perturbation equation are analyzed, and a spaceborne SAR echo signal simulation method based...
JasonYoo Embedded System
A method for compressing amplitude values in waveform storage table of DDS
A method for compressing the amplitude value of the waveform storage table of DDS....
shiyuxin052 MCU
Video surveillance solutions based on PON (passive optical network)
[font=Verdana][b]1. Background[/b] In 2008, the pilot projects of alarm and monitoring systems in 22 cities and the second batch of cities for demonstration of strengthening police force with science ...
xyh_521 Industrial Control Electronics

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 438  2195  187  683  2094  9  45  4  14  43 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号