Commercial Chip - X7R
16Vdc to 10kVdc
A range of commercial MLC chip capacitors in Stable EIA Class
II dielectric. Class II X7R chips are used as decoupling, by-pass,
filtering and transient voltage suppression elements and exhibit
+/-15% temperature coefficient and predictable variation of
electrical properties with time, temperature and voltage.
Designed for surface mount application with nickel barrier
terminations making them suitable for solder wave and reflow
solder board attachment as well as vapor phase attachment for
part sizes 2225 or smaller. Silver-palladium terminations are also
available for hybrid use with conductive epoxy.
Standard EIA case sizes and available C/V values are listed below
- special sizes, thicknesses and other voltage ratings are available;
please contact the sales office for information.
Capacitance and voltage selection for popular chip sizes
Size
Min cap.
Tmax
inches:
mm:
0402
121
0. 024
0.61
0504
121
0.044
1.12
0603
121
0.035
0.89
0805
121
0.054
1.37
1005
121
0.054
1.37
1206
121
0.064
1.63
1210
121
0.065
1.63
1515
151
0.130
3.02
1808
151
0.065
1.63
1812
151
0.065
1.63
1825
471
0.080
2.03
151
0.080*
2.03
151
0.100*
2.54
471
0.140*
3.56
16V
25V
50V
100V
200V
250V
300V
400V
500V
600V
800V
†
1kV
†
1.5kV
†
2kV
†
3kV
†
4kV
†
5kV
†
6kV
†
7kV
†
8kV
†
9kV
†
10kV
†
†
562
472
472
472
222
152
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
393
333
333
333
153
103
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
273
223
223
223
103
682
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
124
104
104
683
333
273
153
123
123
822
472
272
•
•
•
•
•
•
•
•
•
•
154
124
124
823
473
393
183
123
822
822
472
272
•
•
•
•
•
•
•
•
•
•
334
274
274
184
104
683
473
273
223
183
103
682
222
102
•
•
•
•
•
•
•
•
474
474
474
334
184
124
823
563
563
393
273
153
472
222
•
•
•
•
•
•
•
•
125
105
824
684
564
394
274
224
154
124
823
563
183
822
152
122
•
•
•
•
•
•
684
564
394
274
184
124
823
563
563
393
273
153
472
272
561
331
•
•
•
•
•
•
824
564
564
394
224
154
104
823
683
563
333
223
682
332
821
391
•
•
•
•
•
•
125
105
824
564
334
224
154
104
104
683
473
273
822
472
122
681
•
•
•
•
•
•
155
125
125
824
564
394
224
184
154
124
683
473
153
682
122
122
•
•
•
•
•
•
185
155
155
125
824
684
474
334
334
224
124
823
273
123
472
152
821
•
•
•
•
•
225
225
225
185
155
125
824
564
474
394
274
154
563
273
103
272
182
•
•
•
•
Units rated above 800V may require conformal coating to preclude arcing over chip surface
20
Phone: +1.661.295.5920 | www.novacap.com
Chip Ordering Information
High Reliability
Testing
High Reliability
Test Criteria
-
HB
Positive
Class
X5R VTC
II
E/G W
P
Termination
Capacitance
Capacitance
Tolerance
Packaging
T
None
M
Special
Thickness
Case Size
Dielectric
XX
1206
N
472
J
101
N
X050
H
Capacitance Code
1st two digits are
significant, third
digit denotes
number of zeros,
R = decimal
Examples:
1R0 = 1.0pF
120 = 12pF
471 = 470pF
102 = 1,000pF
273 = 0.027µF
474 = 0.47µF
105 = 1.0µF
X
Special Thickness
None
Standard thickness
as per Novacap
catalog specifications
Denotes a special
thickness other than
standard. Specify in
inches if required.
(As shown above
X
= 0.050”)
Packaging
None
T
W
Bulk
Tape and Reel
Waffle Pack
Marking
Unmarked
Marked
*
Marking not
available on
sizes < 0603
High Reliability
Testing
None
Standard product
H
H
High Reliability Testing
High Temp Screening
Dielectric Codes
N
M
F
D
K
R
Y
Z
B
C
X
S
E
G
W
P
RN
RB
C0G/NP0
C0G/NP0
C0G/NP0
C0G/NP0
R3L
R2D
Y5V
Z5U
X7R
X7R
BX
X8R
Class II
Class II
X5R
Positive VTC
NP0
X7R
Ultra Stable
Ultra Stable Magnetic Free
High Temp. (up to 160ºC)
High Temp. (up to 200ºC)
Ultra Stable
Pulse Energy
General Purpose
General Purpose
Stable
Stable Magnetic Free
MIL
High Temp. (up to 150ºC)
High Temp. (up to 200ºC)
High Temp. (up to 160ºC)
Stable
Pulse Power
RoHS 2013 < 200V
RoHS 2013 < 200V
B
{
Hi-Reliability
Testing Criteria
HB
MIL-PRF-55681 Group A
HK
MIL-PRF-38534 Class K
HS
MIL-PRF-123 Group A
Termination Codes
Voltage Code
1st two digits are significant,
third digit denotes number of
zeros. For example:
160 =
101 =
501 =
102 =
502 =
103 =
16 Volts
100 Volts
500 Volts
1,000 Volts
5,000 Volts
10,000 Volts
P
PR
K
N
Y
NG
C
D
B
E
S
Palladium Silver
Palladium Silver*
Solderable Palladium Silver*
Nickel Barrier*
Nickel Barrier
Nickel Barrier Gold Flash*
FlexiCap™/Nickel Barrier*
FlexiCap™/Nickel Barrier
Copper Barrier*
Copper Barrier
Silver*
100% tin
90% tin, 10% lead
100% tin
90% tin, 10% lead
100% tin
90% tin, 10% lead
*
Indicates RoHS terminations
Capacitance Tolerance Codes
Code Tolerance
*
Not RF series
Cap. Value
< 10pF
C0G/NP0
N
•
•
•
•
•
•
•
•
•
•
M
•
•
•
•
•
•
•
•
•
•
•
•
F/D
Y5V
R3L
R2D Z5U
X7R
B
C
BX
X
K
•
•
R
Y/Z
±0.10pF
±0.25pF
±0.50pF
±1%
±2%
±5%
±10%
±20%
+80% -20%
+100% -0%
Prefix Definitions
None
RF
LS
ES
ST
SM
CR
RC
Standard chip
Improved ESR Capacitor
Y
3
Certified Safety Capacitor
Y Certified Safety Capacitor
2
C
D
p. 23
p. 42 - 43
p. 42 - 43
p. 48 - 53
p. 48 - 53
p. 54
p. 58 - 61
F
G
J
K
M
Z
P
•
•
•
•
•
•
•
•
•
•
•
•
•*
•
•
•*
•*
•
•
•
•*
•
•
•
•
•
•
•
•
•
•
•
•
•
•
Stacked Capacitor Assembly
Stacked Hi-Rel Capacitor Assembly
Cap-Rack Capacitor Array
Bleed Resistor
Marking
M
X8R
S
Voltage
Prefix
Phone: +1.661.295.5920 | www.novacap.com
15
Technical Summary
W
Technical Information
Novacap provides application notes throughout this catalog as
a guide to chip selection and attachment methods. Refer to the
Novacap Technical Brochure found at www.novacap.com for
more details. This technical information includes the nature of
capacitance, dielectric properties, electrical properties, classes
of dielectrics, ferroelectric behavior, test standards, and high
reliability test plans. Please do not hesitate to contact the sales
office for any product or technical assistance.
Capacitor Size
Size availability is based primarily on capacitance values and
voltage rating. Smaller units are generally less expensive.
Because mass affects the thermal shock susceptibility of chip
capacitors, size selection should consider the soldering method
used to attach the chip to the board. Sizes 1812 and smaller
can be wave, vapor phase, or reflow soldered. Larger units
require reflow soldering.
Chip Selection
Multilayer capacitors (MLC) are categorized by dielectric
performance with temperature. The Temperature Coefficient
of Capacitance describes the variance of capacitance value with
temperature. The choice of components is therefore largely
determined by the temperature stability required of the device
and the size necessary for the desired capacitance value and
voltage rating.
Packaging
Units are available reeled, in waffle pack, or bulk packaged. Bar
coded labels are standard for reeled and bulk packaging.
Primary Dielectric Types
T
MB
C0G/NP0:
Ultra stable Class I dielectric, with negligible dependence of
capacitance on temperature, voltage, frequency, and time. Used
in circuitry requiring very stable performance.
X7R:
Stable Class II dielectric, with predictable change in properties
across a temperature range of -55°C to +125°C. Used as
blocking, decoupling, bypassing, and frequency discriminating
elements. This dielectric is ferroelectric and provides higher
capacitance than Class I materials.
BX:
The military specification for ceramic chip capacitors (MIL-
PRF-55681) defines a mid-K stable dielectric designated as BX.
The BX specification has voltage temperature limits in addition
to temperature limits of capacitance. The BX dielectric is limited
to ±15% maximum change in capacitance between 25°C and
-55°C or +125°C and also has a voltage restriction of +15%
/ -25% maximum change in capacitance between 25°C and
-55°C or +125°C at rated voltage.
Z5U/Y5V:
General purpose Class III dielectrics with higher dielectric
constant and greater variation of properties over temperature
and voltage. Very high capacitance per volume is attainable
for general purpose applications where stability over a wide
temperature range is not critical.
FlexiCap™/Nickel Barrier
100% tin
FlexiCap™/Nickel Barrier
90/10% tin/lead
Dielectric
Termination
Combinations
Nickel Barrier
90/10% tin/lead
Palladium Silver
Palladium Silver
Solderable
Palladium Silver
Nickel Barrier
100% tin
Nickel Barrier
Gold flash
Termination Material
Copper Barrier
90/10% tin/lead
Solderable Silver
We recommend the following
termination types:
Solder Attachment:
N
Nickel Barrier, 100% matte tin
plated - RoHS
C
FlexiCap™ with Nickel Barrier,
100% tin plated - RoHS
Y
Nickel Barrier, tin-lead plated
D
FlexiCap™ Nickel Barrier, tin-lead
plated
B
Copper Barrier 100% matte tin
plated - RoHS
E
Copper Barrier, tin-lead plated
K
Solderable Palladium Silver -
RoHS
S
Solderable Silver - RoHS
Palladium Silver
Dielectric
Code
N/RN
C0G/NP0
K
R3L
B/RB
X7R
W
X5R
X
BX
Y
Y5V
Z
Z5U
M
C0G/NP0 (
Mag free
)
C
X7R (
Mag free
)
S
X8R
F
C0G/NP0 (160ºC)
D
C0G/NP0 (200ºC)
G
Class II (160ºC)
E
Class II (200ºC)
P
Pulse Power
R
R2D
P
•
•
•
•
•
•
•
•
•
•
•
RoHS RoHS RoHS
PR
K
N
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
Y
•
•
•
•
•
•
•
RoHS RoHS
NG
C
•
•
•
•
•
•
•
•
•
•
•
D
•
•
•
•
•
•
RoHS
B
Copper Barrier
100% tin
E
RoHS
S
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
Conductive Epoxy attachment:
P
PR
Palladium Silver - RoHS
NG
Nickel Barrier Gold Flash,
also suitable for soldering
attachment - RoHS
Phone: +1.661.295.5920 | www.novacap.com
3
Dielectric Characteristics
X7R (B) Stable and RoHS 2013 (RB) type
Operating temperature range:
Temperature coefficient :
Dissipation factor
Insulation resistance:
Dielectric
withstanding
voltage
Ageing rate:
Test parameters:
>25V rating:
<25V rating:
@25ºC:
@125ºC:
<200V:
201-500V:
>500V:
-55°C to 125°C
±15%
DC
Max.
2.5% max
3.5% max
>100GW or >1000WF
whichever is less
>10GW or >100WF
whichever is less
250%
150% or 500V
whichever is greater
120% or 750V
whichever is greater
<2.0% per decade
1KHz, 1.0 ±0.2 VRMS, 25°C
%CAPACITANCE CHANGE
%DC
TEMPERATURE COEFFICIENT
UPPER LIMIT
20
15
10
5
0
-5
-10
-15
-20
-55
-35
-15
5
25
TYPICAL
LOWER LIMIT
45
65
85
105
125
TEMPERATURE °C
X7R (C) Stable Non Magnetic
Operating temperature range:
Temperature coefficient:
Dissipation factor
Insulation resistance:
Dielectric
withstanding
voltage
Ageing rate:
Test parameters:
>25V rating:
<25V rating:
@25ºC:
@125ºC:
<200V:
201-500V:
>500V:
-55°C to 125°C
±15%
DC
Max.
2.5% max
3.5% max
>100GW or >1000WF
whichever is less
>10GW or >100WF
whichever is less
250%
150% or 500V
whichever is greater
120% or 750V
whichever is greater
<2.0% per decade
1KHz, 1.0 ±0.2 VRMS, 25°C
%CAPACITANCE CHANGE
%DC
TEMPERATURE COEFFICIENT
UPPER LIMIT
20
15
10
5
0
-5
-10
-15
-20
-55
-35
-15
5
25
TYPICAL
LOWER LIMIT
45
65
85
105
125
TEMPERATURE °C
BX (X) Stable
Operating temperature range:
Temperature coefficient:
Temp-voltage coefficient:
Dissipation factor
Insulation resistance:
Dielectric
withstanding
voltage
Ageing rate:
Test parameters:
>25V rating:
<25V rating:
@25ºC:
@125ºC:
<200V:
201-500V:
>500V:
-55°C to 125°C
±15%
DC
Max.
+15% -25%
DC
Max.
2.5% max
3.5% max
>100GW or >1000WF
whichever is less
>10GW or >100WF
whichever is less
250%
150% or 500V
whichever is greater
120% or 750V
whichever is greater
<2.0% per decade
1KHz, 1.0 ±0.2 VRMS, 25°C
%DC
TEMPERATURE COEFFICIENT
UPPER LIMIT
20
%CAPACITANCE CHANGE
15
10
5
0
-5
-10
-15
-20
-55
-35
-15
5
25
TYPICAL
LOWER LIMIT
45
65
85
105
125
TEMPERATURE °C
X8R (S) Stable
Operating temperature range:
Temp. coefficient <150ºC:
Dissipation factor
Insulation
resistance
Dielectric
withstanding
voltage
Ageing rate:
Test parameters:
>25V rating:
<25V rating:
@25ºC:
@150ºC:
<200V:
201-500V:
>500V:
-55°C to 150°C
% CAPACITANCE CHANGE
%DC
TEMPERATURE COEFFICIENT
±15%
DC
Max.
2.5% max
3.5% max
>100GW or >1000WF
whichever is less
>10GW or >100WF
whichever is less
250%
150% or 500V
whichever is greater
120% or 750V
whichever is greater
<2.0% per decade
1KHz, 1.0 ±0.2 VRMS, 25°C
40
20
0
-20
-40
-55
-25
0
25
50
75
100
125
150
TEMPERATURE °C
6
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