2SK3913-01MR
N-CHANNEL SILICON POWER MOSFET
Outline Drawings
(mm)
TO-220F
200406
FUJI POWER MOSFET
Super FAP-G Series
Features
High speed switching
No secondary breadown
Avalanche-proof
Low on-resistance
Low driving power
Applications
Switching regulators
DC-DC converters
UPS (Uninterruptible Power Supply)
Maximum ratings and characteristic
Absolute maximum ratings
(Tc=25°C unless otherwise specified)
Item
Drain-source voltage
Continuous Drain Current
Pulsed Drain Current
Gate-Source Voltage
Maximum Avalanche current
Non-Repetitive
Maximum Avalanche Energy
Repetitive
Maximum Avalanche Energy
Maximum Drain-Source dV/dt
Peak Diode Recovery dV/dt
Peak Diode Recovery -di/dt
Max. Power Dissipation
Symbol
V
DS
V
DSX
I
D
I
D(puls]
V
GS
I
AR
E
AS
E
AR
dV
DS
/dt
dV/dt
-di/dt
P
D
Ratings
250
220
14
±56
±30
14
301.1
3.7
20
5
100
37
2.16
+150
Unit
V
V
A
A
V
A
mJ
mJ
Remarks
V
GS
=-30V
Equivalent circuit schematic
Drain(D)
Note *1
Note *2
Note *3
Gate(G)
Source(S)
Note *1:Tch
<
150°C,Repetitive and Non-repetitive
=
Note *2:StartingTch=25°C,I
AS
=6A,L=14.1mH,
V
CC
=48V,R
G
=50Ω
kV/µs V
DS
< 250V
EAS limited by maximum channel temperature
=
kV/µs Note *4
and avalanch current.
A/µs Note *5
See to the ‘Avalanche Energy’ graph
Tc=25°C
W
Note *3:Repetitive rating:Pulse width limited by
Ta=25°C
maximum channel temperature.
Operating and Storage
T
ch
°C
See to the ‘Transient Theemal impedance’
Temperature range
T
stg
-55 to +150 °C
graph
Isolation Voltage
V
ISO
2
kVrms t=60sec f=60Hz
Note *4:I
F
<
-I
D
, -di/dt=100A/
µ
s,V
CC
BV
DSS
,Tch
<
150°C
<
=
=
=
Note *5:I
F
<
-I
D
, dv/dt=5kV/
µ
s,V
CC
<
BV
DSS
,Tch
<
150°C
Electrical characteristics (T
c
=25°C unless otherwise specified)
=
=
=
Item
Drain-Source Breakdown Voltaget
Gate Threshold Voltage
Zero Gate Voltage Drain Current
Gate-Source Leakage Current
Drain-Source On-State Resistance
Forward Transcondutance
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Turn-On Time t
on
Turn-Off Time t
off
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
Diode forward on-voltage
Reverse recovery time
Reverse recovery charge
Symbol
BV
DSS
V
GS(th)
I
DSS
I
GSS
R
DS(on)
g
fs
C
iss
C
oss
C
rss
td
(on)
t
r
td
(off)
t
f
Q
G
Q
GS
Q
GD
V
SD
t
rr
Q
rr
Symbol
R
th(ch-c)
R
th(ch-a)
Test Conditions
I
D
= 250µA
V
GS
=0V
I
D
= 250µA
V
DS
=V
GS
V
DS
=250V V
GS
=0V
V
DS
=200V V
GS
=0V
V
GS
=±30V V
DS
=0V
I
D
=7A V
GS
=10V
I
D
=7A V
DS
=25V
V
DS
=75V
V
GS
=0V
f=1MH
V
CC
=48V I
D
=7A
V
GS
=10V
R
GS
=10
Ω
V
CC
=125V
I
D
=14A
V
GS
=10V
I
F
=14A V
GS
=0V T
ch
=25°C
I
F
=14A V
GS
=0V
-di/dt=100A/µs T
ch
=25°C
Test Conditions
channel to case
channel to ambient
T
ch
=25°C
T
ch
=125°C
220
10
780
90
6.0
12
3
23
6
22
7.0
6.0
1.00
120
0.5
Min.
250
3.0
Typ.
Max.
5.0
25
2
100
280
1170
135
9.0
18
4.5
35
9
33
11
9.0
1.50
250
1.25
Units
V
V
µA
mA
nA
mΩ
S
pF
5
ns
nC
V
ns
µC
Thermalcharacteristics
Item
Thermal resistance
www.fujielectric.co.jp/fdt/scd
Min.
Typ.
Max.
3.378
58
Units
°C/W
°C/W
1
2SK3913-01MR
Characteristics
Allowable Power Dissipation
PD=f(Tc)
FUJI POWER MOSFET
40
35
Typical Output Characteristics
ID=f(VDS):80
µ
s pulse test,Tch=25
°
C
35
30
20V
10V
30
25
8V
25
PD [W]
20
ID [A]
20
15
15
10
10
5
7V
6.5V
5
VGS=6V
0
0
25
50
75
100
125
150
0
0
2
4
6
8
10
12
14
16
Tc [
°
C]
VDS [V]
Typical Transfer Characteristic
ID=f(VGS):80
µ
s pulse test,VDS=25V,Tch=25
°
C
100
Typical Transconductance
gfs=f(ID):80
µ
s pulse test,VDS=25V,Tch=25
°
C
10
10
ID[A]
1
gfs [S]
1
0
1
2
3
4
5
6
7
8
9
10
0.1
0.1
0.1
0.01
1
10
100
VGS[V]
ID [A]
1.0
0.9
Typical Drain-Source on-state Resistance
RDS(on)=f(ID):80
µ
s pulse test,Tch=25
°
C
VGS=6.5V
7.0V
7.5V
0.8
Drain-Source On-state Resistance
RDS(on)=f(Tch):ID=7A,VGS=10V
0.7
0.8
0.6
8V
0.7
RDS(on) [
Ω
]
RDS(on) [
Ω
]
0.6
0.5
0.4
0.3
0.5
10V
20V
0.4
max.
0.3
typ.
0.2
0.2
0.1
0.0
0
5
10
15
20
25
30
35
0.1
0.0
-50
-25
0
25
50
75
100
125
150
ID [A]
Tch [
°
C]
2
2SK3913-01MR
Gate Threshold Voltage vs. Tch
VGS(th)=f(Tch):VDS=VGS,ID=250uA
FUJI POWER MOSFET
7
24
Typical Gate Charge Characteristics
VGS=f(Qg):ID=14A,Tch=25
°
C
6
20
Vcc= 50V
250V
200V
5
max.
16
VGS(th) [V]
VGS [V]
4
12
3
min.
8
2
1
4
0
-50
-25
0
25
50
75
100
125
150
0
0
10
20
30
40
50
60
70
Tch [
°
C]
Qg [nC]
10n
Typical Capacitance
C=f(VDS):VGS=0V,f=1MHz
100
Typical Forward Characteristics of Reverse Diode
IF=f(VSD):80
µ
s pulse test,Tch=25
°
C
1n
Ciss
10
C [F]
100p
Coss
IF [A]
1
Crss
0.1
0.00
10p
1p
-1
10
10
0
10
1
10
2
10
3
0.25
0.50
0.75
1.00
1.25
1.50
VDS [V]
VSD [V]
10
3
Typical Switching Characteristics vs. ID
t=f(ID):Vcc=48V,VGS=10V,RG=10
Ω
350
Maximum Avalanche Energy vs. starting Tch
E(AV)=f(starting Tch):Vcc=48V,I(AV)<=14A
300
I
AS
=5.6A
tf
10
2
250
EAV [mJ]
td(off)
200
I
AS
=8.4A
150
I
AS
=14A
100
t [ns]
td(on)
10
1
tr
50
10
0
0
-1
10
10
0
10
1
10
2
0
25
50
75
100
125
150
ID [A]
starting Tch [
°
C]
3
Analog electronics
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