2SK3926-01MR
N-CHANNEL SILICON POWER MOSFET
Outline Drawings
(mm)
TO-220F
200406
FUJI POWER MOSFET
Super FAP-G Series
Features
High speed switching
No secondary breadown
Avalanche-proof
Low on-resistance
Low driving power
Applications
Switching regulators
DC-DC converters
UPS (Uninterruptible Power Supply)
Maximum ratings and characteristic
Absolute maximum ratings
(Tc=25°C unless otherwise specified)
Item
Drain-source voltage
Continuous Drain Current
Pulsed Drain Current
Gate-Source Voltage
Maximum Avalanche current
Non-Repetitive
Maximum Avalanche Energy
Repetitive
Maximum Avalanche Energy
Maximum Drain-Source dV/dt
Peak Diode Recovery dV/dt
Peak Diode Recovery -di/dt
Max. Power Dissipation
Operating and Storage
Temperature range
Isolation Voltage
Symbol
V
DS
V
DSX
I
D
I
D(puls]
V
GS
I
AR
E
AS
E
AR
dV
DS
/dt
dV/dt
-di/dt
P
D
T
ch
T
stg
V
ISO
Ratings
250
220
34
±136
±30
34
665.7
9.5
20
5
100
95
2.16
+150
-55 to +150
2
Unit
V
V
A
A
V
A
mJ
mJ
Remarks
V
GS
=-30V
Equivalent circuit schematic
Drain(D)
Note *1
Note *2
Note *3
Gate(G)
Source(S)
Note *1:Tch < 150°C,Repetitive and Non-repetitive
=
Note *2:StartingTch=25°C,I
AS
=14A,L=5.71mH,
V
CC
=48V,R
G
=50Ω
EAS limited by maximum channel temperature
and avalanch current.
See to the ‘Avalanche Energy’ graph
Note *3:Repetitive rating:Pulse width limited by
maximum channel temperature.
See to the ‘Transient Theemal impedance’
graph
kV/µs V
DS
< 250V
=
kV/µs Note *4
A/µs Note *5
Tc=25°C
W
Ta=25°C
°C
°C
kVrms t=60sec, f=60Hz
Electrical characteristics (T
c
=25°C unless otherwise specified)
Item
Drain-Source Breakdown Voltaget
Gate Threshold Voltage
Zero Gate Voltage Drain Current
Gate-Source Leakage Current
Drain-Source On-State Resistance
Forward Transcondutance
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Turn-On Time t
on
Turn-Off Time t
off
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
Diode forward on-voltage
Reverse recovery time
Reverse recovery charge
Symbol
BV
DSS
V
GS(th)
I
DSS
I
GSS
R
DS(on)
g
fs
C
iss
C
oss
C
rss
td
(on)
t
r
td
(off)
t
f
Q
G
Q
GS
Q
GD
V
SD
t
rr
Q
rr
Symbol
R
th(ch-c)
R
th(ch-a)
Note *4:I
F
< -I
D
, -di/dt=100A/
µ
s,V
CC
< BV
DSS
,Tch< 150°C
=
=
=
<
Note *5:I
F
< -I
D
, dv/dt=5kV/
µ
s,V
CC
BV
DSS
,Tch< 150°C
=
=
=
Test Conditions
I
D
= 250µA
V
GS
=0V
µA
I
D
= 250
V
DS
=V
GS
T
ch
=25°C
V
DS
=250V V
GS
=0V
T
ch
=125°C
V
DS
=200V V
GS
=0V
V
GS
=±30V V
DS
=0V
I
D
=17A V
GS
=10V
I
D
=17A V
DS
=25V
V
DS
=75V
V
GS
=0V
f=1MH
V
CC
=48V I
D
=17A
V
GS
=10V
R
GS
=10
Ω
V
CC
=125V
I
D
=34A
V
GS
=10V
I
F
=34A V
GS
=0V T
ch
=25°C
I
F
=34A V
GS
=0V
-di/dt=100A/µs T
ch
=25°C
Test Conditions
channel to case
channel to ambient
Min.
250
3.0
Typ.
Max.
5.0
25
2.0
100
110
Units
V
V
µA
mA
nA
mΩ
S
pF
13
85
26
1850
2800
220
330
21
32
20
30
19
29
56
85
19
29
56
85
20
30
19
29
1.00
1.50
140
250
0.5
1.25
ns
nC
V
ns
µC
Thermalcharacteristics
Item
Thermal resistance
www.fujielectric.co.jp/fdt/scd
Min.
Typ.
Max.
1.316
58
Units
°C/W
°C/W
1
2SK3926-01MR
Characteristics
Allowable Power Dissipation
PD=f(Tc)
FUJI POWER MOSFET
120
100
90
Typical Output Characteristics
ID=f(VDS):80
µ
s pulse test,Tch=25
°
C
20V
10V
100
80
70
80
60
7.5V
ID [A]
PD [W]
7V
50
40
6.5V
60
40
30
20
20
10
0
0
25
50
75
100
125
150
0
0
2
4
6
8
10
12
VGS=6V
14
16
Tc [
°
C]
VDS [V]
100
Typical Transfer Characteristic
ID=f(VGS):80
µ
s pulse test,VDS=25V,Tch=25
°
C
100
Typical Transconductance
gfs=f(ID):80
µ
s pulse test,VDS=25V,Tch=25
°
C
10
10
ID[A]
1
gfs [S]
1
0.1
0.1
0.1
0.01
0
1
2
3
4
5
6
7
8
9
10
1
10
100
VGS[V]
ID [A]
0.20
Typical Drain-Source on-state Resistance
RDS(on)=f(ID):80
µ
s pulse test,Tch=25
°
C
VGS=6.5V
7.0V
0.30
Drain-Source On-state Resistance
RDS(on)=f(Tch):ID=17A,VGS=10V
0.18
0.25
0.16
RDS(on) [
Ω
]
7.5V
10V
20V
0.14
RDS(on) [
Ω
]
8V
0.20
0.15
max.
0.12
0.10
0.10
typ.
0.08
0.05
0.06
0
10
20
30
40
50
60
70
80
90
0.00
-50
-25
0
25
50
75
100
125
150
ID [A]
Tch [
°
C]
2
2SK3926-01MR
Gate Threshold Voltage vs. Tch
VGS(th)=f(Tch):VDS=VGS,ID=250uA
FUJI POWER MOSFET
7
24
Typical Gate Charge Characteristics
VGS=f(Qg):ID=34A,Tch=25
°
C
6
20
Vcc= 50V
5
max.
16
250V
200V
VGS(th) [V]
VGS [V]
4
12
3
min.
8
2
1
4
0
-50
-25
0
25
50
75
100
125
150
0
0
20
40
60
80
100
120
140
Tch [
°
C]
Qg [nC]
10n
Typical Capacitance
C=f(VDS):VGS=0V,f=1MHz
100
Typical Forward Characteristics of Reverse Diode
IF=f(VSD):80
µ
s pulse test,Tch=25
°
C
Ciss
1n
10
C [F]
Coss
100p
1
Crss
10p
-1
10
0
1
2
3
IF [A]
0.1
0.00
10
10
10
10
0.25
0.50
0.75
1.00
1.25
1.50
VDS [V]
VSD [V]
10
3
Typical Switching Characteristics vs. ID
t=f(ID):Vcc=48V,VGS=10V,RG=10
Ω
Maximum Avalanche Energy vs. starting Tch
E(AV)=f(starting Tch):Vcc=48V,I(AV)<=34A
700
I
AS
=14A
600
tf
500
10
2
td(off)
td(on)
10
1
EAV [mJ]
400 I
AS
=21A
t [ns]
300
I
AS
=34A
200
tr
100
10
0
0
-1
10
10
0
10
1
10
2
0
25
50
75
100
125
150
ID [A]
starting Tch [
°
C]
3
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