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2SK665

Description
Silicon N-Channel MOS FET
CategoryDiscrete semiconductor    The transistor   
File Size32KB,2 Pages
ManufacturerPanasonic
Websitehttp://www.panasonic.co.jp/semicon/e-index.html
Environmental Compliance
Download Datasheet Parametric View All

2SK665 Overview

Silicon N-Channel MOS FET

2SK665 Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
Parts packaging codeSC-70
package instructionSMALL OUTLINE, R-PDSO-G3
Contacts3
Reach Compliance Codeunknow
ECCN codeEAR99
Other featuresBUILT-IN BIAS RESISTOR RATIO IS 0.02, HIGH INPUT IMPEDANCE
ConfigurationSINGLE WITH BUILT-IN DIODE AND RESISTOR
Minimum drain-source breakdown voltage20 V
Maximum drain current (Abs) (ID)0.1 A
Maximum drain current (ID)0.1 A
Maximum drain-source on-resistance50 Ω
FET technologyMETAL-OXIDE SEMICONDUCTOR
JESD-30 codeR-PDSO-G3
Number of components1
Number of terminals3
Operating modeENHANCEMENT MODE
Maximum operating temperature150 °C
Package body materialPLASTIC/EPOXY
Package shapeRECTANGULAR
Package formSMALL OUTLINE
Peak Reflow Temperature (Celsius)260
Polarity/channel typeN-CHANNEL
Maximum power dissipation(Abs)0.15 W
Certification statusNot Qualified
surface mountYES
Terminal formGULL WING
Terminal locationDUAL
Maximum time at peak reflow temperature10
transistor applicationsSWITCHING
Transistor component materialsSILICON
Base Number Matches1
Silicon MOS FETs (Small Signal)
2SK665
Silicon N-Channel MOS FET
For switching
unit: mm
2.1±0.1
s
Features
q
High-speed switching
q
Small drive current owing to high input inpedance
q
High electrostatic breakdown voltage
0.65
0.425
1.25±0.1
0.425
1
2.0±0.2
1.3±0.1
0.65
3
2
0.9±0.1
0 to 0.1
Parameter
Drain to Source voltage
Gate to Source voltage
Drain current
Max drain current
Allowable power dissipation
Channel temperature
Storage temperature
Symbol
V
DS
V
GSO
I
D
I
DP
P
D
T
ch
T
stg
Ratings
20
8
100
200
150
150
−55
to +150
Unit
V
V
mA
mA
mW
°C
°C
0.7±0.1
0.2±0.1
1: Gate
2: Source
3: Drain
EIAJ: SC-70
S-Mini Type Package (3-pin)
Marking Symbol: 3O
Internal Connection
D
R
1
G
R
2
S
s
Electrical Characteristics
(Ta = 25°C)
Parameter
Drain to Source cut-off current
Gate to Source leakage current
Drain to Source breakdown voltage
Gate threshold voltage
Drain to Source ON-resistance
Forward transfer admittance
High level output voltage
Low level output voltage
Input resistance
Turn-on time
Turn-off time
*1
Symbol
I
DSS
I
GSS
V
DSS
V
th
R
DS(on)*3
| Y
fs
|
Conditions
V
DS
= 10V, V
GS
= 0
V
GS
= 8V, V
DS
= 0
I
D
= 100µA, V
GS
= 0
I
D
= 100µA, V
DS
= V
GS
I
D
= 20mA, V
GS
= 5V
I
D
= 20mA, V
DS
= 5V, f = 1kHz
min
40
20
1.5
20
4.5
typ
max
10
80
3.5
50
0.15
–0.05
+0.1
s
Absolute Maximum Ratings
(Ta = 25°C)
0.2
0.3
–0
+0.1
Unit
µA
µA
V
V
mS
V
V
kΩ
µs
µs
V
OH
V
DD
= 5V, V
GS
= 1V, R
L
= 200Ω
V
SL
V
DD
= 5V, V
GS
= 5V, R
L
= 200Ω
*1
R
1
+ R
2
t
on
t
off*2
*2
*2
1
100
200
1
1
V
DD
= 5V, V
GS
= 0 to 5V, R
L
= 200Ω
V
DD
= 5V, V
GS
= 5 to 0V, R
L
= 200Ω
*3
Resistance ratio R
1
/R
2
= 1/50
V
out
200Ω
t
on
, t
off
measurement circuit
Pulse measurement
90%
100µF
V
GS
= 5V
50Ω
V
in
V
DD
= 5V
V
out
10%
10%
90%
t
on
t
off
1

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