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A2F500M3E-1FGG484I

Description
Field Programmable Gate Array, 11520 CLBs, 500000 Gates, 100MHz, 11520-Cell, CMOS, PBGA484, 1 MM PITCH, GREEN, FBGA-484
CategoryProgrammable logic devices    Programmable logic   
File Size9MB,182 Pages
ManufacturerMicrosemi
Websitehttps://www.microsemi.com
Environmental Compliance
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A2F500M3E-1FGG484I Overview

Field Programmable Gate Array, 11520 CLBs, 500000 Gates, 100MHz, 11520-Cell, CMOS, PBGA484, 1 MM PITCH, GREEN, FBGA-484

A2F500M3E-1FGG484I Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerMicrosemi
package instructionBGA, BGA484,26X26,40
Reach Compliance Codecompliant
maximum clock frequency100 MHz
JESD-30 codeS-PBGA-B484
JESD-609 codee1
length23 mm
Humidity sensitivity level3
Configurable number of logic blocks11520
Equivalent number of gates500000
Number of entries128
Number of logical units11520
Output times128
Number of terminals484
Maximum operating temperature100 °C
Minimum operating temperature-40 °C
organize11520 CLBS, 500000 GATES
Package body materialPLASTIC/EPOXY
encapsulated codeBGA
Encapsulate equivalent codeBGA484,26X26,40
Package shapeSQUARE
Package formGRID ARRAY
Peak Reflow Temperature (Celsius)250
power supply1.5,1.8,2.5,3.3 V
Programmable logic typeFIELD PROGRAMMABLE GATE ARRAY
Certification statusNot Qualified
Maximum seat height2.44 mm
Maximum supply voltage1.575 V
Minimum supply voltage1.425 V
Nominal supply voltage1.5 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceTin/Silver/Copper (Sn/Ag/Cu)
Terminal formBALL
Terminal pitch1 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperature40
width23 mm
Revision 7
SmartFusion Customizable System-on-Chip (cSoC)
Microcontroller Subsystem (MSS)
Hard 100 MHz 32-Bit ARM
®
Cortex™-M3
– 1.25 DMIPS/MHz Throughput from Zero Wait State
Memory
– Memory Protection Unit (MPU)
– Single Cycle Multiplication, Hardware Divide
– JTAG Debug (4 wires), Serial Wire Debug (SWD, 2
wires), and Single Wire Viewer (SWV) Interfaces
Internal Memory
– Embedded Nonvolatile Flash Memory (eNVM), 128
Kbytes to 512 Kbytes
– Embedded High-Speed SRAM (eSRAM), 16 Kbytes
to 64 Kbytes, Implemented in 2 Physical Blocks to
Enable Simultaneous Access from 2 Different
Masters
Multi-Layer AHB Communications Matrix
– Provides up to 16 Gbps of On-Chip Memory
Bandwidth,
1
Allowing Multi-Master Schemes
10/100 Ethernet MAC with RMII Interface
2
Programmable External Memory Controller, Which
Supports:
– Asynchronous Memories
– NOR Flash, SRAM, PSRAM
– Synchronous SRAMs
Two I
2
C Peripherals
Two 16550 Compatible UARTs
Two SPI Peripherals
Two 32-Bit Timers
32-Bit Watchdog Timer
8-Channel DMA Controller to Offload the Cortex-M3
from Data Transactions
Clock Sources
– 32 KHz to 20 MHz Main Oscillator
– Battery-Backed 32 KHz Low Power Oscillator with
Real-Time Counter (RTC)
– 100 MHz Embedded RC Oscillator; 1% Accurate
– Embedded Analog PLL with 4 Output Phases (0, 90,
180, 270)
Based on proven ProASIC
®
3 FPGA Fabric
Low Power, Firm-Error Immune 130-nm, 7-Layer Metal,
Flash-Based CMOS Process
Nonvolatile, Live at Power-Up, Retains Program When
Powered Off
350 MHz System Performance
Embedded SRAMs and FIFOs
– Variable Aspect Ratio 4,608-Bit SRAM Blocks
– x1, x2, x4, x9, and x18 Organizations
– True Dual-Port SRAM (excluding x18)
– Programmable Embedded FIFO Control Logic
Secure ISP with 128-Bit AES via JTAG
FlashLock
®
to Secure FPGA Contents
Five Clock Conditioning Circuits (CCCs) with up to 2
Integrated Analog PLLs
– Phase Shift, Multiply/Divide, and Delay Capabilities
– Frequency: Input 1.5–350 MHz, Output 0.75 to
350 MHz
Programmable Analog
Analog Front-End (AFE)
Up to Three 12-Bit SAR ADCs
– 500 Ksps in 12-Bit Mode
– 550 Ksps in 10-Bit Mode
– 600 Ksps in 8-Bit Mode
Internal 2.56 V Reference or Optional External
Reference
One First-Order
ΣΔ
DAC (sigma-delta) per ADC
– 12-Bit 500 Ksps Update Rate
Up to 5 High-Performance Analog Signal Conditioning
Blocks (SCB) per Device, Each Including:
– Two High-Voltage Bipolar Voltage Monitors (with 4
input ranges from ±2.5 V to –11.5/+14 V) with 1%
Accuracy
– High Gain Current Monitor, Differential Gain = 50, up
to 14 V Common Mode
– Temperature Monitor (Resolution = ¼°C in 12-Bit
Mode; Accurate from –55°C to 150°C)
Up to Ten High-Speed Voltage Comparators
(t
pd
= 15 ns)
Offloads Cortex-M3–Based MSS from Analog
Initialization and Processing of ADC, DAC, and SCBs
Sample Sequence Engine for ADC and DAC Parameter
Set-Up
Post-Processing Engine for Functions such as Low-
Pass Filtering and Linear Transformation
Easily Configured via GUI in Libero
®
Integrated Design
(IDE) Software
FPGA I/Os
– LVDS, PCI, PCI-X, up to 24 mA IOH/IOL
– Up to 350 MHz
MSS I/Os
– Schmitt Trigger, up to 6 mA IOH, 8 mA IOL
– Up to 180 MHz
Single 3.3 V Power Supply with On-Chip 1.5 V Regulator
External 1.5 V Is Allowed by Bypassing Regulator
(digital VCC = 1.5 V for FPGA and MSS, analog VCC =
3.3 V and 1.5 V)
Analog Compute Engine (ACE)
High-Performance FPGA
I/Os and Operating Voltage
1 Theoretical maximum
2 A2F200 and larger devices
August 2011
© 2011 Microsemi Corporation
I
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