S
D
S
ARF1502
D
G
S
ARF1500
BeO
135-05
RF POWER MOSFET
Specified 65 Volt, 27.12 MHz Characteristics:
Output Power = 900 Watts.
Gain = 17dB (Class C)
Efficiency > 75%
MAXIMUM RATINGS
Symbol
V
DSS
V
DGO
I
D
V
GS
P
D
T
J
,T
STG
T
L
Parameter
N - CHANNEL ENHANCEMENT MODE
S
G
S
65V
1500W 40MHz
The ARF1500 is an RF power transistor designed for class C/E operation in very high power scientific, commercial,
medical and industrial RF power generator and amplifier applications up to 40 MHz.
A
IN D
FO VA
R NC
M
ED
AT
IO
N
200
200
70
±30
1500
300
MIN
TYP
High Performance Power RF Package.
Very High Breakdown for Improved Ruggedness.
Low Thermal Resistance.
Nitride Passivated Die for Improved Reliability.
All Ratings: T
C
= 25°C unless otherwise specified.
ARF 1500
UNIT
Volts
Amps
Volts
Watts
°C
Drain-Source Voltage
Drain-Gate Voltage
Continuous Drain Current @ T
C
= 25°C
Gate-Source Voltage
Total Device Dissipation @ T
C
= 25°C
Operating and Storage Junction Temperature Range
Lead Temperature: 0.063" from Case for 10 Sec.
-55 to 200
STATIC ELECTRICAL CHARACTERISTICS
Symbol
BV
DSS
V
DS
(ON)
I
DSS
I
GSS
g
fs
V
isolation
V
GS
(TH)
Characteristic / Test Conditions
On State Drain Voltage
1
MAX
UNIT
Volts
µA
nA
mhos
Volts
Drain-Source Breakdown Voltage (V
GS
= 0V, I
D
= 250 µA)
(I
D
(ON)
= 35A, V
GS
= 10V)
Zero Gate Voltage Drain Current (V
DS
= V
DSS
, V
GS
= 0V)
Gate-Source Leakage Current (V
GS
= ±30V, V
DS
= 0V)
Forward Transconductance (V
DS
= 25V, I
D
= 35A)
RMS Voltage
200
4.0
100
1000
±400
Zero Gate Voltage Drain Current (V
DS
= 0.8 V
DSS
, V
GS
= 0V, T
C
= 125°C)
8
2500
3
11
5
(60Hz Sinewave from terminals to mounting surface for 1 minute)
Gate Threshold Voltage (V
DS
= V
GS
, I
D
= 50mA)
Volts
THERMAL CHARACTERISTICS
Symbol
R
θJC
R
θCS
Characteristic (per package unless otherwise noted)
Junction to Case
Case to Sink
(Use High Efficiency Thermal Joint Compound and Planar Heat Sink Surface.)
MIN
TYP
MAX
UNIT
°C/W
050-5600 Rev - 7-01
0.12
0.09
CAUTION:
These Devices are Sensitive to Electrostatic Discharge. Proper Handling Procedures Should Be Followed.
APT Website - http://www.advancedpower.com
USA:
EUROPE:
405 S.W. Columbia Street
Chemin de Magret
Bend, Oregon 97702 -1035
F-33700 Merignac - France
Phone: (541) 382-8028
Phone: (33) 5 57 92 15 15
FAX: (541) 388-0364
FAX: (33) 5 56 47 97 61
DYNAMIC CHARACTERISTICS
Symbol
C
iss
C
oss
C
rss
t
d(on)
t
r
t
d(off)
t
f
Characteristic
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Turn-on Delay Time
Rise Time
Turn-off Delay Time
Fall Time
Test Conditions
V
GS
= 0V
MIN
TYP
MAX
ARF1502
UNIT
4820
800
210
5
3.0
15
3
6000
1100
290
10
7
25
7
ns
pF
V
DS
= 50V
f = 1 MHz
V
GS
= 15V
V
DD
= 0.5 V
DSS
I
D
= I
D[Cont.]
@ 25°C
R
G
= 1.6
Ω
FUNCTIONAL CHARACTERISTICS
A
IN D
FO VA
R NC
M
ED
AT
IO
N
Test Conditions
f = 27.12 MHz
P
out
= 900W
MIN
TYP
Symbol
G
PS
η
ψ
Characteristic
MAX
UNIT
dB
%
Common Source Amplifier Power Gain
Drain Efficiency
15
70
17
75
V
GS
= 0V
V
DD
= 65V
Electrical Ruggedness VSWR 10:1
No Degradation in Output Power
1
Pulse Test: Pulse width < 380 µS, Duty Cycle < 2%.
APT Reserves the right to change, without notice, the specifications and information contained herein.
1.065
.160
D
S
D
S
.500
HAZARDOUS MATERIAL
WARNING
The ceramic portion of the
device between leads and
mounting surface is beryllium
oxide. Beryllium oxide dust is
highly toxic when inhaled. Care
must be taken during handling
and mounting to avoid damage
to this area. These devices
must never be thrown away with
general industrial or domestic
waste.
G
S
ARF1500
BeO
135-05
1.065
dims: inches
.045
S
G
S
.500
.005
.207
.375
.207
.105 typ.
050-5600 Rev - 7-01
yy
;;
yyyy
;;;;
Clamp
ARF 1500
Compliant
layer
Heat Sink
Thermal Considerations and Package Mounting:
The rated 1500W power dissipation is only available when the package mounting
surface is at 25˚C and the junction temperature is 200˚C. The thermal resistance
between junctions and case mounting surface is 0.12 ˚C/W. When installed, an addi-
tional thermal impedance of 0.09 ˚C/W between the package base and the mounting
surface is typical. Insure that the mounting surface is smooth and flat. Thermal joint
compound must be used to reduce the effects of small surface irregularities. The heat-
sink should incorporate a copper heat spreader to obtain best results.
The package is designed to be clamped to a heatsink. A clamped joint maintains the
required mounting pressure while allowing for thermal expansion of both the device
and the heat sink. A simple clamp, a compliant layer of plastic or rubber, and two 6-32
(M3.5) screws can provide the minimum 85 lb required mounting force. T = 6 in-lb.
Mobile and portable
京公网安备 11010802033920号
EEWORLD
