EEWORLDEEWORLDEEWORLD

Part Number

Search

P4C1048L-70TM

Description
LOW POWER 512K x 8 CMOS STATIC RAM
File Size157KB,12 Pages
ManufacturerPyramid Semiconductor Corporation
Websitehttp://www.pyramidsemiconductor.com/
Download Datasheet View All

P4C1048L-70TM Overview

LOW POWER 512K x 8 CMOS STATIC RAM

P4C1048L
LOW POWER 512K x 8
CMOS STATIC RAM
FEATURES
V
CC
Current
— Operating: 35mA
— CMOS Standby: 100µA
Access Times
—45/55/70/100 ns
Single 5 Volts ±10% Power Supply
Easy Memory Expansion Using
CE
and
OE
Inputs
Common Data I/O
Three-State Outputs
Fully TTL Compatible Inputs and Outputs
Advanced CMOS Technology
Automatic Power Down
Packages
—32-Pin 600 mil Plastic and Ceramic DIP
—32-Pin 445 mil SOP
—32-Pin TSOP II
DESCRIPTION
The P4C1048L is a 4 Megabit low power CMOS static
RAM organized as 512K x 8. The CMOS memory re-
quires no clocks or refreshing, and has equal access
and cycle times. Inputs are fully TTL-compatible. The
RAM operates from a single 5V±10% tolerance power
supply.
Access times as fast as 45 ns are availale. CMOS is
utilized to reduce power consumption to a low level.
The P4C1048L device provides asynchronous opera-
tion with matching access and cycle times. Memory
locations are specified on address pins A
0
to A
18
. Read-
ing is accomplished by device selection (CE low) and
output enabling (OE) while write enable (WE) remains
HIGH. By presenting the address under these condi-
tions, the data in the addressed memory location is pre-
sented on the data input/output pins. The input/output
pins stay in the HIGH Z state when either
CE
is HIGH or
WE
is LOW.
The P4C1048L is packaged in a 32-pin 445 mil plastic
SOP, 32-pin TSOP II, or 600 mil plastic or ceramic side-
brazed DIP.
FUNCTIONAL BLOCK DIAGRAM
PIN CONFIGURATION
DIP (P600, C10),
SOP (S12), TSOP II (T4)
TOP VIEW
Document #
SRAM129
REV D
Revised July 2007
1
PXA270 core board solution:
PXA270 core board solution: CPU: PXA270 SDRAM: 128M FLASH: 32M Interface: USB, SDCARD, SERIAL, etc. LCD+TOUCH: 3.5' Support WIFI Solution can provide: SCH + PCB + BOOM + WINCE50 BSP There is also a S3...
smarsmar Embedded System
Top 500 automotive electronics companies recruit embedded talents
[color=#000000][b][size=12pt][font=Calibri]Platform[/font][/size][/b][b][font=宋体][size=12pt]Development Engineer (low-level software development engineer)[/size][/font][/b][/color][align=left][font=宋体...
zouyu024 Recruitment
[Shenzhen Baoan] [12-20K] Hardware Engineer, Embedded Development Engineer - Smart Lock/Internet of Things
[color=#000][font="][size=14px]Smart lock R&D project, urgently recruiting embedded development engineers and hardware engineers! [/size][/font][/color][color=#000][font="][size=14px]We don't care abo...
alphadev Recruitment
I want to make a similar one based on TI's watch development platform.
I want to make a similar one based on TI's watch development platform. Is there anyone who can help me?...
tziang Creative Market
In the face of the ever-changing kernel, how should we learn LINUX device drivers!
Faced with the constantly upgraded Linux kernel, GNU development tools, and various graphics libraries in the Linux environment, many Linux application developers and Linux device driver developers ar...
edu118gct Embedded System
STM Data 2 2009 National Tour Seminar Speech
The attached data is as shown below:...
zhangkai0215 Embedded System

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 2480  1216  90  2502  2047  50  25  2  51  42 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号