P320DT90VI datasheet, PDF - EEWORLD Datasheet

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P320DT90VI: Description32 Megabit (2 M x 16-Bit/1 M x 32-Bit) CMOS 3.0 Volt-only High Performance Page Mode Flash Memory; File Size525KB，49 Pages; ManufacturerAMD; Websitehttp://www.amd.com

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P320DT90VI Overview

32 Megabit (2 M x 16-Bit/1 M x 32-Bit) CMOS 3.0 Volt-only High Performance Page Mode Flash Memory

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Am29PL320D

Data Sheet

RETIRED

PRODUCT

This product has been retired and is not recommended for designs. For new and current designs,

S29GL032M supersedes Am29PL320D and is the factory-recommended migration path. Please refer

to the S29GL032M datasheet for specifications and ordering information. Availability of this docu-

ment is retained for reference and historical purposes only.

June 2005

The following document specifies Spansion memory products that are now offered by both Advanced

Micro Devices and Fujitsu. Although the document is marked with the name of the company that

originally developed the specification, these products will be offered to customers of both AMD and

Fujitsu.

Continuity of Specifications

There is no change to this datasheet as a result of offering the device as a Spansion product. Any

changes that have been made are the result of normal datasheet improvement and are noted in the

document revision summary, where supported. Future routine revisions will occur when appro-

priate, and changes will be noted in a revision summary.

For More Information

Please contact your local AMD or Fujitsu sales office for additional information about Spansion

memory solutions.

Publication Number

24075

Revision

Amendment

Issue Date

June 13, 2005

TABLE OF CONTENTS

Product Selector Guide . . . . . . . . . . . . . . . . . . . . . 5

Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

Input Configuration . . . . . . . . . . . . . . . . . . . . . . . . 7

Logic Symbol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

Ordering Information . . . . . . . . . . . . . . . . . . . . . . . 8

Standard Products .................................................................... 8

Device Bus Operations . . . . . . . . . . . . . . . . . . . . . . 9

Table 1. Am29PL320D Device Bus Operations ................................9

Figure 3. Erase Operation.............................................................. 23

Temporary Sector Unprotect Enable/Disable

Command Sequence .............................................................. 24

Figure 4. Temporary Sector Unprotect Algorithm .......................... 24

Command Definitions ............................................................. 25

Table 13. Command Definitions (Double Word Mode) .................. 25

Table 14. Command Definitions (Word Mode) ............................... 26

Word/Double Word Configuration ............................................. 9

Requirements for Reading Array Data ..................................... 9

Read Mode ............................................................................... 9

Random Read (Non-Page Mode Read) ............................................9

Write Operation Status . . . . . . . . . . . . . . . . . . . . . 27

DQ7: Data# Polling ................................................................. 27

Figure 5. Data# Polling Algorithm .................................................. 27

Page Mode Read .................................................................... 10

Table 2. Double Word Mode ...........................................................10

Table 3. Word Mode ........................................................................10

DQ6: Toggle Bit ...................................................................... 28

DQ2: Toggle Bit ...................................................................... 28

Reading Toggle Bits DQ6/DQ2 ............................................... 28

DQ5: Exceeded Timing Limits ................................................ 28

Figure 6. Toggle Bit Algorithm........................................................ 29

Writing Commands/Command Sequences ............................ 11

Accelerated Program Operation ......................................................11

DQ3: Sector Erase Timer ....................................................... 29

Table 15. Write Operation Status ................................................... 30

Program and Erase Operation Status .................................... 11

Standby Mode ........................................................................ 11

Automatic Sleep Mode ........................................................... 11

Output Disable Mode .............................................................. 11

Table 4. Sector Address Table, Top Boot (Am29PL320DT) ...........12

Table 5. SecSi

™

Sector Addresses for Top Boot Devices .............12

Table 6. Sector Address Table, Bottom Boot (Am29PL320DB) ......13

Table 7. SecSi

™

Sector Addresses for

Bottom Boot Devices .......................................................................13

Absolute Maximum Ratings. . . . . . . . . . . . . . . . . 31

Figure 7. Maximum Negative Overshoot Waveform ...................... 31

Figure 8. Maximum Positive Overshoot Waveform........................ 31

Autoselect Mode ..................................................................... 14

Table 8. Am29PL320D Autoselect Codes (High Voltage Method) ..14

Operating Ranges . . . . . . . . . . . . . . . . . . . . . . . . 31

Commercial (C) Devices ......................................................... 31

Industrial (I) Devices ............................................................... 31

Supply Voltages .............................................................. 31

DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 32

CMOS Compatible .................................................................. 32

Zero Power Flash ................................................................... 33

Figure 9. I

CC1

Current vs. Time (Showing Active and Automatic Sleep

Currents) ........................................................................................ 33

Figure 10. Typical I

CC1

vs. Frequency ........................................... 33

Figure 11. Test Setup..................................................................... 34

Table 16. Test Specifications ......................................................... 34

Sector Protection/Unprotection ............................................... 14

Common Flash Memory Interface (CFI) . . . . . . . 15

Table 9. CFI Query Identification String ..........................................15

Table 10. System Interface String ...................................................16

Table 11. Device Geometry Definition ............................................16

Table 12. Primary Vendor-Specific Extended Query ......................17

Key to Switching Waveforms. . . . . . . . . . . . . . . . 34

Figure 12. Input Waveforms and Measurement Levels ................. 34

SecSi

™

(Secured Silicon) Sector Flash Memory Region ....... 18

Factory Locked: SecSi Sector Programmed and

Protected At the Factory .................................................................18

Customer Lockable: SecSi Sector NOT Programmed or Locked

At the Factory .................................................................................18

Figure 1. SecSi Sector Protect Verify.............................................. 19

Read Operations .................................................................... 35

Figure 13. Conventional Read Operations Timings ....................... 36

Figure 14. Page Read Timings ...................................................... 36

Double Word/Word Configuration (WORD#) ........................ 37

Figure 15. WORD# Timings for Read Operations.......................... 37

Figure 16. WORD# Timings for Write Operations.......................... 37

Write Protect (WP#) ................................................................ 19

Hardware Data Protection ...................................................... 19

Low V

Write Inhibit ......................................................................19

Write Pulse “Glitch” Protection ........................................................19

Logical Inhibit ..................................................................................19

Power-Up Write Inhibit ....................................................................19

Program/Erase Operations .................................................... 38

Figure 17. Program Operation Timings..........................................

Figure 18. AC Waveforms for Chip/Sector Erase Operations........

Figure 19. Data# Polling Timings (During Embedded Algorithms).

Figure 20. Toggle Bit Timings (During Embedded Algorithms)......

Figure 21. DQ2 vs. DQ6 for Erase and

Erase Suspend Operations ............................................................

Command Definitions . . . . . . . . . . . . . . . . . . . . . . 19

Reading Array Data ................................................................ 19

Reset Command ..................................................................... 20

Autoselect Command Sequence ............................................ 20

Enter SecSi

™

Sector/Exit SecSi Sector

Command Sequence .............................................................. 20

Word/Double Word Program Command Sequence ............... 20

Unlock Bypass Command Sequence ..............................................21

Figure 2. Program Operation .......................................................... 21

Alternate CE# Controlled

Erase/Program Operations ..................................................... 42

Figure 22. Alternate CE# Controlled Write Operation Timings ...... 43

Erase and Programming Performance . . . . . . . 44

Latchup Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44

Data Retention. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44

BGA Package Capacitance . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45

Physical Dimensions . . . . . . . . . . . . . . . . . . . . . . 46

FBF084—84-Ball Fine Pitch Ball Grid Array (FBGA) 11 x 12 mm ..... 46

Chip Erase Command Sequence ........................................... 22

Sector Erase Command Sequence ........................................ 22

Erase Suspend/Erase Resume Commands ........................... 22

Revision Summary . . . . . . . . . . . . . . . . . . . . . . . . 47

Revision A (March 7, 2001) .................................................... 47

June 13, 2005

Am29PL320D

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