Standard SRAM, 1KX1, 10ns, ECL10K, CDFP16,
| Parameter Name | Attribute value |
| Is it lead-free? | Contains lead |
| Is it Rohs certified? | incompatible |
| Maker | Fairchild |
| package instruction | DFP, FL16,.3 |
| Reach Compliance Code | compliant |
| Is Samacsys | N |
| Maximum access time | 10 ns |
| I/O type | SEPARATE |
| JESD-30 code | R-XDFP-F16 |
| JESD-609 code | e0 |
| memory density | 1024 bit |
| Memory IC Type | STANDARD SRAM |
| memory width | 1 |
| Humidity sensitivity level | 2A |
| Number of terminals | 16 |
| word count | 1024 words |
| character code | 1000 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| organize | 1KX1 |
| Output characteristics | OPEN-EMITTER |
| Package body material | CERAMIC |
| encapsulated code | DFP |
| Encapsulate equivalent code | FL16,.3 |
| Package shape | RECTANGULAR |
| Package form | FLATPACK |
| Parallel/Serial | PARALLEL |
| Peak Reflow Temperature (Celsius) | 250 |
| Certification status | Not Qualified |
| surface mount | YES |
| technology | ECL10K |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | FLAT |
| Terminal pitch | 1.27 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | 30 |
| Base Number Matches | 1 |
| 10415FC10 | F10415ADCQM | F10415ADCQR | H0505CA2180BEW | F10415DCQP | F10415DCQM | F10415FCQM | |
|---|---|---|---|---|---|---|---|
| Description | Standard SRAM, 1KX1, 10ns, ECL10K, CDFP16, | Standard SRAM, 1KX1, 20ns, ECL10K, CDIP16, | Standard SRAM, 1KX1, 20ns, ECL10K, CDIP16, | Fixed Resistor, Thin Film, 0.125W, 218ohm, 40V, 0.1% +/-Tol, -25,25ppm/Cel, 0505, | Standard SRAM, 1KX1, 35ns, ECL10K, CDIP16, | Standard SRAM, 1KX1, 35ns, ECL10K, CDIP16, | Standard SRAM, 1KX1, 35ns, ECL10K, CDFP16, |
| Is it Rohs certified? | incompatible | incompatible | incompatible | conform to | incompatible | incompatible | incompatible |
| Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant | compliant |
| JESD-609 code | e0 | e0 | e0 | e4 | e0 | e0 | e0 |
| Number of terminals | 16 | 16 | 16 | 2 | 16 | 16 | 16 |
| Maximum operating temperature | 70 °C | 70 °C | 70 °C | 150 °C | 70 °C | 70 °C | 70 °C |
| Package form | FLATPACK | IN-LINE | IN-LINE | SMT | IN-LINE | IN-LINE | FLATPACK |
| technology | ECL10K | ECL10K | ECL10K | THIN FILM | ECL10K | ECL10K | ECL10K |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Gold (Au) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Is it lead-free? | Contains lead | Contains lead | Contains lead | - | Contains lead | Contains lead | Contains lead |
| Maker | Fairchild | Fairchild | Fairchild | - | Fairchild | Fairchild | Fairchild |
| package instruction | DFP, FL16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 | - | DIP, DIP16,.3 | DIP, DIP16,.3 | DFP, FL16,.3 |
| Maximum access time | 10 ns | 20 ns | 20 ns | - | 35 ns | 35 ns | 35 ns |
| I/O type | SEPARATE | SEPARATE | SEPARATE | - | SEPARATE | SEPARATE | SEPARATE |
| JESD-30 code | R-XDFP-F16 | R-XDIP-T16 | R-XDIP-T16 | - | R-XDIP-T16 | R-XDIP-T16 | R-XDFP-F16 |
| memory density | 1024 bit | 1024 bit | 1024 bit | - | 1024 bit | 1024 bit | 1024 bit |
| Memory IC Type | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | - | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM |
| memory width | 1 | 1 | 1 | - | 1 | 1 | 1 |
| Humidity sensitivity level | 2A | 2A | 2A | - | 2A | 2A | 2A |
| word count | 1024 words | 1024 words | 1024 words | - | 1024 words | 1024 words | 1024 words |
| character code | 1000 | 1000 | 1000 | - | 1000 | 1000 | 1000 |
| Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | - | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| organize | 1KX1 | 1KX1 | 1KX1 | - | 1KX1 | 1KX1 | 1KX1 |
| Output characteristics | OPEN-EMITTER | OPEN-EMITTER | OPEN-EMITTER | - | OPEN-EMITTER | OPEN-EMITTER | OPEN-EMITTER |
| Package body material | CERAMIC | CERAMIC | CERAMIC | - | CERAMIC | CERAMIC | CERAMIC |
| encapsulated code | DFP | DIP | DIP | - | DIP | DIP | DFP |
| Encapsulate equivalent code | FL16,.3 | DIP16,.3 | DIP16,.3 | - | DIP16,.3 | DIP16,.3 | FL16,.3 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Parallel/Serial | PARALLEL | PARALLEL | PARALLEL | - | PARALLEL | PARALLEL | PARALLEL |
| Peak Reflow Temperature (Celsius) | 250 | 250 | 250 | - | 250 | 250 | 250 |
| Certification status | Not Qualified | Not Qualified | - | - | - | Not Qualified | Not Qualified |
| surface mount | YES | NO | NO | - | NO | NO | YES |
| Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | - | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| Terminal form | FLAT | THROUGH-HOLE | THROUGH-HOLE | - | THROUGH-HOLE | THROUGH-HOLE | FLAT |
| Terminal pitch | 1.27 mm | 2.54 mm | 2.54 mm | - | 2.54 mm | 2.54 mm | 1.27 mm |
| Terminal location | DUAL | DUAL | DUAL | - | DUAL | DUAL | DUAL |
| Maximum time at peak reflow temperature | 30 | 30 | 30 | - | 30 | 30 | 30 |