| Parameter Name | Attribute value |
| Brand Name | Texas Instruments |
| Is it lead-free? | Lead free |
| Is it Rohs certified? | conform to |
| Maker | Texas Instruments |
| Parts packaging code | SOIC |
| package instruction | HLSOP, |
| Contacts | 8 |
| Reach Compliance Code | compli |
| ECCN code | EAR99 |
| Factory Lead Time | 1 week |
| Amplifier type | OPERATIONAL AMPLIFIER |
| Architecture | VOLTAGE-FEEDBACK |
| Maximum average bias current (IIB) | 0.00005 µA |
| Nominal bandwidth (3dB) | 90 MHz |
| Maximum bias current (IIB) at 25C | 0.00005 µA |
| Minimum Common Mode Rejection Ratio | 66 dB |
| Nominal Common Mode Rejection Ratio | 80 dB |
| frequency compensation | YES |
| Maximum input offset current (IIO) | 0.00005 µA |
| Maximum input offset voltage | 8000 µV |
| JESD-30 code | R-PDSO-G8 |
| JESD-609 code | e3 |
| length | 4.89 mm |
| low-bias | YES |
| low-dissonance | NO |
| micropower | NO |
| Humidity sensitivity level | 1 |
| Number of functions | 1 |
| Number of terminals | 8 |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -40 °C |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | HLSOP |
| Package shape | RECTANGULAR |
| Package form | SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE |
| method of packing | TR |
| Peak Reflow Temperature (Celsius) | 260 |
| power | NO |
| Programmable power | NO |
| Certification status | Not Qualified |
| Maximum seat height | 1.7 mm |
| Nominal slew rate | 150 V/us |
| Maximum slew rate | 6 mA |
| Supply voltage upper limit | 7.5 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | AUTOMOTIVE |
| Terminal surface | Matte Tin (Sn) |
| Terminal form | GULL WING |
| Terminal pitch | 1.27 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| Nominal Uniform Gain Bandwidth | 100000 kHz |
| Minimum voltage gain | 94 |
| broadband | YES |
| width | 3.9 mm |
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