EEWORLDEEWORLDEEWORLD

Part Number

Search

X3261E-H-24.000MHZ

Description
ACMOS Output Clock Oscillator,
CategoryPassive components    oscillator   
File Size170KB,4 Pages
ManufacturerXsis Electronics Inc.
Environmental Compliance
Download Datasheet Parametric View All

X3261E-H-24.000MHZ Overview

ACMOS Output Clock Oscillator,

X3261E-H-24.000MHZ Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
Objectid1322290412
Reach Compliance Codecompliant
Other featuresTRI-STATE; ENABLE/DISABLE FUNCTION; TRAY
maximum descent time6 ns
Frequency Adjustment - MechanicalNO
frequency stability10%
JESD-609 codee4
Installation featuresTHROUGH HOLE MOUNT
Nominal operating frequency24 MHz
Maximum operating temperature70 °C
Minimum operating temperature
Oscillator typeACMOS
Output load10 KOHM, 15 pF
physical size22.28mm x 12.88mm x 5.08mm
longest rise time6 ns
Maximum supply voltage3.63 V
Minimum supply voltage2.97 V
Nominal supply voltage3.3 V
surface mountNO
maximum symmetry55/45 %
Terminal surfaceGold (Au) - with Nickel (Ni) barrier
“ X3200” Series ( LVHCMOS ), 3.3 VDC
High Reliability Hybrid Microcircuit Crystal Oscillators
( Enable / Disable Option on Pin 1 )
Features
Ruggedized Crystal Mount
Tristate Output Option
Radiation Tolerant to 10 Krads
100% Screening Options
Low Phase Noise
Hermetically Sealed Metal Package
ECCN: EAR99
.200 Max
(5.08)
.225 + .025
(5.72 + .64)
.100 + .005
(2.54 + .13)
Pin 1 is identified
with a Sq. Corner
PIN #
FUNCTION
1
.507 Max
(12.88)
14
+
.600 – .005
(15.24 + .13)
.877 Max
(22.28)
8
7
.300 + .005
(7.62 + .13)
.018 + .002
(4.57 + .05)
Applications
High Shock & Vibration Applications
Navigation Systems
Aerospace Instrumentation
Industrial Controls
Gun Launched Munitions
14
7
8
1
All Others
B+
GND/CASE
OUTPUT
**E/D (Optional)
N/C
Package Specifications & Outline:
Dimensions: Inches (mm)
Header & Leads Material: Kovar
Cover Material: Nickel
Seal: Hermetic – Resistance Welded
Weight: 4.0 Gms typical, 5.0 Gms Max.
o
Thermal Resistance,
Junction to Case ( θ
JC
): 22 C / Watt
o
Lead Soldering, Temp./Time: 260 C, 10 Secs. Max.
Header Finish:
100 to 250 μ inches
nickel
Lead Finish: 50 to 80 μ inches gold over 100 to 250 μ inches nickel
E/D ( Enable/Disable ) Input:
A “Low”
level at the input disables the Output
into a high impedance state.
E/D
Input has internal pull-up. It can
be left floating or connected to Vdd.
** Enable/Disable
Option is available for
frequency > 100 KHz
Hot Solder Tinning per MIL-PRF-55310 is optional at additional cost.
Contact Xsis Electronics
at xsis@xsis.com for any special requirements.
ORDERING INFORMATION
( Please build your part number from options below ) :
P/N EXAMPLE:
X3243E – 883B – 24.000 MHz
3.3 V LVHCMOS, + 50 PPM over -55 C to +125 C,
=
Tristate Output, 883B Screening, 24.000 MHz
o
o
X 32
Model #
4
3
E
883B
24.000 MHz
Output Frequency
Frequency Stability
Options
1 = + 0.1%
2 = + 500 PPM
3
4
5
6
7
=
=
=
=
=
+ 100 PPM
+ 50 PPM
+ 20 PPM *
+ 10 PPM *
+ 25 PPM *
100% Screening Options
Operating Temp. Range
Options
1
2
3
4
5
6
=
=
=
=
=
=
0 C
- 40
o
C
- 55
o
C
- 55
o
C
- 40
o
C
- 20
o
C
o
to + 70 C
to + 85
o
C
to +125
o
C
to +105
o
C
to + 95
o
C
to + 70
o
C
o
Tristate Options
E = Tristate
Blank = No Tristate
883B = Mil - Screening
H
= HI-REL Screening
Blank = No Screening
MIL Screening
is same as
MIL-PRF-55310 Class B Screening
HI-REL Screening
is similar to
MIL-PRF-55310 Class S Screening
Rev 09 /15
* Frequency Stability Options 5, 6 & 7 are not
available for all operating temperature ranges.
Page 1 of 4
Tel. 913-631-0448 Fax. 913-631-1170, www.xsis.com, email xsis@xsis.com
Xsis Electronics, Inc.,
12620 W. 63rd St., Shawnee, KS 66216
[Urgent] Please teach me how to use VHDL to implement matrix transposition
How to use VHDL to implement 8*8 matrix transpose? Please give me some advice, thank you!...
qianyg Embedded System
Help: DSP emulator driver
I have a "Sanzhi" brand DSP emulator that I bought a few years ago, but I lost the driver, and the company went bankrupt. What bad luck! Does anyone have the DSP emulator driver? Thank you, thank you,...
aijing_yang DSP and ARM Processors
The genuine PB5.0 cannot be debugged. What's going on?
I used the trial version for a while and everything was working fine. Now I bought the genuine PB and compiled a DEBUG version, but it can't start. If it is the release version, there is no problem. W...
hhyyzzcool Embedded System
Analysis of the development trend of global application processor architecture
[p=25, null, left][color=rgb(51, 51, 51)]Due to the vigorous development of mobile applications, the improvement of application processor architecture has become more and more active. In addition, wit...
wstt ARM Technology
RFID problem help
Is there anyone familiar with the RFID chip RC522? I want to use SPI to control several RFID modules, connect the data lines of several modules together, and use IRQ to determine which module swiped t...
522403323 RF/Wirelessly
RTL8192CU_8188CUS_8188CE-VAU_WinCE6 system driver package
Share RTL8192CU_8188CUS_8188CE-VAU_WinCE6 system driver package...
natertech Integrated technical exchanges

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 831  2925  340  407  571  17  59  7  9  12 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号