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MAX14430–MAX14432
Four-Channel, Fast, Low-Power,
3kV
RMS
and 3.75kV
RMS
Digital Isolators
General Description
The MAX14430/MAX14431/MAX14432 are fast, low power,
4-channel, digital galvanic isolators using Maxim’s propri-
etary process technology. These devices transfer digital
signals between circuits with different power domains
while using as little as 0.58mW per channel at 1Mbps with
a 1.8V supply. The MAX14430–MAX14432 have an iso-
lation rating of 3kV
RMS
(QSOP package) or 3.75kV
RMS
(narrow SOIC package) for 60 seconds. For applica-
tions requiring 5kV
RMS
of isolation, see the MAX14434-
MAX14436.
The MAX14430–MAX14432 family offers all three pos-
sible unidirectional channel configurations to accom-
modate any 4-channel design, including SPI, RS-232,
RS-485, and digital I/O applications. Output enable for
the A side of the MAX14431R/S/U/V is active-low, making
them ideal for isolating a port on a shared SPI bus since
the
CS
signal can directly enable the MISO signal on the
isolator. All other devices in the family have the traditional
active-high enable.
Devices are available with a maximum data rate of either
25Mbps or 200Mbps and with outputs that are either
default-high or default-low. The default is the state the
output assumes when the input is either not powered or is
open-circuit. See the
Ordering Information
and
Product
Selector Guide
for suffixes associated with each option.
Independent 1.71V to 5.5V supplies on each side of the
isolator also make the devices suitable for use as level
translators.
The MAX14430–MAX14432 are available either in a
16-pin narrow-body SOIC package with 4mm of creep-
age and clearance, or in a smaller 16-pin QSOP package
with 3.8mm of creepage and clearance. The SOIC pack-
age material has a minimum comparative tracking index
(CTI) of 600V, which gives it a group 1 rating in creepage
table. The QSOP package material has a minimum CTI of
400V, which gives it a group 2 rating in creepage table. All
devices are rated for operation at ambient temperatures of
-40°C to +125°C.
Benefits and Features
●
Robust Galvanic Isolation for Fast Digital Signals
• Up to 200Mbps Data Rate
• Continuously Withstands 445V
RMS
(V
IOWM
)
• Withstands 3.75kV
RMS
for 60s (V
ISO
) Narrow
SOIC Package
• Withstands 3kV
RMS
for 60s (V
ISO
) QSOP Package
• Withstands ±10kV Surge between GNDA and
GNDB with 1.2/50μs Waveform Narrow SOIC
Package
• Withstands ±7.5kV Surge between GNDA and
GNDB with 1.2/50μs Waveform QSOP Package
•
High CMTI (50kV/μs, Typical)
●
Low Power Consumption
• 1.1mW per Channel at 1Mbps with V
DD
= 3.3V
• 3.5mW per Channel at 100Mbps with V
DD
= 1.8V
●
Options to Support a Broad Range of Applications
• 2 Data Rates (25Mbps, 200Mbps)
•
3 Channel Direction Configurations
• 2 Output Default States (High/Low)
• Two Packages (Narrow SOIC and QSOP)
Applications
●
●
●
●
●
Isolated SPI Interface
Fieldbus Communications for Industrial Automation
Isolated RS-485/RS-422, CAN
Battery Management
Medical Systems
Safety Regulatory Approvals
●
UL According to UL1577
●
cUL According to CSA Bulletin 5A
Ordering Information
appears at end of data sheet.
19-100198; Rev 3; 7/19
MAX14430–MAX14432
Four-Channel, Fast, Low-Power,
3kV
RMS
and 3.75kV
RMS
Digital Isolators
Absolute Maximum Ratings
V
DDA
to GNDA ........................................................-0.3V to +6V
V
DDB
to GNDB ........................................................-0.3V to +6V
IN_, EN_ on Side A to GNDA ..................................-0.3V to +6V
IN_, EN_ on Side B to GNDB .................................-0.3V to +6V
OUT_ on Side A to GNDA ...................... -0.3V to (V
DDA
+ 0.3V)
OUT_ on Side B to GNDB ..................... -0.3V to (V
DDB
+ 0.3V)
Short-Circuit Duration
OUT_ on Side A to GNDA,
OUT_ on Side B to GNDB.....................................Continuous
Continuous Power Dissipation (T
A
= +70°C)
Narrow SOIC (derate 13.3mW/°C above +70°C) .... 1066.7mW
QSOP (derate 9.6mW/°C above +70°C) .................... 771.5mW
Operating Temperature Range ......................... -40°C to +125°C
Maximum Junction Temperature .....................................+150°C
Storage Temperature Range ............................ -60°C to +150°C
Soldering Temperature (reflow) .......................................+260°C
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these
or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect
device reliability.
Package Information
PACKAGE TYPE: 16 NARROW SOIC
Package Code
Outline Number
Land Pattern Number
THERMAL RESISTANCE, FOUR-LAYER BOARD
Junction to Ambient (θ
JA
)
Junction to Case (θ
JC
)
PACKAGE TYPE: 16 QSOP
Package Code
Outline Number
Land Pattern Number
THERMAL RESISTANCE, FOUR-LAYER BOARD
Junction to Ambient (θ
JA
)
Junction to Case (θ
JC
)
103.7°C/W
37°C/W
E16MS+1F
21-0055
90-0167
75°C/W
24°C/W
S16MS+12
21-0041
90-0442
For the latest package outline information and land patterns (footprints), go to
www.maximintegrated.com/packages.
Note that a “+”,
“#”, or “-” in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing
pertains to the package regardless of RoHS status.
Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For
detailed information on package thermal considerations, refer to
www.maximintegrated.com/thermal-tutorial.
www.maximintegrated.com
Maxim Integrated
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