2-wire Serial EEPROM 1M (131,072 x 8)

| 24C1024 | AT24C1024-10PI-2.7 | AT24C1024C1-10CI-2.7 | AT24C1024W-10SI-2.7 | AT24C1024-10CI-2.7 | AT24C1024-10UI-2.7 | |
|---|---|---|---|---|---|---|
| Description | 2-wire Serial EEPROM 1M (131,072 x 8) | 2-wire Serial EEPROM 1M (131,072 x 8) | 2-wire Serial EEPROM 1M (131,072 x 8) | 2-wire Serial EEPROM 1M (131,072 x 8) | 2-wire Serial EEPROM 1M (131,072 x 8) | 2-wire Serial EEPROM 1M (131,072 x 8) |
| Is it Rohs certified? | - | incompatible | incompatible | incompatible | incompatible | incompatible |
| Maker | - | Atmel (Microchip) | Atmel (Microchip) | Atmel (Microchip) | Atmel (Microchip) | Atmel (Microchip) |
| Parts packaging code | - | DIP | SOIC | SOIC | SOIC | BGA |
| package instruction | - | DIP, DIP8,.3 | SON, SOLCC8,.3 | 0.209 INCH, EIAJ, PLASTIC, SOIC-8 | SON, SOLCC8,.25 | VFBGA, BGA8,2X4,30 |
| Contacts | - | 8 | 8 | 8 | 8 | 8 |
| Reach Compliance Code | - | compli | compli | unknow | unknow | unknow |
| ECCN code | - | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| Maximum clock frequency (fCLK) | - | 0.4 MHz | 0.4 MHz | 0.4 MHz | 0.4 MHz | 0.4 MHz |
| Data retention time - minimum | - | 40 | 40 | 40 | 40 | 40 |
| Durability | - | 100000 Write/Erase Cycles | 100000 Write/Erase Cycles | 100000 Write/Erase Cycles | 100000 Write/Erase Cycles | 100000 Write/Erase Cycles |
| I2C control byte | - | 10100DMR | 10100DMR | 10100DMR | 10100DMR | 10100DMR |
| JESD-30 code | - | R-PDIP-T8 | R-XDSO-N8 | R-PDSO-G8 | R-XDSO-N8 | R-PBGA-B8 |
| JESD-609 code | - | e0 | e0 | e0 | e0 | e0 |
| length | - | 9.271 mm | 8 mm | 5.29 mm | 5.99 mm | - |
| memory density | - | 1048576 bi | 1048576 bi | 1048576 bi | 1048576 bi | 1048576 bi |
| Memory IC Type | - | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM |
| memory width | - | 8 | 8 | 8 | 8 | 8 |
| Humidity sensitivity level | - | 1 | 3 | 1 | 3 | - |
| Number of functions | - | 1 | 1 | 1 | 1 | 1 |
| Number of terminals | - | 8 | 8 | 8 | 8 | 8 |
| word count | - | 131072 words | 131072 words | 131072 words | 131072 words | 131072 words |
| character code | - | 128000 | 128000 | 128000 | 128000 | 128000 |
| Operating mode | - | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
| Maximum operating temperature | - | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
| Minimum operating temperature | - | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| organize | - | 128KX8 | 128KX8 | 128KX8 | 128KX8 | 128KX8 |
| Package body material | - | PLASTIC/EPOXY | UNSPECIFIED | PLASTIC/EPOXY | UNSPECIFIED | PLASTIC/EPOXY |
| encapsulated code | - | DIP | SON | SOP | SON | VFBGA |
| Encapsulate equivalent code | - | DIP8,.3 | SOLCC8,.3 | SOP8,.3 | SOLCC8,.25 | BGA8,2X4,30 |
| Package shape | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | - | IN-LINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
| Parallel/Serial | - | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL |
| Peak Reflow Temperature (Celsius) | - | NOT SPECIFIED | 240 | 240 | 240 | NOT SPECIFIED |
| power supply | - | 3/5 V | 3/5 V | 3/5 V | 3/5 V | 3/5 V |
| Certification status | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum seat height | - | 5.334 mm | 1.14 mm | 2.16 mm | 1.14 mm | 0.96 mm |
| Serial bus type | - | I2C | I2C | I2C | I2C | I2C |
| Maximum standby current | - | 0.000003 A | 0.000003 A | 0.000003 A | 0.000003 A | 0.000003 A |
| Maximum slew rate | - | 0.005 mA | 0.005 mA | 0.005 mA | 0.005 mA | 0.005 mA |
| Maximum supply voltage (Vsup) | - | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| Minimum supply voltage (Vsup) | - | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V |
| Nominal supply voltage (Vsup) | - | 3 V | 3 V | 3 V | 3 V | 3 V |
| surface mount | - | NO | YES | YES | YES | YES |
| technology | - | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | - | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| Terminal surface | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | - | THROUGH-HOLE | NO LEAD | GULL WING | NO LEAD | BALL |
| Terminal pitch | - | 2.54 mm | 1.27 mm | 1.27 mm | 1.27 mm | 0.75 mm |
| Terminal location | - | DUAL | DUAL | DUAL | DUAL | BOTTOM |
| Maximum time at peak reflow temperature | - | NOT SPECIFIED | 30 | 30 | 30 | NOT SPECIFIED |
| width | - | 7.62 mm | 5 mm | 5.24 mm | 4.93 mm | - |
| Maximum write cycle time (tWC) | - | 10 ms | 10 ms | 10 ms | 10 ms | 10 ms |
| write protect | - | HARDWARE | HARDWARE | HARDWARE | HARDWARE | HARDWARE |