|
100363FC |
100363DMQB |
| Description |
IC 100K SERIES, DUAL 8 LINE TO 1 LINE MULTIPLEXER, TRUE OUTPUT, CQFP24, CERPAK-24, Multiplexer/Demultiplexer |
IC 100K SERIES, DUAL 8 LINE TO 1 LINE MULTIPLEXER, TRUE OUTPUT, CDIP24, CERAMIC, DIP-24, Multiplexer/Demultiplexer |
| Is it Rohs certified? |
incompatible |
incompatible |
| Maker |
National Semiconductor(TI ) |
National Semiconductor(TI ) |
| package instruction |
QFF, QFL24,.4SQ |
DIP, DIP24,.4 |
| Reach Compliance Code |
unknown |
unknown |
| Is Samacsys |
N |
N |
| series |
100K |
100K |
| JESD-30 code |
S-GQFP-F24 |
R-GDIP-T24 |
| JESD-609 code |
e0 |
e0 |
| Logic integrated circuit type |
MULTIPLEXER |
MULTIPLEXER |
| Number of functions |
2 |
2 |
| Number of entries |
8 |
8 |
| Output times |
1 |
1 |
| Number of terminals |
24 |
24 |
| Maximum operating temperature |
85 °C |
125 °C |
| Output characteristics |
OPEN-EMITTER |
OPEN-EMITTER |
| Output polarity |
TRUE |
TRUE |
| Package body material |
CERAMIC, GLASS-SEALED |
CERAMIC, GLASS-SEALED |
| encapsulated code |
QFF |
DIP |
| Encapsulate equivalent code |
QFL24,.4SQ |
DIP24,.4 |
| Package shape |
SQUARE |
RECTANGULAR |
| Package form |
FLATPACK |
IN-LINE |
| Peak Reflow Temperature (Celsius) |
NOT SPECIFIED |
NOT SPECIFIED |
| power supply |
-4.5 V |
-4.5 V |
| Maximum supply current (ICC) |
80 mA |
87 mA |
| Prop。Delay @ Nom-Sup |
1.8 ns |
3 ns |
| propagation delay (tpd) |
2.7 ns |
3 ns |
| Certification status |
Not Qualified |
Not Qualified |
| Maximum seat height |
2.159 mm |
5.72 mm |
| surface mount |
YES |
NO |
| technology |
ECL |
ECL |
| Temperature level |
OTHER |
MILITARY |
| Terminal surface |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
| Terminal form |
FLAT |
THROUGH-HOLE |
| Terminal pitch |
1.27 mm |
2.54 mm |
| Terminal location |
QUAD |
DUAL |
| Maximum time at peak reflow temperature |
NOT SPECIFIED |
NOT SPECIFIED |
| Base Number Matches |
1 |
1 |