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1059671-1 Product Details
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Blind Mate RF Connectors
Not EU R oHS or ELV C om plia nt
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1059671-1
T E I nternal N umber: 1 0 5 9 6 7 1 - 1
Product Highlights:
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C onnector
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OSP Miniature Modular Product Line
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Terminate To Printed C ircuit Board
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Jack
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Sealed
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Obsolete
C ontact Product Information C enter
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Documentation & Additional Information
Product Drawings:
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None Available
Catalog Pages/Data Sheets:
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RF C OAXIAL SOLUTIONS FOR C OMMUNIC ATIONS
(PDF, English)
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Blind Mate C onnectors
(PDF, English)
Product Specifications:
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None Available
Application Specifications:
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None Available
Instruction Sheets:
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None Available
CAD Files:
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None Available
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Product Features
(Please use the Product Drawing for all design activity)
Product Type Features:
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Product Type
= C onnector
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Product Line = OSP Miniature Modular
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Gender
= Jack
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Sealed = Yes
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Body Style = Straight
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Panel Thickness (mm [in]) = 6.35 [0.250]
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Dielectric Material = TFE Fluorocarbon
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Body Material = Stainless Steel
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Body Finish = Passivated
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C omment = Field Replaceable/Solder and Braze-In
Mechanical Attachment:
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Panel Attachment
= With
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Panel Attachment Style = Front Mount
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Panel Attachment Method
= Threaded
Electrical Characteristics:
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Impedance (Nominal) (?) = 50
Contact Related Features:
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C enter C ontact Material = Beryllium C opper
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C enter C ontact Plating = Gold
Industry Standards:
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RoHS/ELV C ompliance
= Not ELV/RoHS compliant
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Lead Free Solder Processes
= Wave solder capable to 240?C , Wave
solder capable to 260?C , Wave solder capable to 265?C , Reflow
solder capable to 245?C , Reflow solder capable to 260?C , Pin-in-
Paste capable to 245?C , Pin-in-Paste capable to 260?C
Conditions for Usage:
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Terminate To = Printed C ircuit Board
Other:
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Brand = AMP
Additional Information:
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Product Line Information
Related Products:
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Tooling
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