IC,FLIP-FLOP,SINGLE,D TYPE,ECL,FP,16PIN,CERAMIC
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| package instruction | DFP, FL16,.3 |
| Reach Compliance Code | unknown |
| Is Samacsys | N |
| JESD-30 code | R-XDFP-F16 |
| JESD-609 code | e0 |
| Logic integrated circuit type | D FLIP-FLOP |
| Number of functions | 1 |
| Number of terminals | 16 |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | -30 °C |
| Package body material | CERAMIC |
| encapsulated code | DFP |
| Encapsulate equivalent code | FL16,.3 |
| Package shape | RECTANGULAR |
| Package form | FLATPACK |
| Certification status | Not Qualified |
| Filter level | 38535Q/M;38534H;883B |
| surface mount | YES |
| technology | ECL |
| Temperature level | OTHER |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | FLAT |
| Terminal pitch | 1.27 mm |
| Terminal location | DUAL |
| Trigger type | MASTER-SLAVE |
| Base Number Matches | 1 |
| 1670/BFAJC | MCC1670 | 1670/BEAJC | |
|---|---|---|---|
| Description | IC,FLIP-FLOP,SINGLE,D TYPE,ECL,FP,16PIN,CERAMIC | IC,FLIP-FLOP,SINGLE,D TYPE,ECL,DIE | IC,FLIP-FLOP,SINGLE,D TYPE,ECL,DIP,16PIN,CERAMIC |
| package instruction | DFP, FL16,.3 | , DIE OR CHIP | DIP, DIP16,.3 |
| Reach Compliance Code | unknown | unknown | unknown |
| Logic integrated circuit type | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP |
| Number of functions | 1 | 1 | 1 |
| Maximum operating temperature | 85 °C | 25 °C | 85 °C |
| Minimum operating temperature | -30 °C | 25 °C | -30 °C |
| Encapsulate equivalent code | FL16,.3 | DIE OR CHIP | DIP16,.3 |
| Certification status | Not Qualified | Not Qualified | Not Qualified |
| technology | ECL | ECL | ECL |
| Temperature level | OTHER | OTHER | OTHER |
| Trigger type | MASTER-SLAVE | MASTER-SLAVE | MASTER-SLAVE |
| Base Number Matches | 1 | 1 | 1 |
| Is it Rohs certified? | incompatible | - | incompatible |
| Is Samacsys | N | - | N |
| JESD-30 code | R-XDFP-F16 | - | R-XDIP-T16 |
| JESD-609 code | e0 | - | e0 |
| Number of terminals | 16 | - | 16 |
| Package body material | CERAMIC | - | CERAMIC |
| encapsulated code | DFP | - | DIP |
| Package shape | RECTANGULAR | - | RECTANGULAR |
| Package form | FLATPACK | - | IN-LINE |
| Filter level | 38535Q/M;38534H;883B | - | 38535Q/M;38534H;883B |
| surface mount | YES | - | NO |
| Terminal surface | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) |
| Terminal form | FLAT | - | THROUGH-HOLE |
| Terminal pitch | 1.27 mm | - | 2.54 mm |
| Terminal location | DUAL | - | DUAL |