5962F0150901QXC datasheet, PDF

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5962F0150901QXC: Description1A SWITCHING CONTROLLER, 500kHz SWITCHING FREQ-MAX, DFP18, DFP-18; CategoryPower/power management The power supply circuit; File Size138KB，23 Pages; ManufacturerRenesas Electronics Corporation; Websitehttps://www.renesas.com/; Environmental Compliance

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5962F0150901QXC Overview

1A SWITCHING CONTROLLER, 500kHz SWITCHING FREQ-MAX, DFP18, DFP-18

5962F0150901QXC Parametric

Parameter Name	Attribute value
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Parts packaging code	DFP
package instruction	QFF, FL18,.3
Contacts	18
Reach Compliance Code	compliant
ECCN code	EAR99
Is Samacsys	N
Analog Integrated Circuits - Other Types	SWITCHING CONTROLLER
control mode	CURRENT-MODE
Control Technology	PULSE WIDTH MODULATION
Maximum input voltage	20 V
Minimum input voltage	12 V
JESD-30 code	R-XDFP-F18
JESD-609 code	e4
length	11.175 mm
Number of functions	1
Number of terminals	18
Maximum operating temperature	125 °C
Minimum operating temperature	-50 °C
Maximum output current	1 A
Package body material	UNSPECIFIED
encapsulated code	QFF
Encapsulate equivalent code	FL18,.3
Package shape	RECTANGULAR
Package form	FLATPACK
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
Certification status	Not Qualified
Filter level	MIL-PRF-38535 Class Q
Maximum seat height	2.92 mm
surface mount	YES
Switch configuration	SINGLE
Maximum switching frequency	500 kHz
technology	BICMOS
Temperature level	AUTOMOTIVE
Terminal surface	Gold (Au)
Terminal form	FLAT
Terminal pitch	1.27 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
total dose	300k Rad(Si) V
width	8.3 mm
Base Number Matches	1

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REVISIONS

LTR

DESCRIPTION

Make title and symbol changes to both tests specified under the UVLO section

in table I. - ro

DATE (YR-MO-DA)

00-12-18

APPROVED

R. MONNIN

Made a change to the minimum ambient operating temperature in 1.4 and table

I. Changes also made to the delay to output test and PSRR test in table I. – rp

01-03-21

R. MONNIN

Add footnote to the error amp section as specified in table I and add footnote

to figure 2. - ro

01-07-10

R. MONNIN

Make changes to output voltage test, total output variation test, and input

voltage test as specified in table I. Also, make change to footnote 2/ as

specified in table I and footnote 1/ as specified in figure 2. - ro

01-08-16

R. MONNIN

Add new footnote to figure 2 and to the Oscillator section as specified under

table I. Make change to RTCT description as specified under figure 2.

Make change to V

test condition as specified under table I. - ro

03-09-19

R. MONNIN

REV

SHEET

REV

SHEET

REV STATUS

OF SHEETS

PMIC N/A

REV

SHEET

PREPARED BY

RICK OFFICER

STANDARD

MICROCIRCUIT

DRAWING

THIS DRAWING IS AVAILABLE

FOR USE BY ALL

DEPARTMENTS

AND AGENCIES OF THE

DEPARTMENT OF DEFENSE

CHECKED BY

RAJESH PITHADIA

DEFENSE SUPPLY CENTER COLUMBUS

COLUMBUS, OHIO 43216

http://www.dscc.dla.mil

APPROVED BY

RAYMOND MONNIN

MICROCIRCUIT, DIGITAL-LINEAR, CURRENT

MODE PULSE WIDTH MODULATOR,

MONOLITHIC SILICON

DRAWING APPROVAL DATE

00-11-30

AMSC N/A

REVISION LEVEL

SIZE

SHEET

CAGE CODE

67268

1 OF

5962-01509

DSCC FORM 2233

APR 97

DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited.

5962-E560-03

1.3 Absolute maximum ratings. 1/

Supply voltage (V

) ......................................................................................+35 V dc

Maximum storage temperature range .............................................................-65°C to +150°C

Lead temperature (soldering, 10 seconds) .....................................................+265°C

Power dissipation (P

) ....................................................................................1.5 W

Junction temperature (T

) ...............................................................................+175°C

Thermal resistance, junction-to-case (θ

Case P .........................................................................................................25°C/W

Case X .........................................................................................................8°C/W

Thermal resistance, junction-to-ambient (θ

Case P .........................................................................................................100°C/W

Case X .........................................................................................................90°C/W

1.4 Recommended operating conditions.

Supply voltage (V

) ......................................................................................+12 V dc to +20 V dc

Ambient operating temperature range (TA) ....................................................-50°C to +125°C

1.5 Radiation features.

Maximum total dose available (dose rate = 50 – 300 rads (Si)/s) ....................300 Krads (Si)

Latch-up ..........................................................................................................None 2/

Single event latch-up ......................................................................................> 83 MEV / (cm /mg) 2/

Single event upset ..........................................................................................> 35 MEV / (cm /mg) 2/

2. APPLICABLE DOCUMENTS

2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a

part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those listed in

the issue of the Department of Defense Index of Specifications and Standards (DoDISS) and supplement thereto, cited in the

solicitation.

SPECIFICATION

DEPARTMENT OF DEFENSE

MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for.

STANDARDS

DEPARTMENT OF DEFENSE

MIL-STD-883 -

MIL-STD-1835 -

Test Method Standard Microcircuits.

Interface Standard Electronic Component Case Outlines.

______

1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the

maximum levels may degrade performance and affect reliability.

2/ Guaranteed by design or process but not tested.

STANDARD

MICROCIRCUIT DRAWING

DEFENSE SUPPLY CENTER COLUMBUS

COLUMBUS, OHIO 43216-5000

DSCC FORM 2234

APR 97

SIZE

REVISION LEVEL

5962-01509

SHEET

HANDBOOKS

DEPARTMENT OF DEFENSE

MIL-HDBK-103 -

MIL-HDBK-780 -

List of Standard Microcircuit Drawings.

Standard Microcircuit Drawings.

(Unless otherwise indicated, copies of the specification, standards, and handbooks are available from the Standardization

Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)

2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text

of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a

specific exemption has been obtained.

3. REQUIREMENTS

3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with

MIL-PRF-38535 and as specified herein or as modified in the device manufacturer's Quality Management (QM) plan. The

modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for

device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified

herein.

3.1.1 Microcircuit die. For the microcircuit die requirements, see appendix A to this document.

3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified

in MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M.

3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.4 herein and figure 1.

3.2.2 Terminal connections. The terminal connections shall be as specified on figure 2.

3.2.3 Radiation exposure circuit. The radiation exposure circuit shall be as specified on figure 3.

3.3 Electrical performance characteristics and post irradiation parameter limits. Unless otherwise specified herein, the

electrical performance characteristics and post irradiation parameter limits are as specified in table I and shall apply over the

full ambient operating temperature range.

3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table IIA. The electrical

tests for each subgroup are defined in table I.

3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturer's PIN may also be

marked as listed in MIL-HDBK-103. For packages where marking of the entire SMD PIN number is not feasible due to space

limitations, the manufacturer has the option of not marking the "5962-" on the device. For RHA product using this option, the

RHA designator shall still be marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535.

Marking for device class M shall be in accordance with MIL-PRF-38535, appendix A.

3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a "QML" or "Q" as required in

MIL-PRF-38535. The compliance mark for device class M shall be a "C" as required in MIL-PRF-38535, appendix A.

3.6 Certificate of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535

listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a certificate of

compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see

6.6.2 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply for this

drawing shall affirm that the manufacturer's product meets, for device classes Q and V, the requirements of MIL-PRF-38535

and herein or for device class M, the requirements of MIL-PRF-38535, appendix A and herein.

STANDARD

MICROCIRCUIT DRAWING

DEFENSE SUPPLY CENTER COLUMBUS

COLUMBUS, OHIO 43216-5000

DSCC FORM 2234

APR 97

SIZE

REVISION LEVEL

5962-01509

SHEET

5962F0150901QXC Related Products

	5962F0150901QXC	5962F0150901VPC	5962F0150901VXC	5962F0150901QPC	5962F0150901V9A
Description	1A SWITCHING CONTROLLER, 500kHz SWITCHING FREQ-MAX, DFP18, DFP-18	1A SWITCHING CONTROLLER, 500kHz SWITCHING FREQ-MAX, CDIP8, CERAMIC, DIP-8	1A SWITCHING CONTROLLER, 500kHz SWITCHING FREQ-MAX, DFP18, DFP-18	1A SWITCHING CONTROLLER, 500kHz SWITCHING FREQ-MAX, CDIP8, CERAMIC, DIP-8	SWITCHING CONTROLLER, UUC11, DIE-11
Parts packaging code	DFP	DIP	DFP	DIP	DIE
package instruction	QFF, FL18,.3	DIP, DIP8,.3	QFF, FL18,.3	DIP, DIP8,.3	DIE, DIE OR CHIP
Contacts	18	8	18	8	11
Reach Compliance Code	compliant	compliant	compliant	compliant	compliant
ECCN code	EAR99	EAR99	EAR99	EAR99	EAR99
Is Samacsys	N	N	N	N	N
Analog Integrated Circuits - Other Types	SWITCHING CONTROLLER	SWITCHING CONTROLLER	SWITCHING CONTROLLER	SWITCHING CONTROLLER	SWITCHING CONTROLLER
control mode	CURRENT-MODE	CURRENT-MODE	CURRENT-MODE	CURRENT-MODE	CURRENT-MODE
Control Technology	PULSE WIDTH MODULATION	PULSE WIDTH MODULATION	PULSE WIDTH MODULATION	PULSE WIDTH MODULATION	PULSE WIDTH MODULATION
Maximum input voltage	20 V	20 V	20 V	20 V	20 V
Minimum input voltage	12 V	12 V	12 V	12 V	12 V
JESD-30 code	R-XDFP-F18	R-CDIP-T8	R-XDFP-F18	R-CDIP-T8	X-XUUC-N11
Number of functions	1	1	1	1	1
Number of terminals	18	8	18	8	11
Maximum operating temperature	125 °C	125 °C	125 °C	125 °C	125 °C
Minimum operating temperature	-50 °C	-50 °C	-50 °C	-50 °C	-50 °C
Maximum output current	1 A	1 A	1 A	1 A	0.2 A
Package body material	UNSPECIFIED	CERAMIC, METAL-SEALED COFIRED	UNSPECIFIED	CERAMIC, METAL-SEALED COFIRED	UNSPECIFIED
encapsulated code	QFF	DIP	QFF	DIP	DIE
Encapsulate equivalent code	FL18,.3	DIP8,.3	FL18,.3	DIP8,.3	DIE OR CHIP
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	UNSPECIFIED
Package form	FLATPACK	IN-LINE	FLATPACK	IN-LINE	UNCASED CHIP
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Filter level	MIL-PRF-38535 Class Q	MIL-PRF-38535 Class V	MIL-PRF-38535 Class V	MIL-PRF-38535 Class Q	MIL-PRF-38535 Class V
surface mount	YES	NO	YES	NO	YES
Switch configuration	SINGLE	SINGLE	SINGLE	SINGLE	SINGLE
Maximum switching frequency	500 kHz	500 kHz	500 kHz	500 kHz	57 kHz
technology	BICMOS	BICMOS	BICMOS	BICMOS	BICMOS
Temperature level	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE
Terminal form	FLAT	THROUGH-HOLE	FLAT	THROUGH-HOLE	NO LEAD
Terminal location	DUAL	DUAL	DUAL	DUAL	UPPER
total dose	300k Rad(Si) V	300k Rad(Si) V	300k Rad(Si) V	300k Rad(Si) V	300k Rad(Si) V
Base Number Matches	1	1	1	1	1
Is it lead-free?	Lead free	-	Lead free	Lead free	Lead free
Is it Rohs certified?	conform to	-	conform to	conform to	conform to
JESD-609 code	e4	e4	e4	e4	-
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	-	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
Maximum seat height	2.92 mm	5.08 mm	2.92 mm	5.08 mm	-
Terminal surface	Gold (Au)	GOLD	Gold (Au)	Gold (Au)	-
Terminal pitch	1.27 mm	2.54 mm	1.27 mm	2.54 mm	-
Maximum time at peak reflow temperature	NOT SPECIFIED	-	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
width	8.3 mm	7.62 mm	8.3 mm	7.62 mm	-

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