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IS61LF51218A-7.5TQLI

Description
Cache SRAM, 512KX18, 7.5ns, CMOS, PQFP100, LEAD FREE, TQFP-100
Categorystorage    storage   
File Size463KB,32 Pages
ManufacturerIntegrated Silicon Solution ( ISSI )
Environmental Compliance  
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IS61LF51218A-7.5TQLI Overview

Cache SRAM, 512KX18, 7.5ns, CMOS, PQFP100, LEAD FREE, TQFP-100

IS61LF51218A-7.5TQLI Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
Parts packaging codeQFP
package instructionLQFP, QFP100,.63X.87
Contacts100
Reach Compliance Codecompliant
ECCN code3A991.B.2.A
Factory Lead Time10 weeks
Is SamacsysN
Maximum access time7.5 ns
Other featuresFLOW-THROUGH ARCHITECTURE
Maximum clock frequency (fCLK)117 MHz
I/O typeCOMMON
JESD-30 codeR-PQFP-G100
JESD-609 codee3
length20 mm
memory density9437184 bit
Memory IC TypeCACHE SRAM
memory width18
Humidity sensitivity level3
Number of functions1
Number of terminals100
word count524288 words
character code512000
Operating modeSYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize512KX18
Output characteristics3-STATE
Package body materialPLASTIC/EPOXY
encapsulated codeLQFP
Encapsulate equivalent codeQFP100,.63X.87
Package shapeRECTANGULAR
Package formFLATPACK, LOW PROFILE
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)260
power supply2.5/3.3,3.3 V
Certification statusNot Qualified
Maximum seat height1.6 mm
Maximum standby current0.085 A
Minimum standby current3.14 V
Maximum slew rate0.185 mA
Maximum supply voltage (Vsup)3.465 V
Minimum supply voltage (Vsup)3.135 V
Nominal supply voltage (Vsup)3.3 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceMatte Tin (Sn) - annealed
Terminal formGULL WING
Terminal pitch0.65 mm
Terminal locationQUAD
Maximum time at peak reflow temperature40
width14 mm
Base Number Matches1
IS61LF25636A    IS61VF25636A    IS64LF25636A
IS61LF51218A    IS61VF51218A 
256K x 36, 512K x 18 
9 Mb SYNCHRONOUS FLOW-THROUGH 
SEPTEMBER 2010
STATIC RAM
FEATURES
• Internal self-timed write cycle
• Individual Byte Write Control and Global Write
• Clock controlled, registered address, data and
control
• Burst sequence control using MODE input
• Three chip enable option for simple depth expan-
sion and address pipelining
• Common data inputs and data outputs
• Auto Power-down during deselect
• Single cycle deselect
• Snooze MODE for reduced-power standby
• JTAG Boundary Scan for PBGA package
• Power Supply
LF: V
dd
3.3V + 5%,
V
ddq
3.3V/2.5V + 5%
VF: V
dd
2.5V + 5%,
V
ddq
2.5V + 5%
• JEDEC 100-Pin TQFP, 119-pin PBGA, and 165-
pin PBGA packages
• Lead-free available
• Automotive temperature available
VF51218A are high-speed, low-power synchronous
static RAMs designed to provide burstable, high-performance
memory for communication and networking applications.
The IS61LF/VF25636A and IS64LF25636A are organized
as 262,144 words by 36 bits. The IS61LF/VF51218A is
organized as 524,288 words by 18 bits. Fabricated with
ISSI
's advanced CMOS technology, the device integrates
a 2-bit burst counter, high-speed SRAM core, and high-
drive capability outputs into a single monolithic circuit. All
synchronous inputs pass through registers controlled by
a positive-edge-triggered single clock input.
Write cycles are internally self-timed and are initiated by the
rising edge of the clock input. Write cycles can be one to
four bytes wide as controlled by the write control inputs.
Separate byte enables allow individual bytes to be written.
Byte write operation is performed by using byte write en-
able (BWE) input combined with one or more individual
byte write signals (BWx). In addition, Global Write (GW)
is available for writing all bytes at one time, regardless of
the byte write controls.
Bursts can be initiated with either ADSP (Address Status
Processor) or ADSC (Address Status Cache Controller)
input pins. Subsequent burst addresses can be gener-
ated internally and controlled by the ADV (burst address
advance) input pin.
The mode pin is used to select the burst sequence order,
Linear burst is achieved when this pin is tied LOW. Inter-
leave burst is achieved when this pin is tied HIGH or left
floating.
-6.5 
6.5
7.5
133
-7.5 
7.5
8.5
117
Units
ns
ns
MHz
DESCRIPTION
The
ISSI
IS61LF/VF25636A, IS64LF25636A and IS61LF/
FAST ACCESS TIME
Symbol 
t
kq
t
kc
Parameter 
Clock Access Time
Cycle Time
Frequency
Copyright © 2010 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time without
notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to obtain the lat-
est version of this device specification before relying on any published information and before placing orders for products.
Integrated Silicon Solution, Inc. does not recommend the use of any of its products in life support applications where the failure or malfunction of the product can reason-
ably be expected to cause failure of the life support system or to significantly affect its safety or effectiveness. Products are not authorized for use in such applications
unless Integrated Silicon Solution, Inc. receives written assurance to its satisfaction, that:
a.) the risk of injury or damage has been minimized;
b.) the user assume all such risks; and
c.) potential liability of Integrated Silicon Solution, Inc is adequately protected under the circumstances
Integrated Silicon Solution, Inc.
Rev.  H
07/22/2010
1

IS61LF51218A-7.5TQLI Related Products

IS61LF51218A-7.5TQLI IS64LF25636A-7.5B3LA3 IS61LF25636A-7.5TQLI IS61LF25636A-7.5TQI IS64LF25636A-7.5TQLA3 IS61LF51218A-7.5TQI
Description Cache SRAM, 512KX18, 7.5ns, CMOS, PQFP100, LEAD FREE, TQFP-100 Standard SRAM, 256KX36, 7.5ns, CMOS, PBGA165 Cache SRAM, 256KX36, 7.5ns, CMOS, PQFP100, LEAD FREE, TQFP-100 256KX36 CACHE SRAM, 7.5ns, PQFP100, TQFP-100 Cache SRAM, 256KX36, 7.5ns, CMOS, PQFP100, LEAD FREE, TQFP-100 512KX18 CACHE SRAM, 7.5ns, PQFP100, TQFP-100
Is it Rohs certified? conform to conform to conform to incompatible conform to incompatible
package instruction LQFP, QFP100,.63X.87 BGA, BGA165,11X15,40 LQFP, QFP100,.63X.87 TQFP-100 LQFP, QFP100,.63X.87 TQFP-100
Reach Compliance Code compliant compliant compliant compliant compliant compli
Factory Lead Time 10 weeks 12 weeks 10 weeks 12 weeks 12 weeks 12 weeks
Maximum access time 7.5 ns 7.5 ns 7.5 ns 7.5 ns 7.5 ns 7.5 ns
Maximum clock frequency (fCLK) 117 MHz 117 MHz 117 MHz 117 MHz 117 MHz 117 MHz
I/O type COMMON COMMON COMMON COMMON COMMON COMMON
JESD-30 code R-PQFP-G100 R-PBGA-B165 R-PQFP-G100 R-PQFP-G100 R-PQFP-G100 R-PQFP-G100
memory density 9437184 bit 9437184 bit 9437184 bit 9437184 bit 9437184 bit 9437184 bi
Memory IC Type CACHE SRAM STANDARD SRAM CACHE SRAM CACHE SRAM CACHE SRAM CACHE SRAM
memory width 18 36 36 36 36 18
Number of terminals 100 165 100 100 100 100
word count 524288 words 262144 words 262144 words 262144 words 262144 words 524288 words
character code 512000 256000 256000 256000 256000 512000
Operating mode SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
Maximum operating temperature 85 °C 125 °C 85 °C 85 °C 125 °C 85 °C
Minimum operating temperature -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C
organize 512KX18 256KX36 256KX36 256KX36 256KX36 512KX18
Output characteristics 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code LQFP BGA LQFP LQFP LQFP LQFP
Encapsulate equivalent code QFP100,.63X.87 BGA165,11X15,40 QFP100,.63X.87 QFP100,.63X.87 QFP100,.63X.87 QFP100,.63X.87
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form FLATPACK, LOW PROFILE GRID ARRAY FLATPACK, LOW PROFILE FLATPACK, LOW PROFILE FLATPACK, LOW PROFILE FLATPACK, LOW PROFILE
Parallel/Serial PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
power supply 2.5/3.3,3.3 V 2.5/3.3,3.3 V 2.5/3.3,3.3 V 2.5/3.3,3.3 V 2.5/3.3,3.3 V 2.5/3.3,3.3 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum standby current 0.085 A 0.09 A 0.085 A 0.085 A 0.09 A 0.085 A
Minimum standby current 3.14 V 3.14 V 3.14 V 3.14 V 3.14 V 3.14 V
Maximum slew rate 0.185 mA 0.225 mA 0.185 mA 0.185 mA 0.225 mA 0.185 mA
surface mount YES YES YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level INDUSTRIAL AUTOMOTIVE INDUSTRIAL INDUSTRIAL AUTOMOTIVE INDUSTRIAL
Terminal form GULL WING BALL GULL WING GULL WING GULL WING GULL WING
Terminal pitch 0.65 mm 1 mm 0.65 mm 0.65 mm 0.65 mm 0.65 mm
Terminal location QUAD BOTTOM QUAD QUAD QUAD QUAD
Is it lead-free? Lead free - Lead free Contains lead Lead free Contains lead
Parts packaging code QFP - QFP QFP QFP QFP
Contacts 100 - 100 100 100 100
ECCN code 3A991.B.2.A - 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A
Other features FLOW-THROUGH ARCHITECTURE - FLOW-THROUGH ARCHITECTURE FLOW-THROUGH ARCHITECTURE FLOW-THROUGH ARCHITECTURE FLOW-THROUGH ARCHITECTURE
JESD-609 code e3 - e3 e0 e3 e0
length 20 mm - 20 mm 20 mm 20 mm 20 mm
Number of functions 1 - 1 1 1 1
Peak Reflow Temperature (Celsius) 260 - 260 240 260 240
Maximum seat height 1.6 mm - 1.6 mm 1.6 mm 1.6 mm 1.6 mm
Maximum supply voltage (Vsup) 3.465 V - 3.465 V 3.465 V 3.465 V 3.465 V
Minimum supply voltage (Vsup) 3.135 V - 3.135 V 3.135 V 3.135 V 3.135 V
Nominal supply voltage (Vsup) 3.3 V - 3.3 V 3.3 V 3.3 V 3.3 V
Terminal surface Matte Tin (Sn) - annealed - Matte Tin (Sn) - annealed Tin/Lead (Sn/Pb) Matte Tin (Sn) - annealed Tin/Lead (Sn/Pb)
Maximum time at peak reflow temperature 40 - 40 30 40 30
width 14 mm - 14 mm 14 mm 14 mm 14 mm
Maker - Integrated Silicon Solution ( ISSI ) Integrated Silicon Solution ( ISSI ) Integrated Silicon Solution ( ISSI ) Integrated Silicon Solution ( ISSI ) Integrated Silicon Solution ( ISSI )

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