EEWORLDEEWORLDEEWORLD

Part Number

Search

C1206N169C1GRC

Description
Ceramic Capacitor, Multilayer, Ceramic, 100V, 15.62% +Tol, 15.62% -Tol, BP, 30ppm/Cel TC, 0.0000016uF, Surface Mount, 1206, CHIP
CategoryPassive components    capacitor   
File Size459KB,5 Pages
ManufacturerKEMET
Websitehttp://www.kemet.com
Environmental Compliance
Download Datasheet Parametric View All

C1206N169C1GRC Overview

Ceramic Capacitor, Multilayer, Ceramic, 100V, 15.62% +Tol, 15.62% -Tol, BP, 30ppm/Cel TC, 0.0000016uF, Surface Mount, 1206, CHIP

C1206N169C1GRC Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
package instruction, 1206
Reach Compliance Codecompliant
ECCN codeEAR99
capacitance0.0000016 µF
Capacitor typeCERAMIC CAPACITOR
dielectric materialsCERAMIC
high1.3 mm
JESD-609 codee3
length3.2 mm
Manufacturer's serial numberC
Installation featuresSURFACE MOUNT
multi-layerYes
negative tolerance15.625%
Number of terminals2
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
Package shapeRECTANGULAR PACKAGE
Package formSMT
method of packingBULK; TR, 7 INCH
positive tolerance15.625%
Rated (DC) voltage (URdc)100 V
GuidelineMIL-PRF-55681
seriesC(SIZE)N
size code1206
surface mountYES
Temperature characteristic codeBP
Temperature Coefficient30ppm/Cel ppm/°C
Terminal surfaceMatte Tin (Sn) - with Nickel (Ni) barrier
Terminal shapeWRAPAROUND
width1.6 mm
Base Number Matches1
CERAMIC CHIP/MIL-PRF-55681
CAPACITOR OUTLINE DRAWINGS
CHIP DIMENSIONS
“SOLDERGUARD I” *
SOLDER
“SOLDERGUARD II”
TINNED
W
T
L
BW
NICKEL
ELECTRODES
SILVER
METALLIZATION
ELECTRODES
NICKEL
SILVER
METALLIZATION
Military Designation - “S” or “U”
KEMET Designation - “H”
Military Designation - “W” or “Y”
KEMET Designation - “C”
DIMENSIONS—MILLIMETERS AND (INCHES)
STYLE
KEMET
SIZE
CODE
T
L
W
MIN.
MAX.
BW
CDR01
CDR02
CDR03
CDR04
CDR05
CDR06
CDR31
CDR32
CDR33
CDR34
CDR35
C0805
C1805
C1808
C1812
C1825
C2225
C0805
C1206
C1210
C1812
C1825
2.03 ±.38 (.080 ±.015)
4.57 ±.38 (.180 ±.015)
4.57 ±.38 (.180 ±.015)
4.57 ±.38 (.180 ±.015)
+.51
+.020
4.57
.180
–.38
–.015
5.72 ±.51 (.225 ±.020)
2.00 ±.20 (.078 ±.008)
3.20 ±.20 (.125 ±.008)
3.20 ±.25 (.125 ±.010)
4.50 ±.25 (.176 ±.010)
4.50 ±.30 (.176 ±.012)
(
)
1.27 ±.38 (.050 ±.015)
1.27 ±.38 (.050 ±.015)
2.03 ±.38 (.080 ±.015)
3.18 ±.38 (.125 ±.015)
+.51
+.020
6.35
.250
–.38
–.015
6.35 ±.51 (.250 ±.020)
1.25 ±.20 (.049 ±.008)
1.60 ±.20 (.062 ±.008)
2.50 ±.25 (.098 ±.010)
3.20 ±.25 (.125 ±.010)
6.40 ±.30 (.250 ±.012)
.56 (.022)
.56 (.022)
.56 (.022)
.56 (.022)
.51 (.020)
.51 (.020)
1.40 (.055)
1.40 (.055)
2.03 (.080)
2.03 (.080)
2.03 (.080)
2.03 (.080)
1.30 (.051)
1.30 (.051)
1.50 (.059)
1.50 (.059)
1.50 (.059)
.51 ± 0.25 (.020 ±.010)
.51 ± 0.25 (.020 ±.010)
.51 ± 0.25 (.020 ±.010)
.51 ± 0.25 (.020 ±.010)
.51 ± 0.25 (.020 ±.010)
.51 ± 0.25 (.020 ±.010)
.50 ± 0.20 (.020 ±.008)
.50 ± 0.20 (.020 ±.008)
.50 ± 0.25 (.020 ±.010)
.50 ± 0.25 (.020 ±.010)
.50 ± 0.30 (.020 ±.012)
(
)
Note: For Solderguard I (MIL-C55681 “S” or “U” Endmets), the length, width and thickness positive tolerances (including bandwidth) cited above are allowed to increase by the following
amounts:
Width/Thickness
Length
CDR01
0.51MM (.020)
0.38MM (.015)
CDR02-06
0.64MM (.025)
0.38MM (.015)
CDR31-35
0.60MM (.023)
0.30MM (.012)
MIL-PRF-55681 PART NUMBER ORDERING INFORMATION
CDR01
B P
101 B K
S M
STYLE & SIZE CODE
STYLE
C — Ceramic
D — Dielectric, Fixed Chip
R — Established Reliability
FAILURE RATE LEVEL
(%/1000 hrs.)
TERMINATION FINISH
S — Solder Coated, Final
(SolderGuard I)
U — Base Metalization—
Barrier Metal—Solder
Coated (SolderGuard I)
W — Base Metalization—
Barrier Metal—Tinned
Tin or (Tin/Lead Alloy)
SolderGuard II
Y — Base Metalization
Barrier Metal—Tinned
(100% Tin) Solderguard II
RATED TEMPERATURE
–55°C to +125°C
DIELECTRICS
P —± 30 PPM/°C—WITH OR WITHOUT VOLTAGE
X —± 15%—without voltage
+ 15%, –25%—with voltage
CAPACITANCE
Expressed in picofarads (pF).
First 2 digits represent significant figures and the last digit specifies the number of zeros to follow.
(Use 9 for 1.0 through 9.9pF. Example: 2.2pF = 229)
CAPACITANCE TOLERANCE
B
C
D
F
±.1 pF ±.25 pF ±.5 pF ±1%
J
±5%
K
M
±10% ±20%
RATED VOLTAGE
A — 50; B — 100
KEMET/MIL-PRF-55681 PART NUMBER EQUIVALENTS
C 0805
P 101 K
1 G M C*
CERAMIC
SIZE CODE
See Table Above
END METALIZATION
C — SolderGuard II
(100% Sn)
(Military equiv: Y, W)
H — SolderGuard I
(Sn60)
(Military equiv: S, U)
SPECIFICATION
P -MIL-PRF-55681 = CDR01-CDR06
N-MIL-PRF-55681 = CDR31-CDR35
FAILURE RATE
(%/1,000 hrs.)
M — 1.0
P — 0.1
R — 0.01
S — 0.001
CAPACITANCE CODE
Expressed in picofarads (pF).
First two digits represent significant figures.
Third digit specifies number of zeros. (Use 9
for 1.0 thru 9.9 pF. Example: 2.2 pF –229)
VOLTAGE TEMPERATURE CHARACTERISTIC
Designated by Capacitance
Change Over Temperature Range
G — BP (C0G/NP0) (±30 PPM/°C)
X — BX (±15% Without Voltage
+15% -25% With Voltage)
CAPACITANCE TOLERANCE
B
C
D
F
J
K
M
±
.1 pF
±
.25 pF
±
.5 pF
±
1%
±
5%
±
10%
±
20%
VOLTAGE
1 — 100V, 5 — 50V
* Part Number Example: C0805P101K1GMC
(14 digits - no spaces)
©KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300
87
Ceramic Surface Mount
M — 1.0
P — 0.1
R — 0.01
S — 0.001
Which one has lower power consumption?
[color=#333333][font=Arial, Helvetica, sans-serif]Whose power consumption is lower? The chart shown by Geng Lifeng shows that Cortex-M0+ has the upper hand, but he also admits that TI's Wolverine tech...
wangfuchong ARM Technology
Help, kernel and user state issues regarding virtual printer drivers
I am a newbie and I have a very confusing question. I am going to write a driver for a virtual printer that can run under Vista. I thought that the printer driver under XP was in kernel mode, but I fo...
yangrui7202 Embedded System
Microbit Crowdfunding Opinion Collection
In order to better crowdfund the mocrobit development board (Chinese version), make it easier to use, meet everyone's needs, and have certain characteristics, this post is launched to collect opinions...
dcexpert MicroPython Open Source section
Array Address
Recently I am learning about the TFT controller of STM32F429-Discovery. I read the official examples and there is one part that puzzles me. /* Start Address configuration: frame buffer is located at F...
woody_chen stm32/stm8
"Saturated Inductance" Summit Lecture!
Author: nc965 [color=#3e3e3e]There is little information available on saturated inductor design, but engineering practice is necessary. In fact, a good saturated inductor design has a global impact on...
木犯001号 Analogue and Mixed Signal
【Play with LaunchPad】ADC10 Introduction
This series of documents would like to thank forum members wstt, david_lee, cat3902982, sugerlatu, zhangdaoyu and other friends for their strong support. They spent a lot of time and energy to organiz...
EEWORLD社区 Microcontroller MCU

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 403  1510  2097  1186  2593  9  31  43  24  53 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号