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587-10-316-10-005437

Description
IC Socket, BGA316, 316 Contact(s), ROHS COMPLIANT
CategoryThe connector    socket   
File Size216KB,2 Pages
ManufacturerMill-Max
Websitehttps://www.mill-max.com
Environmental Compliance
Download Datasheet Parametric View All

587-10-316-10-005437 Overview

IC Socket, BGA316, 316 Contact(s), ROHS COMPLIANT

587-10-316-10-005437 Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
package instructionROHS COMPLIANT
Reach Compliance Codecompliant
ECCN codeEAR99
Other featuresBGA ADAPTER
Contact to complete cooperationGOLD (10) OVER NICKEL (150)
Contact completed and terminatedGold (Au) - with Nickel (Ni) barrier
Contact materialBRASS
Device slot typeIC SOCKET
Type of equipment usedBGA316
Shell materialGLASS FILLED EPOXY
JESD-609 codee4
Number of contacts316
Base Number Matches1
 Product Number: 587-10-316-10-005437
Description:
BGA Header
.050 Grid; BGA Header
Plating Code:
10
Shell Plating:
10 μ" Gold over 100 μ" Nickel
316-10-005
20 X 20 
#
Of
Pins
316
Mill-Max
Part
Number
587-10-316-10-005437
RoHS
Compliant
 LOOSE PIN:
Pin Used: 8737 (Brass Alloy)
BRASS ALLOY
(UNS C36000) per ASTM B 16
Properties of BRASS ALLOY:
Chemical composition: Cu 61.5%, Zn 35.4%, Pb 3.1%†
Hardness as machined: 80-90 Rockwell B
Density: .307 lbs/in3
Electrical conductivity: 26% IACS*
Melting point: 900°C/885°C (liquidus/solidus)
†(3 to 4% lead is used to permit "free machining" and is permitted by EC Directive 2002/95Annex 6; so all pin
materials are RoHS compliant)
*International Annealed Copper Standard, i.e. as a % of pure copper.
 INSULATOR INFORMATION:
FR-4
Laminate
High Temperature
Properties of FR-4 Laminate:
Epoxy/Glass Laminate. Thicknesses available: .010", .020", .031", .047", .062", .093", .125" (natural color, beige)
ENVIRONMENTAL DATA:
Operating temperature range: -55/+125 °C
Shock (No electrical discontinuity greater than 1μs):50 G
Solderability: 364-52
Resistance to soldering heat: 364-56A Test Cond. C
Mill-Max Mfg. Corp. Datasheet — Last Modified 6/6/2009
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