Automotive Sensor Signal Conditioner
with LIN and PWM Interface
ZSSC3170
Datasheet
Brief Description
The ZSSC3170 is a CMOS integrated circuit for highly
accurate amplification and sensor specific correction
of bridge sensor signals. Featuring a maximum analog
gain of 420, as well as extended offset compensation
capabilities, the ZSSC3170 is adjustable to nearly all
resistive bridge sensor types.
Digital compensation of offset, sensitivity, temperature
drift, and nonlinearity is accomplished via a 16-bit
RISC microcontroller. Conditioning coefficients are
stored in an EEPROM certified for automotive appli-
cations.
Measured values are provided by one of the digital
LIN or PWM interfaces. Each interface can support
end-of-line calibration using the sensor output. Noise
sensitivity is greatly reduced because the calibration
equipment and the ZSSC3170 are mated digitally.
For quick and easy evaluation and support for
calibrating prototypes, IDT offers the ZSSC3170 SSC
Evaluation Kit, which includes evaluation hardware,
SSOP20 samples, and software.
Benefits
Measurement and temperature signal available via
one output pin
Compatible with nearly all resistive bridge inputs
No external trimming components required
Single-pass calibration minimizes calibration costs
End-of-line calibration using sensor output
Optimized for automotive environments with
special protection circuitry, excellent electro-
magnetic compatibility, and numerous diagnostic
features; AEC-Q100-qualified
Available Support
Evaluation Kit
Application Notes
Calculation Tools
Physical Characteristics
Features
Complies with LIN specifications 1.3 / 2.0 / 2.1
Configurable LIN publisher frame content
Data conversion rate of up to 430Hz fully utilizes
the maximum LIN channel capacity of 20kbit/s
PWM high-side and low-side switches, support for
LIN communication for end-of-line calibration
Digital compensation of offset, gain, temperature
nd
rd
effects up to 2 order, and nonlinearity up to 3
order. Compensation of temperature sensor offset,
nd
gain, and nonlinearity up to 2 order.
Internal or external temperature reference
Media temperature sensing by diode or RTD
Load dump protection of the LIN pin up to ±40V
Accuracy
±0.25% FSO @ -20 to 85°C
±0.50% FSO @ -40 to 125°C
±1.00% FSO @ -40 to 150°C
3 EEPROM words available for optional user data
Supply voltage: 7 to 18 V
Current consumption in Sleep Mode: ≤ 100μA
Input span: 1.8 to 267 mV/V
ADC resolution: 13 to 14 bit
Output resolution: up to 12-bit (LIN and PWM)
Operating temperature range: -40 to 125°C
Extended operating temperature range: ≤150°C
RoHS-compliant delivery form options:
SSOP20, DFN20, or die
ZSSC3170 Basic Circuit
LIN
GND
VBAT
© 2016 Integrated Device Technology, Inc.
1
ZSSC3170
May 30, 2016
Automotive Sensor Signal Conditioner
with LIN and PWM Interface
ZSSC3170
Datasheet
VDDA
ZSSC3170
Block Diagram
Ext. Temp.
Diode
VBR_T
Sensor
Bridge
Control Registers
I
2
C
TM
*
SCL
SDA
HOUT
Temp. Sens.
Select
Gain
Factor
Offset
Shift
ADC
Mode
RAM
PWM
LOUT
VTN1
VBN
VBP
MUX
PGA
Analog Front-End (AFE)
ADC
CMC
LIN
LIN
Ext. RTD
EEPROM
VTN2
VBR_B
VSSA
Internal
Temp.
Sensor
Protection &
Power
Management
Interfaces
VB
VSSE
Digital Block
ZSSC3170
* I
2
C™ is a trademark of NXP.
Applications
LIN Pressure Sensor with Temperature Sensor
LIN
11
LIN
VSS
10
VSSE
VB
9
8
C3
220pF
GND
VBAT
C2
220nF
R1
10W
Sensor Bridge
With Integrated
Temperature Diode
12
LOUT
13
n.c.
14
15
16
17
18
19
20
VBN
VBR_B
VBP
VTN 1
VBR_T
VTN2
n.c.
HOUT
7
ZSSC3170
VDD
6
SCL
SDA
5
4
SCL
SDA
RTD Media
Temperature
Sensor
VSSA
3
R2
VDDA
2
n.c.
1
C1
100nF
Ordering Information
(See section 7 in the data sheet for additional options.)
Product Sales Code
ZSSC3170FE1B
ZSSC3170FE1C
ZSSC3170FE2
ZSSC3170EE1B
ZSSC3170EE1C
ZSSC3170EE2
ZSSC3170EE3R
ZSSC3170EA1B
ZSSC3170EA1C
ZSSC3170EA3R
ZSSC3170KIT
.
Description
ZSSC3170 Die Revision F — Temperature range: -40°C to +150°C
ZSSC3170 Die Revision F — Temperature range: -40°C to +150°C
ZSSC3170 SSOP20 Revision F — Temperature range: -40°C to +150°C
ZSSC3170 Die Revision E — Temperature range: -40°C to +150°C
ZSSC3170 Die Revision E — Temperature range: -40°C to +150°C
ZSSC3170 SSOP20 Revision E — Temperature range: -40°C to +150°C
ZSSC3170 DFN20 Revision E — Temperature Range -40°C to +150°C
ZSSC3170 Die Revision E — Temperature range: -40°C to +125°C
ZSSC3170 Die Revision E — Temperature range: -40°C to +125°C
ZSSC3170 DFN20 Revision E — Temperature Range -40°C to +125°C
ZSSC3170 Evaluation Kit and 5 SSOP20 samples
Package
Unsawn on Wafer, 2450 pcs.
Sawn on Wafer Frame, 2450 pcs.
Add R for 13” reel, 2000 pcs. Add T for tube, 660 pcs.
Unsawn on Wafer, 2450 pcs.
Sawn on Wafer Frame, 2450 pcs.
Add R for 13” reel, 2000 pcs. Add T for tube, 660 pcs.
13” Reel, 4500 pcs
Unsawn on Wafer, 2450 pcs.
Sawn on Wafer Frame, 2450 pcs.
13” Reel, 4500 pcs
Kit
© 2016 Integrated Device Technology, Inc.
2
May 30, 2016
ZSSC3170 Datasheet
Contents
1
ZSSC3170 Characteristics ............................................................................................................ 5
1.1
1.2
1.3
1.4
1.5
2
2.1
2.2
2.3
Absolute Maximum Ratings ..................................................................................................... 5
Operating Conditions............................................................................................................... 6
Electrical Parameters .............................................................................................................. 6
Interface Characteristics ........................................................................................................ 11
EEPROM .............................................................................................................................. 11
Signal Flow and Block Diagram ............................................................................................. 12
Application Modes ................................................................................................................. 13
Analog Front End (AFE) ........................................................................................................ 14
Programmable Gain Amplifier (PGA) ............................................................................... 14
Offset Compensation ....................................................................................................... 14
Analog-to-Digital Converter ............................................................................................. 15
Circuit Description ....................................................................................................................... 12
2.3.1
2.3.2
2.3.3
2.4
2.5
Temperature Measurement ................................................................................................... 17
System Control and Conditioning Calculation ........................................................................ 18
Operating Modes ............................................................................................................. 18
Start-Up Phase ................................................................................................................ 18
Measurement Cycle ......................................................................................................... 19
Conditioning Calculation .................................................................................................. 20
PWM Outputs HOUT and LOUT ...................................................................................... 20
2.5.1
2.5.2
2.5.3
2.5.4
2.6
2.6.1
Signal Outputs....................................................................................................................... 20
2.6.2 LIN Output ....................................................................................................................... 21
2.7 Digital Test and Calibration Interface ..................................................................................... 21
2.8
2.9
3
3.1
3.2
4
Diagnostic and Failsafe Features, Watchdog, and Error Detection ........................................ 21
High Voltage, Reverse Polarity, and Short Circuit Protection ................................................. 21
Application Circuit Examples ................................................................................................. 22
Dimensioning of External Components.................................................................................. 23
Application Circuit Examples and External Components ............................................................. 22
Pinout and Package Options ....................................................................................................... 24
4.1 Die Pad Definitions and Configuration ................................................................................... 24
4.2
4.3
SSOP20 Package ................................................................................................................. 25
DFN20 Package .................................................................................................................... 25
© 2016 Integrated Device Technology, Inc.
3
May 30, 2016
ZSSC3170 Datasheet
5
6
7
8
9
ESD Protection and EMC Specification ....................................................................................... 26
Reliability and RoHS Conformity ................................................................................................. 26
Ordering Information ................................................................................................................... 26
Related Documents ..................................................................................................................... 27
Glossary ...................................................................................................................................... 27
10 Document Revision History ......................................................................................................... 29
List of Figures
Figure 2.1 Block Diagram of ZSSC3170 ........................................................................................... 12
Figure 2.2 Measurement Cycle ........................................................................................................ 19
Figure 3.1 Application Circuit in PWM Mode with Low-Side Switch .................................................. 22
Figure 3.2 Application Circuit in PWM Mode with High-Side Switch ................................................. 22
Figure 3.3 Application Circuit in LIN Mode........................................................................................ 23
List of Tables
Table 1.1
Table 1.2
Table 1.3
Table 1.4
Table 1.5
Table 2.1
Table 2.2
Table 2.3
Table 2.4
Table 2.5
Table 3.1
Table 4.1
Table 4.2
Absolute Maximum Ratings ............................................................................................... 5
Operating Conditions......................................................................................................... 6
Electrical Parameters ........................................................................................................ 6
Interface Characteristics .................................................................................................. 11
EEPROM ........................................................................................................................ 11
Configuration for Application Modes ................................................................................ 13
Adjustable Gain Stages, Corresponding Sensor Signal Spans, and Common Mode Ranges
........................................................................................................................................ 14
Bridge Sensor Offset Shift Ranges .................................................................................. 15
A/D Resolution and Conversion Time in PWM Modes ..................................................... 16
A/D Resolution and Conversion Time in LIN Modes ........................................................ 16
Dimensioning of External Components for Application Examples .................................... 23
Die Pad Definitions for ZSSC3170 .................................................................................. 24
Pin Definition of SSOP20 Package .................................................................................. 25
© 2016 Integrated Device Technology, Inc.
4
May 30, 2016
ZSSC3170 Datasheet
1
ZSSC3170 Characteristics
1.1 Absolute Maximum Ratings
The absolute maximum ratings are stress ratings only. The device might not function or be operable above the
recommended operating conditions given in section 1.2. Stresses exceeding the absolute maximum ratings might
also damage the device. In addition, extended exposure to stresses above the recommended operating
conditions might affect device reliability. IDT does not recommend designing to the “Absolute Maximum Ratings.”
Parameters are valid without time limit unless otherwise noted.
Table 1.1
No.
1.1.1
1.1.2
1.1.3
1.1.4
1.1.5
1.1.6
1.1.7
1.1.8
1.1.9
1.1.10
1.1.11
1)
2)
3)
Absolute Maximum Ratings
Parameter
Symbol
VBAT
PWM
VB
PWM
VBAT
LIN
VB
LIN
V
HOUT,
V
LOUT
V
LIN
3)
Conditions
To VSSE (external GND)
To VSSE
To VSS (external GND)
To VSS
To VSSE
To VSS
To VSSA
To VSSA
To VSSA
Min
-18
-0.3
-18
-0.3
-18
-40
-0.3
-0.3
-0.3
-40
Typ
Max
18
18
40
40
18
40
6.5
6.5
VDDA
+0.3
150
170
Unit
V
V
V
V
V
V
V
V
V
C
C
External Supply Voltage —
1), 2)
PWM Mode
Supply Voltage on VB Pin—
1), 2)
PWM Mode
External Supply Voltage —
1), 2)
LIN Mode
Supply Voltage on VB Pin—
1) 2)
LIN Mode ,
Voltage at HOUT and
1) 2)
LOUT Pins ,
Voltage at LIN pin ,
1) 2)
Analog Supply Voltage
Digital Supply Voltage
VDDA
VDD
V
AIO
,
V
DIO
T
STOR
T
STRG_EXT
3)
Voltage at all other Analog or
3)
Digital Pins
Storage Temperature
Extended Storage Temperature
t < 10h
-40
Refer to the
ZSSC3170 High Voltage Protection Description
for detailed specifications.
Refer to section 3.1 for the application circuit.
No measurement in mass production; parameter is guaranteed by design and/or quality monitoring.
© 2016 Integrated Device Technology, Inc.
5
May 30, 2016
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