IC 1-CH 8-BIT FLASH METHOD ADC, PARALLEL ACCESS, CQCC20, LCC-20, Analog to Digital Converter
| Parameter Name | Attribute value |
| Is it lead-free? | Contains lead |
| Is it Rohs certified? | incompatible |
| Parts packaging code | QLCC |
| package instruction | LCC-20 |
| Contacts | 20 |
| Reach Compliance Code | compliant |
| ECCN code | 3A001.A.2.C |
| Maximum conversion time | 0.975 µs |
| Converter type | ADC, FLASH METHOD |
| JESD-30 code | S-CQCC-N20 |
| JESD-609 code | e0 |
| length | 8.89 mm |
| Number of analog input channels | 1 |
| Number of digits | 8 |
| Number of functions | 1 |
| Number of terminals | 20 |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| Output bit code | BINARY |
| Output format | PARALLEL, 8 BITS |
| Package body material | CERAMIC, METAL-SEALED COFIRED |
| encapsulated code | QCCN |
| Package shape | SQUARE |
| Package form | CHIP CARRIER |
| Peak Reflow Temperature (Celsius) | 220 |
| Certification status | Not Qualified |
| Maximum seat height | 2.54 mm |
| Maximum slew rate | 25 mA |
| Nominal supply voltage | 5 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | MILITARY |
| Terminal surface | TIN LEAD |
| Terminal form | NO LEAD |
| Terminal pitch | 1.27 mm |
| Terminal location | QUAD |
| Maximum time at peak reflow temperature | 30 |
| width | 8.89 mm |
| Base Number Matches | 1 |
| 5962-89518012B | 5962-8951801RX | 5962-8951801RB | 5962-89518012C | 5962-89518012X | 5962-8951801RC | |
|---|---|---|---|---|---|---|
| Description | IC 1-CH 8-BIT FLASH METHOD ADC, PARALLEL ACCESS, CQCC20, LCC-20, Analog to Digital Converter | IC 1-CH 8-BIT FLASH METHOD ADC, PARALLEL ACCESS, CDIP20, 1.060 X 0.310 INCH, CERDIP-20, Analog to Digital Converter | IC 1-CH 8-BIT FLASH METHOD ADC, PARALLEL ACCESS, CDIP20, 1.060 X 0.310 INCH, CERDIP-20, Analog to Digital Converter | IC 1-CH 8-BIT FLASH METHOD ADC, PARALLEL ACCESS, CQCC20, LCC-20, Analog to Digital Converter | IC 1-CH 8-BIT FLASH METHOD ADC, PARALLEL ACCESS, CQCC20, LCC-20, Analog to Digital Converter | IC 1-CH 8-BIT FLASH METHOD ADC, PARALLEL ACCESS, CDIP20, 1.060 X 0.310 INCH, CERDIP-20, Analog to Digital Converter |
| Is it lead-free? | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
| Parts packaging code | QLCC | DIP | DIP | QLCC | QLCC | DIP |
| package instruction | LCC-20 | DIP, | 1.060 X 0.310 INCH, CERDIP-20 | LCC-20 | QCCN, | DIP, |
| Contacts | 20 | 20 | 20 | 20 | 20 | 20 |
| Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant |
| ECCN code | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C |
| Maximum conversion time | 0.975 µs | 0.975 µs | 0.975 µs | 0.975 µs | 0.975 µs | 0.975 µs |
| Converter type | ADC, FLASH METHOD | ADC, FLASH METHOD | ADC, FLASH METHOD | ADC, FLASH METHOD | ADC, FLASH METHOD | ADC, FLASH METHOD |
| JESD-30 code | S-CQCC-N20 | R-GDIP-T20 | R-GDIP-T20 | S-CQCC-N20 | S-CQCC-N20 | R-GDIP-T20 |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 |
| Number of analog input channels | 1 | 1 | 1 | 1 | 1 | 1 |
| Number of digits | 8 | 8 | 8 | 8 | 8 | 8 |
| Number of functions | 1 | 1 | 1 | 1 | 1 | 1 |
| Number of terminals | 20 | 20 | 20 | 20 | 20 | 20 |
| Maximum operating temperature | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| Minimum operating temperature | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
| Output bit code | BINARY | BINARY | BINARY | BINARY | BINARY | BINARY |
| Output format | PARALLEL, 8 BITS | PARALLEL, 8 BITS | PARALLEL, 8 BITS | PARALLEL, 8 BITS | PARALLEL, 8 BITS | PARALLEL, 8 BITS |
| Package body material | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED |
| encapsulated code | QCCN | DIP | DIP | QCCN | QCCN | DIP |
| Package shape | SQUARE | RECTANGULAR | RECTANGULAR | SQUARE | SQUARE | RECTANGULAR |
| Package form | CHIP CARRIER | IN-LINE | IN-LINE | CHIP CARRIER | CHIP CARRIER | IN-LINE |
| Peak Reflow Temperature (Celsius) | 220 | NOT SPECIFIED | NOT SPECIFIED | 220 | 220 | NOT SPECIFIED |
| Certification status | Not Qualified | Qualified | Not Qualified | Not Qualified | Qualified | Not Qualified |
| Maximum seat height | 2.54 mm | 5.08 mm | 5.08 mm | 2.54 mm | 2.54 mm | 5.08 mm |
| Maximum slew rate | 25 mA | 25 mA | 25 mA | 25 mA | 25 mA | 25 mA |
| Nominal supply voltage | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | YES | NO | NO | YES | YES | NO |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
| Terminal surface | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD |
| Terminal form | NO LEAD | THROUGH-HOLE | THROUGH-HOLE | NO LEAD | NO LEAD | THROUGH-HOLE |
| Terminal pitch | 1.27 mm | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm | 2.54 mm |
| Terminal location | QUAD | DUAL | DUAL | QUAD | QUAD | DUAL |
| Maximum time at peak reflow temperature | 30 | NOT SPECIFIED | NOT SPECIFIED | 30 | 30 | NOT SPECIFIED |
| width | 8.89 mm | 7.62 mm | 7.62 mm | 8.89 mm | 8.89 mm | 7.62 mm |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 |
| Maker | - | ADI | ADI | - | ADI | ADI |
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