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MX28F2000TQC-12C4

Description
2M-BIT [256K x 8] CMOS FLASH MEMORY
Categorystorage    storage   
File Size119KB,31 Pages
ManufacturerMacronix
Websitehttp://www.macronix.com/en-us/Pages/default.aspx
Download Datasheet Parametric Compare View All

MX28F2000TQC-12C4 Overview

2M-BIT [256K x 8] CMOS FLASH MEMORY

MX28F2000TQC-12C4 Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerMacronix
Parts packaging codeLCC
package instructionQCCJ, LDCC32,.5X.6
Contacts32
Reach Compliance Codeunknown
ECCN codeEAR99
Maximum access time120 ns
command user interfaceYES
Data pollingYES
JESD-30 codeR-PQCC-J32
JESD-609 codee0
length14.0462 mm
memory density2097152 bit
Memory IC TypeFLASH
memory width8
Number of functions1
Number of departments/size8,14
Number of terminals32
word count262144 words
character code256000
Operating modeASYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize256KX8
Package body materialPLASTIC/EPOXY
encapsulated codeQCCJ
Encapsulate equivalent codeLDCC32,.5X.6
Package shapeRECTANGULAR
Package formCHIP CARRIER
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply5 V
Programming voltage12 V
Certification statusNot Qualified
Maximum seat height3.55 mm
Department size4K,16K
Maximum standby current0.0001 A
Maximum slew rate0.05 mA
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formJ BEND
Terminal pitch1.27 mm
Terminal locationQUAD
Maximum time at peak reflow temperatureNOT SPECIFIED
switch bitYES
typeNOR TYPE
width11.5062 mm
MX28F2000T
2M-BIT [256K x 8] CMOS FLASH MEMORY
FEATURES
• 262,144 bytes by 8-bit organization
• Fast access time: 90/120 ns
• Low power consumption
– 50mA maximum active current
– 100uA maximum standby current
• Programming and erasing voltage 12V
±
5%
• Command register architecture
– Byte Programming (15us typical)
– Auto chip erase 5 seconds typical
(including preprogramming time)
– Block Erase
• Optimized high density blocked architecture
– Eight 4-KB blocks
– Fourteen 16-KB blocks
• Auto Erase (chip & block) and Auto Program
– DATA polling
– Toggle bit
• 10,000 minimum erase/program cycles
• Latch-up protected to 100mA from -1 to VCC+1V
• Advanced CMOS Flash memory technology
• Compatible with JEDEC-standard byte-wide 32-pin
EPROM pinouts
• Package type:
– 32-pin plastic DIP
– 32-pin PLCC
GENERAL DESCRIPTION
The MX28F2000T is a 2-mega bit Flash memory or-
ganized as 256K bytes of 8 bits each. MXIC's Flash
memories offer the most cost-effective and reliable
read/write non-volatile random access memory. The
MX28F2000T is packaged in 32-pin PDIP and PLCC
. It is designed to be reprogrammed and erased in-
system or in-standard EPROM programmers.
The standard MX28F2000T offers access times as
fast as 90 ns, allowing operation of high-speed
microprocessors without wait states. To eliminate
bus contention, the MX28F2000T has separate chip
enable (CE) and output enable (OE) controls.
MXIC's Flash memories augment EPROM function-
ality with in-circuit electrical erasure and
programming. The MX28F2000T uses a command
register to manage this functionality, while
maintaining a standard 32-pin pinout. The
command register allows for 100% TTL level control
inputs and fixed power supply levels during erase
and programming, while maintaining maximum
EPROM compatibility.
MXIC Flash technology reliably stores memory con-
tents even after 10,000 erase and program cycles.
The MXIC cell is designed to optimize the erase and
programming mechanisms. In addition, the combi-
nation of advanced tunnel oxide processing and low
internal electric fields for erase and programming
operations produces reliable cycling.
The
MX28F2000T uses a 12.0V
±
5% VPP supply to
perform the Auto Program/Erase algorithms.
The highest degree of latch-up protection is
achieved with MXIC's proprietary non-epi process.
Latch-up protection is proved for stresses up to 100
milliamps on address and data pin from -1V to VCC
+ 1V.
P/N: PM0472
1
REV. 1.0, Jun 13, 1997

MX28F2000TQC-12C4 Related Products

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Description 2M-BIT [256K x 8] CMOS FLASH MEMORY 2M-BIT [256K x 8] CMOS FLASH MEMORY 2M-BIT [256K x 8] CMOS FLASH MEMORY 2M-BIT [256K x 8] CMOS FLASH MEMORY 2M-BIT [256K x 8] CMOS FLASH MEMORY
Is it Rohs certified? incompatible incompatible incompatible - -
Maker Macronix Macronix Macronix Macronix -
Parts packaging code LCC LCC DIP DIP -
package instruction QCCJ, LDCC32,.5X.6 QCCJ, LDCC32,.5X.6 DIP, DIP32,.6 DIP, DIP32,.6 -
Contacts 32 32 32 32 -
Reach Compliance Code unknown unknow unknow unknow -
ECCN code EAR99 EAR99 EAR99 EAR99 -
Maximum access time 120 ns 90 ns 90 ns 120 ns -
command user interface YES YES YES YES -
Data polling YES YES YES YES -
JESD-30 code R-PQCC-J32 R-PQCC-J32 R-PDIP-T32 R-PDIP-T32 -
JESD-609 code e0 e0 e0 - -
length 14.0462 mm 14.0462 mm 41.91 mm 41.91 mm -
memory density 2097152 bit 2097152 bi 2097152 bi 2097152 bi -
Memory IC Type FLASH FLASH FLASH FLASH -
memory width 8 8 8 8 -
Number of functions 1 1 1 1 -
Number of departments/size 8,14 8,14 8,14 8,14 -
Number of terminals 32 32 32 32 -
word count 262144 words 262144 words 262144 words 262144 words -
character code 256000 256000 256000 256000 -
Operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS -
Maximum operating temperature 70 °C 70 °C 70 °C 70 °C -
organize 256KX8 256KX8 256KX8 256KX8 -
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY -
encapsulated code QCCJ QCCJ DIP DIP -
Encapsulate equivalent code LDCC32,.5X.6 LDCC32,.5X.6 DIP32,.6 DIP32,.6 -
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR -
Package form CHIP CARRIER CHIP CARRIER IN-LINE IN-LINE -
Parallel/Serial PARALLEL PARALLEL PARALLEL PARALLEL -
Peak Reflow Temperature (Celsius) NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED - -
power supply 5 V 5 V 5 V 5 V -
Programming voltage 12 V 12 V 12 V 12 V -
Certification status Not Qualified Not Qualified Not Qualified Not Qualified -
Maximum seat height 3.55 mm 3.55 mm 4.9022 mm 4.9022 mm -
Department size 4K,16K 4K,16K 4K,16K 4K,16K -
Maximum standby current 0.0001 A 0.0001 A 0.0001 A 0.0001 A -
Maximum slew rate 0.05 mA 0.05 mA 0.05 mA 0.05 mA -
Maximum supply voltage (Vsup) 5.5 V 5.5 V 5.5 V 5.5 V -
Minimum supply voltage (Vsup) 4.5 V 4.5 V 4.5 V 4.5 V -
Nominal supply voltage (Vsup) 5 V 5 V 5 V 5 V -
surface mount YES YES NO NO -
technology CMOS CMOS CMOS CMOS -
Temperature level COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL -
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) - -
Terminal form J BEND J BEND THROUGH-HOLE THROUGH-HOLE -
Terminal pitch 1.27 mm 1.27 mm 2.54 mm 2.54 mm -
Terminal location QUAD QUAD DUAL DUAL -
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED - -
switch bit YES YES YES YES -
type NOR TYPE NOR TYPE NOR TYPE NOR TYPE -
width 11.5062 mm 11.5062 mm 15.24 mm 15.24 mm -
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