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MX28F1000PPI-90

Description
1M-BIT [128K x 8] CMOS FLASH MEMORY
Categorystorage    storage   
File Size131KB,33 Pages
ManufacturerMacronix
Websitehttp://www.macronix.com/en-us/Pages/default.aspx
Download Datasheet Parametric View All

MX28F1000PPI-90 Overview

1M-BIT [128K x 8] CMOS FLASH MEMORY

MX28F1000PPI-90 Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerMacronix
Parts packaging codeDIP
package instruction0.600 INCH, PLASTIC, DIP-32
Contacts32
Reach Compliance Codeunknow
ECCN codeEAR99
Is SamacsysN
Maximum access time90 ns
command user interfaceYES
Data pollingYES
JESD-30 codeR-PDIP-T32
JESD-609 codee0
length41.91 mm
memory density1048576 bi
Memory IC TypeFLASH
memory width8
Number of functions1
Number of departments/size4,7
Number of terminals32
word count131072 words
character code128000
Operating modeASYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize128KX8
Package body materialPLASTIC/EPOXY
encapsulated codeDIP
Encapsulate equivalent codeDIP32,.6
Package shapeRECTANGULAR
Package formIN-LINE
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply5 V
Programming voltage12 V
Certification statusNot Qualified
Maximum seat height4.9022 mm
Department size4K,16K
Maximum standby current0.0001 A
Maximum slew rate0.05 mA
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountNO
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
switch bitYES
typeNOR TYPE
width15.24 mm
Base Number Matches1
MX28F1000P
1M-BIT [128K x 8] CMOS FLASH MEMORY
FEATURES
• 131,072 bytes by 8-bit organization
• Fast access time: 70ns(Vcc:5V±5%; CL:35pF)
90/120ns(Vcc:5V±10%; CL:100pF)
• Low power consumption
– 50mA maximum active current
– 100uA maximum standby current
• Programming and erasing voltage 12V
±
5%
• Command register architecture
– Byte Programming (15us typical)
– Auto chip erase 5 seconds typical
(including preprogramming time)
– Block Erase
• Optimized high density blocked architecture
– Four 4-KB blocks
– Seven 16-KB blocks
Auto Erase (chip & block) and Auto Program
– DATA polling
– Toggle bit
10,000 minimum erase/program cycles
Latch-up protected to 100mA from -1 to VCC+1V
Advanced CMOS Flash memory technology
Compatible with JEDEC-standard byte-wide 32-pin
EPROM pinouts
Package type:
– 32-pin plastic DIP
– 32-pin PLCC
– 32-pin TSOP (Type 1)
GENERAL DESCRIPTION
The MX28F1000P is a 1-mega bit Flash memory or-
ganized as 128K bytes of 8 bits each. MXIC's Flash
memories offer the most cost-effective and reliable
read/write non-volatile random access memory. The
MX28F1000P is packaged in 32-pin PDIP, PLCC
and TSOP. It is designed to be reprogrammed and
erased in-system or in-standard EPROM program-
mers.
The standard MX28F1000P offers access times as
fast as 70 ns, allowing operation of high-speed
microprocessors without wait states. To eliminate
bus contention, the MX28F1000P has separate chip
enable (CE) and output enable (OE ) controls.
MXIC's Flash memories augment EPROM function-
ality with in-circuit electrical erasure and
programming. The MX28F1000P uses a command
register to manage this functionality, while
maintaining a standard 32-pin pinout. The
command register allows for 100% TTL level control
inputs and fixed power supply levels during erase
and programming, while maintaining maximum
EPROM compatibility.
MXIC Flash technology reliably stores memory con-
tents even after 10,000 erase and program cycles.
The MXIC cell is designed to optimize the erase and
programming mechanisms. In addition, the combi-
nation of advanced tunnel oxide processing and low
internal electric fields for erase and programming
operations produces reliable cycling.
The
MX28F1000P uses a 12.0V
±
5% VPP supply to
perform the Auto Program/Erase algorithms.
The highest degree of latch-up protection is
achieved with MXIC's proprietary non-epi process.
Latch-up protection is proved for stresses up to 100
milliamps on address and data pin from -1V to VCC
+ 1V.
P/N: PM0340
1
REV. 1.6,JAN. 19, 1999

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