|
MMD-0153 |
MMD-0151 |
MMD-0803 |
MMD-0815 |
MMD-0825 |
MMD-0840 |
MMD-0833 |
| Description |
SILICON, STEP RECOVERY DIODE |
SILICON, STEP RECOVERY DIODE |
SILICON, STEP RECOVERY DIODE |
SILICON, STEP RECOVERY DIODE |
SILICON, STEP RECOVERY DIODE |
SILICON, STEP RECOVERY DIODE |
SILICON, STEP RECOVERY DIODE |
| Is it lead-free? |
Lead free |
Lead free |
Lead free |
Lead free |
Lead free |
Lead free |
Lead free |
| Is it Rohs certified? |
conform to |
conform to |
conform to |
conform to |
conform to |
conform to |
conform to |
| Reach Compliance Code |
unknown |
unknown |
unknown |
unknown |
unknown |
unknown |
unknown |
| application |
COMB GENERATOR; FREQUENCY MULTIPLIER |
COMB GENERATOR; FREQUENCY MULTIPLIER |
COMB GENERATOR; FREQUENCY MULTIPLIER |
COMB GENERATOR; FREQUENCY MULTIPLIER |
COMB GENERATOR; FREQUENCY MULTIPLIER |
COMB GENERATOR; FREQUENCY MULTIPLIER |
COMB GENERATOR; FREQUENCY MULTIPLIER |
| Minimum breakdown voltage |
25 V |
15 V |
70 V |
50 V |
45 V |
15 V |
25 V |
| Shell connection |
ISOLATED |
ISOLATED |
ISOLATED |
ISOLATED |
ISOLATED |
ISOLATED |
ISOLATED |
| Configuration |
SINGLE |
SINGLE |
SINGLE |
SINGLE |
SINGLE |
SINGLE |
SINGLE |
| Maximum diode capacitance |
0.4 pF |
0.65 pF |
6 pF |
4 pF |
2 pF |
0.6 pF |
1.6 pF |
| Diode component materials |
SILICON |
SILICON |
SILICON |
SILICON |
SILICON |
SILICON |
SILICON |
| Diode type |
STEP RECOVERY DIODE |
STEP RECOVERY DIODE |
STEP RECOVERY DIODE |
STEP RECOVERY DIODE |
STEP RECOVERY DIODE |
STEP RECOVERY DIODE |
STEP RECOVERY DIODE |
| JESD-30 code |
O-LALF-W2 |
O-LALF-W2 |
O-LALF-W2 |
O-LALF-W2 |
O-LALF-W2 |
O-LALF-W2 |
O-LALF-W2 |
| JESD-609 code |
e4 |
e4 |
e4 |
e4 |
e4 |
e4 |
e4 |
| Humidity sensitivity level |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
| Number of components |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
| Number of terminals |
2 |
2 |
2 |
2 |
2 |
2 |
2 |
| Maximum operating temperature |
200 °C |
200 °C |
200 °C |
200 °C |
200 °C |
200 °C |
200 °C |
| Minimum operating temperature |
-65 °C |
-65 °C |
-65 °C |
-65 °C |
-65 °C |
-65 °C |
-65 °C |
| Package body material |
GLASS |
GLASS |
GLASS |
GLASS |
GLASS |
GLASS |
GLASS |
| Package shape |
ROUND |
ROUND |
ROUND |
ROUND |
ROUND |
ROUND |
ROUND |
| Package form |
LONG FORM |
LONG FORM |
LONG FORM |
LONG FORM |
LONG FORM |
LONG FORM |
LONG FORM |
| Peak Reflow Temperature (Celsius) |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
| Certification status |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
| surface mount |
NO |
NO |
NO |
NO |
NO |
NO |
NO |
| Terminal surface |
GOLD |
GOLD |
GOLD |
GOLD |
GOLD |
GOLD |
GOLD |
| Terminal form |
WIRE |
WIRE |
WIRE |
WIRE |
WIRE |
WIRE |
WIRE |
| Terminal location |
AXIAL |
AXIAL |
AXIAL |
AXIAL |
AXIAL |
AXIAL |
AXIAL |
| Maximum time at peak reflow temperature |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
| Maker |
Cobham Semiconductor Solutions |
Cobham Semiconductor Solutions |
Cobham Semiconductor Solutions |
- |
Cobham Semiconductor Solutions |
Cobham Semiconductor Solutions |
Cobham Semiconductor Solutions |
| Base Number Matches |
1 |
1 |
1 |
1 |
- |
- |
- |
| package instruction |
- |
- |
O-LALF-W2 |
- |
O-LALF-W2 |
O-LALF-W2 |
O-LALF-W2 |
| minimum cutoff frequency |
- |
- |
100 MHz |
140 MHz |
160 MHz |
300 MHz |
175 MHz |