D8251AB datasheet, PDF - EEWORLD Datasheet

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D8251AB: DescriptionSerial I/O Controller, 1 Channel(s), 0.0078125MBps, MOS, CDIP28, CERAMIC, DIP-28; CategoryThe embedded processor and controller Microcontrollers and processors; File Size617KB，16 Pages; ManufacturerAMD; Websitehttp://www.amd.com

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D8251AB Overview

Serial I/O Controller, 1 Channel(s), 0.0078125MBps, MOS, CDIP28, CERAMIC, DIP-28

D8251AB Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	AMD
Parts packaging code	DIP
package instruction	DIP, DIP28,.6
Contacts	28
Reach Compliance Code	unknown
Is Samacsys	N
Address bus width
boundary scan	NO
Bus compatibility	IAPX 86; IAPX 88
maximum clock frequency	3.125 MHz
letter of agreement	ASYNC, BIT; SYNC, BYTE; BISYNC; EXT SYNC
Data encoding/decoding methods	NRZ
Maximum data transfer rate	0.0078125 MBps
External data bus width	8
JESD-30 code	R-GDIP-T28
JESD-609 code	e0
length	37.1475 mm
low power mode	NO
Number of DMA channels
Number of I/O lines
Number of serial I/Os	1
Number of terminals	28
On-chip data RAM width
Maximum operating temperature	70 °C
Minimum operating temperature
Package body material	CERAMIC, GLASS-SEALED
encapsulated code	DIP
Encapsulate equivalent code	DIP28,.6
Package shape	RECTANGULAR
Package form	IN-LINE
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	5 V
Certification status	Not Qualified
RAM (number of words)	0
Maximum seat height	5.715 mm
Maximum slew rate	100 mA
Maximum supply voltage	5.5 V
Minimum supply voltage	4.5 V
Nominal supply voltage	5 V
surface mount	NO
technology	MOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
width	15.24 mm
uPs/uCs/peripheral integrated circuit type	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL
Base Number Matches	1

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	D8251AB	ID8251AB	P8251A	P8251AB	D8251A	ID8251A
Description	Serial I/O Controller, 1 Channel(s), 0.0078125MBps, MOS, CDIP28, CERAMIC, DIP-28	Serial I/O Controller, 1 Channel(s), 0.0078125MBps, MOS, CDIP28, CERAMIC, DIP-28	Serial I/O Controller, 1 Channel(s), 0.0078125MBps, MOS, PDIP28, PLASTIC, DIP-28	Serial I/O Controller, 1 Channel(s), 0.0078125MBps, MOS, PDIP28, PLASTIC, DIP-28	Serial I/O Controller, 1 Channel(s), 0.0078125MBps, MOS, CDIP28, CERAMIC, DIP-28	Serial I/O Controller, 1 Channel(s), 0.0078125MBps, MOS, CDIP28, CERAMIC, DIP-28
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
Maker	AMD	AMD	AMD	AMD	AMD	AMD
Parts packaging code	DIP	DIP	DIP	DIP	DIP	DIP
package instruction	DIP, DIP28,.6	DIP, DIP28,.6	DIP, DIP28,.6	DIP, DIP28,.6	DIP, DIP28,.6	DIP, DIP28,.6
Contacts	28	28	28	28	28	28
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown
boundary scan	NO	NO	NO	NO	NO	NO
Bus compatibility	IAPX 86; IAPX 88	IAPX 86; IAPX 88	IAPX 86; IAPX 88	IAPX 86; IAPX 88	IAPX 86; IAPX 88	IAPX 86; IAPX 88
maximum clock frequency	3.125 MHz	3.125 MHz	3.125 MHz	3.125 MHz	3.125 MHz	3.125 MHz
letter of agreement	ASYNC, BIT; SYNC, BYTE; BISYNC; EXT SYNC	ASYNC, BIT; SYNC, BYTE; BISYNC; EXT SYNC	ASYNC, BIT; SYNC, BYTE; BISYNC; EXT SYNC	ASYNC, BIT; SYNC, BYTE; BISYNC; EXT SYNC	ASYNC, BIT; SYNC, BYTE; BISYNC; EXT SYNC	ASYNC, BIT; SYNC, BYTE; BISYNC; EXT SYNC
Data encoding/decoding methods	NRZ	NRZ	NRZ	NRZ	NRZ	NRZ
Maximum data transfer rate	0.0078125 MBps	0.0078125 MBps	0.0078125 MBps	0.0078125 MBps	0.0078125 MBps	0.0078125 MBps
External data bus width	8	8	8	8	8	8
JESD-30 code	R-GDIP-T28	R-GDIP-T28	R-PDIP-T28	R-PDIP-T28	R-GDIP-T28	R-GDIP-T28
JESD-609 code	e0	e0	e0	e0	e0	e0
length	37.1475 mm	37.1475 mm	37.1094 mm	37.1094 mm	37.1475 mm	37.1475 mm
low power mode	NO	NO	NO	NO	NO	NO
Number of serial I/Os	1	1	1	1	1	1
Number of terminals	28	28	28	28	28	28
Maximum operating temperature	70 °C	85 °C	70 °C	70 °C	70 °C	85 °C
Package body material	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED	PLASTIC/EPOXY	PLASTIC/EPOXY	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED
encapsulated code	DIP	DIP	DIP	DIP	DIP	DIP
Encapsulate equivalent code	DIP28,.6	DIP28,.6	DIP28,.6	DIP28,.6	DIP28,.6	DIP28,.6
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
power supply	5 V	5 V	5 V	5 V	5 V	5 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	5.715 mm	5.715 mm	5.461 mm	5.461 mm	5.715 mm	5.715 mm
Nominal supply voltage	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	NO	NO	NO	NO	NO	NO
technology	MOS	MOS	MOS	MOS	MOS	MOS
Temperature level	COMMERCIAL	INDUSTRIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
width	15.24 mm	15.24 mm	15.24 mm	15.24 mm	15.24 mm	15.24 mm
uPs/uCs/peripheral integrated circuit type	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL
Maximum slew rate	100 mA	-	100 mA	100 mA	100 mA	150 mA
Maximum supply voltage	5.5 V	-	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage	4.5 V	-	4.5 V	4.5 V	4.5 V	4.5 V

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