|
MH8V725AWZJ-6 |
MH8V725AWZJ-5 |
| Description |
EDO DRAM Module, 8MX72, 60ns, CMOS, DIMM-168 |
EDO DRAM Module, 8MX72, 50ns, CMOS, DIMM-168 |
| Maker |
Mitsubishi |
Mitsubishi |
| Parts packaging code |
DIMM |
DIMM |
| package instruction |
DIMM, DIMM168 |
DIMM, DIMM168 |
| Contacts |
168 |
168 |
| Reach Compliance Code |
unknown |
unknown |
| ECCN code |
EAR99 |
EAR99 |
| access mode |
FAST PAGE WITH EDO |
FAST PAGE WITH EDO |
| Maximum access time |
60 ns |
50 ns |
| Other features |
CAS BEFORE RAS/HIDDEN REFRESH |
CAS BEFORE RAS/HIDDEN REFRESH |
| I/O type |
COMMON |
COMMON |
| JESD-30 code |
R-XDMA-N168 |
R-XDMA-N168 |
| memory density |
603979776 bit |
603979776 bit |
| Memory IC Type |
EDO DRAM MODULE |
EDO DRAM MODULE |
| memory width |
72 |
72 |
| Number of functions |
1 |
1 |
| Number of ports |
1 |
1 |
| Number of terminals |
168 |
168 |
| word count |
8388608 words |
8388608 words |
| character code |
8000000 |
8000000 |
| Operating mode |
ASYNCHRONOUS |
ASYNCHRONOUS |
| Maximum operating temperature |
70 °C |
70 °C |
| organize |
8MX72 |
8MX72 |
| Output characteristics |
3-STATE |
3-STATE |
| Package body material |
UNSPECIFIED |
UNSPECIFIED |
| encapsulated code |
DIMM |
DIMM |
| Encapsulate equivalent code |
DIMM168 |
DIMM168 |
| Package shape |
RECTANGULAR |
RECTANGULAR |
| Package form |
MICROELECTRONIC ASSEMBLY |
MICROELECTRONIC ASSEMBLY |
| power supply |
3.3 V |
3.3 V |
| Certification status |
Not Qualified |
Not Qualified |
| refresh cycle |
8192 |
8192 |
| Maximum seat height |
25.4 mm |
25.4 mm |
| Maximum standby current |
0.0045 A |
0.0045 A |
| Maximum slew rate |
1.08 mA |
1.17 mA |
| Maximum supply voltage (Vsup) |
3.6 V |
3.6 V |
| Minimum supply voltage (Vsup) |
3 V |
3 V |
| Nominal supply voltage (Vsup) |
3.3 V |
3.3 V |
| surface mount |
NO |
NO |
| technology |
CMOS |
CMOS |
| Temperature level |
COMMERCIAL |
COMMERCIAL |
| Terminal form |
NO LEAD |
NO LEAD |
| Terminal pitch |
1.27 mm |
1.27 mm |
| Terminal location |
DUAL |
DUAL |
| Base Number Matches |
1 |
1 |