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DP8472N

Description
1.25Mbps, FLOPPY DISK DRIVE CONTROLLER, PDIP40, DIP-40
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size2MB,26 Pages
ManufacturerTexas Instruments
Websitehttp://www.ti.com.cn/
Stay tuned Parametric Compare

DP8472N Overview

1.25Mbps, FLOPPY DISK DRIVE CONTROLLER, PDIP40, DIP-40

DP8472N Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerTexas Instruments
package instructionDIP, DIP40,.6
Reach Compliance Codeunknown
Is SamacsysN
Maximum data transfer rate0.15625 MBps
External data bus width8
JESD-30 codeR-PDIP-T40
JESD-609 codee0
Number of terminals40
Maximum operating temperature70 °C
Minimum operating temperature
Package body materialPLASTIC/EPOXY
encapsulated codeDIP
Encapsulate equivalent codeDIP40,.6
Package shapeRECTANGULAR
Package formIN-LINE
Peak Reflow Temperature (Celsius)NOT SPECIFIED
Certification statusNot Qualified
Maximum slew rate40 mA
Maximum supply voltage5.5 V
Minimum supply voltage4.5 V
Nominal supply voltage5 V
surface mountNO
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
uPs/uCs/peripheral integrated circuit typeSECONDARY STORAGE CONTROLLER, FLOPPY DISK DRIVE
Base Number Matches1

DP8472N Related Products

DP8472N DP8472J DP8474V
Description 1.25Mbps, FLOPPY DISK DRIVE CONTROLLER, PDIP40, DIP-40 1.25Mbps, FLOPPY DISK DRIVE CONTROLLER, CDIP40, DIP-40 1.25Mbps, FLOPPY DISK DRIVE CONTROLLER, PQCC44, PLASTIC, LCC-44
Is it Rohs certified? incompatible incompatible incompatible
Maker Texas Instruments Texas Instruments Texas Instruments
package instruction DIP, DIP40,.6 DIP, DIP40,.6 QCCJ, LDCC44,.7SQ
Reach Compliance Code unknown unknown unknown
Is Samacsys N N N
Maximum data transfer rate 0.15625 MBps 0.15625 MBps 0.15625 MBps
External data bus width 8 8 8
JESD-30 code R-PDIP-T40 R-GDIP-T40 S-PQCC-J44
JESD-609 code e0 e0 e0
Number of terminals 40 40 44
Maximum operating temperature 70 °C 70 °C 70 °C
Package body material PLASTIC/EPOXY CERAMIC, GLASS-SEALED PLASTIC/EPOXY
encapsulated code DIP DIP QCCJ
Encapsulate equivalent code DIP40,.6 DIP40,.6 LDCC44,.7SQ
Package shape RECTANGULAR RECTANGULAR SQUARE
Package form IN-LINE IN-LINE CHIP CARRIER
Peak Reflow Temperature (Celsius) NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
Certification status Not Qualified Not Qualified Not Qualified
Maximum slew rate 40 mA 40 mA 40 mA
Maximum supply voltage 5.5 V 5.5 V 5.5 V
Minimum supply voltage 4.5 V 4.5 V 4.5 V
Nominal supply voltage 5 V 5 V 5 V
surface mount NO NO YES
technology CMOS CMOS CMOS
Temperature level COMMERCIAL COMMERCIAL COMMERCIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form THROUGH-HOLE THROUGH-HOLE J BEND
Terminal pitch 2.54 mm 2.54 mm 1.27 mm
Terminal location DUAL DUAL QUAD
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
uPs/uCs/peripheral integrated circuit type SECONDARY STORAGE CONTROLLER, FLOPPY DISK DRIVE SECONDARY STORAGE CONTROLLER, FLOPPY DISK DRIVE SECONDARY STORAGE CONTROLLER, FLOPPY DISK DRIVE
Base Number Matches 1 1 1
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