IC,FLIP-FLOP,QUAD,D TYPE,HC-CMOS,DIP,16PIN,PLASTIC
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | Texas Instruments |
| Reach Compliance Code | not_compliant |
| Is Samacsys | N |
| JESD-30 code | R-PDIP-T16 |
| Logic integrated circuit type | D FLIP-FLOP |
| Number of functions | 4 |
| Number of terminals | 16 |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | -40 °C |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP16,.3 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Certification status | Not Qualified |
| surface mount | NO |
| technology | CMOS |
| Temperature level | INDUSTRIAL |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| Trigger type | POSITIVE EDGE |
| Base Number Matches | 1 |
| SN74HC379N1 | SN74HC378NP1 | SN74HC378N1 | SN74HC379NP1 | SN74HC378FN | SN54HC378FH | SN54HC379FH | |
|---|---|---|---|---|---|---|---|
| Description | IC,FLIP-FLOP,QUAD,D TYPE,HC-CMOS,DIP,16PIN,PLASTIC | IC,FLIP-FLOP,HEX,D TYPE,HC-CMOS,DIP,16PIN,PLASTIC | IC,FLIP-FLOP,HEX,D TYPE,HC-CMOS,DIP,16PIN,PLASTIC | IC,FLIP-FLOP,QUAD,D TYPE,HC-CMOS,DIP,16PIN,PLASTIC | IC,FLIP-FLOP,HEX,D TYPE,HC-CMOS,LDCC,20PIN,PLASTIC | IC,FLIP-FLOP,HEX,D TYPE,HC-CMOS,LLCC,20PIN,CERAMIC | IC,FLIP-FLOP,QUAD,D TYPE,HC-CMOS,LLCC,20PIN,CERAMIC |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
| Maker | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
| Reach Compliance Code | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant |
| JESD-30 code | R-PDIP-T16 | R-PDIP-T16 | R-PDIP-T16 | R-PDIP-T16 | S-PQCC-J20 | S-XQCC-N20 | S-XQCC-N20 |
| Logic integrated circuit type | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP |
| Number of functions | 4 | 6 | 6 | 4 | 6 | 6 | 4 |
| Number of terminals | 16 | 16 | 16 | 16 | 20 | 20 | 20 |
| Maximum operating temperature | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 125 °C | 125 °C |
| Minimum operating temperature | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -55 °C | -55 °C |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC | CERAMIC |
| encapsulated code | DIP | DIP | DIP | DIP | QCCJ | QCCN | QCCN |
| Encapsulate equivalent code | DIP16,.3 | DIP16,.3 | DIP16,.3 | DIP16,.3 | LDCC20,.4SQ | LCC20,.35SQ | LCC20,.35SQ |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE | SQUARE | SQUARE |
| Package form | IN-LINE | IN-LINE | IN-LINE | IN-LINE | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| surface mount | NO | NO | NO | NO | YES | YES | YES |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | MILITARY | MILITARY |
| Terminal form | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | J BEND | NO LEAD | NO LEAD |
| Terminal pitch | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm | 1.27 mm |
| Terminal location | DUAL | DUAL | DUAL | DUAL | QUAD | QUAD | QUAD |
| Trigger type | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE |
| Is Samacsys | N | N | N | N | - | - | - |
| Base Number Matches | 1 | 1 | 1 | 1 | - | - | - |